Patents by Inventor Dai Nakagawa

Dai Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12001040
    Abstract: The invention provides a multilayer laminated film with alternately laminated birefringent and isotropic layers. The birefringent layers have a first monotonically increasing region of optical thickness and contain monotonically increasing region 1A of maximum optical thickness of 100 nm or less, and monotonically increasing region 1B of minimum optical thickness of more than 100 nm, and ratio 1B/1A of slope 1B of monotonically increasing region 1B to slope 1A of monotonically increasing region 1A is more than 0 and less than 0.8. The isotropic layers have a second monotonically increasing region of optical thickness and contain monotonically increasing region 2A of maximum optical thickness of 200 nm or less and monotonically increasing region 2B of minimum optical thickness of more than 200 nm, and ratio 2B/2A of slope 2B of monotonically increasing region 2B to slope 2A of monotonically increasing region 2A is more than 1.5 and 10 or less.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: June 4, 2024
    Assignee: TOYOBO CO., LTD
    Inventors: Dai Nakagawa, Nobuyuki Nakanishi, Mitsuo Tojo
  • Patent number: 12001041
    Abstract: The invention provides a multilayer laminated film with alternately laminated birefringent and isotropic layers. The birefringent layers have a first monotonically increasing region of optical thickness and contain monotonically increasing region 1A of maximum optical thickness is 100 nm or less, and monotonically increasing region 1B of minimum optical thickness of more than 100 nm, and ratio 1B/1A of slope 1B of monotonically increasing region 1B to slope 1A of monotonically increasing region 1A is 0.8 or more and less than 1.5. The isotropic layers have a second monotonically increasing region of optical thickness and contain monotonically increasing region 2A of maximum optical thickness of 200 nm or less and monotonically increasing region 2B of minimum optical thickness of more than 200 nm, and ratio 2B/2A of slope 2B of monotonically increasing region 2B to slope 2A of monotonically increasing region 2A is more than 1.5 and less than 5.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: June 4, 2024
    Assignee: TOYOBO CO., LTD.
    Inventors: Dai Nakagawa, Nobuyuki Nakanishi, Shigeyuki Watanabe
  • Publication number: 20240072838
    Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface opposite to each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is in contact with the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is not in contact with the second ground electrode.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 29, 2024
    Inventors: Hiromichi KITAJIMA, Dai NAKAGAWA, Takanori UEJIMA
  • Publication number: 20240057247
    Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface facing each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is connected to the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is connected to the second ground electrode.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventors: Takanori UEJIMA, Hiromichi KITAJIMA, Dai NAKAGAWA
  • Publication number: 20240047377
    Abstract: A high-frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal electrode layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal electrode layer covers at least a part of the resin layer, and overlaps with at least a part of the first electronic component and at least a part of the second electronic component in a plan view. At least a part of a main surface of the first electronic component opposite to the mounting substrate side is in contact with the metal electrode layer. The metal electrode layer has a through-portion between a first signal terminal of the first electronic component and a second signal terminal of the second electronic component in the plan view.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 8, 2024
    Inventors: Takanori UEJIMA, Hiromichi KITAJIMA, Dai NAKAGAWA
  • Publication number: 20230328877
    Abstract: The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.
    Type: Application
    Filed: January 18, 2023
    Publication date: October 12, 2023
    Inventors: Yukiya YAMAGUCHI, Takanori UEJIMA, Yuji TAKEMATSU, Dai NAKAGAWA, Kyohei MORITA
  • Publication number: 20230319984
    Abstract: Detection accuracy is improved with a reduced size. A radio-frequency module includes an antenna terminal, a signal input terminal, a signal output terminal, a mounting substrate, a chip inductor, and a directional coupler. The mounting substrate has a first major surface and a second major surface opposite to each other. The chip inductor is mounted on the first major surface of the mounting substrate. The chip inductor is provided in at least one of a transmitting path between the antenna terminal and the signal input terminal and a receiving path between the antenna terminal and the signal output terminal. The directional coupler is mounted on the second major surface of the mounting substrate, and at least part of the directional coupler is provided in the transmitting path.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 5, 2023
    Inventors: Tetsuro HARADA, Dai NAKAGAWA, Yuji TAKEMATSU, Hiroaki TAKAOKA, Takahisa TOYOMURA
  • Publication number: 20230268950
    Abstract: A radio frequency module includes a module substrate having a principal surface, one or more circuit components disposed on a principal surface side, a resin member disposed on the principal surface side and covering a side surface of the one or more circuit components, a metal shield layer in contact with a top surface of the resin member and a top surface of the one or more circuit components, and an engraved portion provided on the top surface of the one or more circuit components.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Inventors: Yuji TAKEMATSU, Takanori UEJIMA, Dai NAKAGAWA
  • Publication number: 20230269864
    Abstract: A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.
