Patents by Inventor Dai Nakagawa

Dai Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210226652
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Sho MATSUMOTO, Takanori UEJIMA, Yuji TAKEMATSU, Tetsuro HARADA, Dai NAKAGAWA, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20210219419
    Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.
    Type: Application
    Filed: March 30, 2021
    Publication date: July 15, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yuji TAKEMATSU, Takanori UEJIMA, Sho MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Patent number: 10974489
    Abstract: A laminated film has a multilayer structure with outermost layers 1 and 2 composed mainly of a resin, wherein the multilayer structure has first and second layers alternately laminated in the thickness direction so that the total number of the first and second layers is 30 or more, the first layer is a birefringent layer composed mainly of a resin and is 10-1,000 nm thick, the second layer is an isotropic layer composed mainly of a resin and is 10-1,000 nm thick, the thicknesses of the first and second layers increase along the thickness direction from the outermost layer 2 side to the outermost layer 1 side, the total thickness of the outermost layers is 10% or more of the total thickness of the multilayer structure, and the thickness of the outermost layer 1 is larger than the thickness of the outermost layer 2.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: April 13, 2021
    Assignee: TEIJIN FILM SOLUTIONS LIMITED
    Inventors: Dai Nakagawa, Nobuyuki Nakanishi, Tomoka Yoshimura, Mitsuo Tojo
  • Patent number: 10971466
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 10964657
    Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 30, 2021
    Assignee: MURATA MANUFACTURING CO.. LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuki Fukuda
  • Patent number: 10950569
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 16, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuki Fukuda
  • Publication number: 20210003757
    Abstract: The invention provides a multilayer laminated film in which a birefringent layer comprising a first resin and an isotropic layer comprising a second resin are alternately laminated. The multilayer laminated film reflects light at a wavelength of 380-780 nm. A series of the birefringent layers has an optical thickness monotonically increasing region in which the 0.8×mth layer has an optical thickness of 140-180 