    Type: Application
    Filed: May 2, 2023
    Publication date: August 24, 2023
    Inventors: Yuji TAKEMATSU, Takanori UEJIMA, Dai NAKAGAWA
  • Publication number: 20230261678
    Abstract: A radio frequency module is reduced in height. A radio frequency module includes a mounting substrate, a filter, and a conductive member. The mounting substrate has a first main surface and a second main surface opposite to each other. The filter is mounted on the first main surface of the mounting substrate. The conductive member covers at least part of a main surface of the filter on a side opposite to the mounting substrate. The first main surface of the mounting substrate has a recess. The main surface of the filter is in contact with the conductive member. At least part of the filter is positioned inside the recess.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 17, 2023
    Inventors: Takanori UEJIMA, Yuji TAKEMATSU, Dai NAKAGAWA, Yukiya YAMAGUCHI
  • Publication number: 20230223970
    Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 13, 2023
    Inventors: Takanori UEJIMA, Dai NAKAGAWA, Yukiya YAMAGUCHI, Yuji TAKEMATSU, Motoji TSUDA, Mayuka ONO, Hiroki FUJIWARA, Kiyoshi AIKAWA, Takashi YAMADA
  • Publication number: 20230170862
    Abstract: Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a plurality of transmission filters, a resin layer, and a shield layer. The mounting substrate has a first major surface and a second major surface opposite to each other. The plurality of transmission filters is mounted on the first major surface of the mounting substrate. The resin layer is disposed on the first major surface of the mounting substrate and covers at least part of an outer peripheral surface of each of the plurality of transmission filters. The shield layer covers the resin layer and at least part of each of the plurality of transmission filters. At least part of a major surface of each of the plurality of transmission filters on an opposite side to the mounting substrate side is in contact with the shield layer.
    Type: Application
    Filed: January 25, 2023
    Publication date: June 1, 2023
    Inventors: Dai NAKAGAWA, Takanori UEJIMA, Yuji TAKEMATSU, Isao TAKENAKA
  • Publication number: 20230118132
    Abstract: A radio-frequency module includes a mount board, an acoustic wave filter, a metal block, a resin layer, and a shield layer. The mount board has a first principal surface and a second principal surface opposite to each other, and has a ground layer. The acoustic wave filter is mounted on the first principal surface of the mount board. The metal block is disposed on the first principal surface of the mount board, and is connected to the ground layer. The resin layer is disposed on the first principal surface of the mount board, and covers the periphery of the acoustic wave filter and the periphery of the metal block. The shield layer covers the principal surface, which is on the opposite side to the mount board side, of the acoustic wave filter, the resin layer, and the metal block. The metal block is in contact with the shield layer.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Inventors: Naoya MATSUMOTO, Takanori UEJIMA, Yuji TAKEMATSU, Dai NAKAGAWA
  • Publication number: 20230121885
    Abstract: A high frequency module includes a mounting substrate, an acoustic wave filter, a protection member, a resin layer, and a shield layer. The acoustic wave filter is mounted on a first main surface of the mounting substrate. The protection member is disposed on a main surface of the acoustic wave filter that is far from the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter and an outer peripheral surface of the protection member. The shield layer covers the resin layer and the protection member. The protection member is in contact with both the acoustic wave filter and the shield layer. The acoustic wave filter includes a piezoelectric substrate. A main surface of the piezoelectric substrate that is far from the mounting substrate is in contact with the protection member.
    Type: Application
    Filed: December 16, 2022
    Publication date: April 20, 2023
    Inventors: Naoya MATSUMOTO, Takanori UEJIMA, Yuji TAKEMATSU, Dai NAKAGAWA
  • Publication number: 20230066774
    Abstract: Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The acoustic wave filter is arranged near the first main surface of the mounting substrate. The resin layer is arranged on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter. The shield layer covers the resin layer and the acoustic wave filter. The shield layer is in contact with a second main surface of the acoustic wave filter that is far from the mounting substrate.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 2, 2023
    Inventors: Dai NAKAGAWA, Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Ryohei OKABE, Hiromichi KITAJIMA
  • Publication number: 20230006708
    Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.
    Type: Application
    Filed: September 9, 2022
    Publication date: January 5, 2023
    Inventors: Dai NAKAGAWA, Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Ryohei OKABE, Hiromichi KITAJIMA
  • Patent number: 11476226
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Uejima, Yuji Takematsu, Naoya Matsumoto, Shou Matsumoto, Tetsuro Harada, Dai Nakagawa, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 11448809
    Abstract: A multi-layer, layered film includes a multi-layer, alternately layered body containing birefringent first layers including a first resin and isotropic second layers including a second resin, in which the multi-layer, layered film has a layer thickness profile with which light at a wavelength of from 380 to 780 nm can be reflected due to optical interference between each of the first layers and each of the second layers, in which a layer thickness profile for an optical thickness of the first layers has a first monotonically increasing region which meets specific requirements, and in which a layer thickness profile for an optical thickness of the second layers has a second monotonically increasing region which meets specific requirements.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 20, 2022
    Assignee: TOYOBO CO., LTD.
    Inventors: Amane Hirose, Nobuyuki Nakanishi, Mitsuo Tojo, Dai Nakagawa
  • Patent number: 11309925
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: April 19, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Sho Matsumoto, Takanori Uejima, Yuji Takematsu, Tetsuro Harada, Dai Nakagawa, Naoya Matsumoto, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 11239876
    Abstract: A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: February 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Dai Nakagawa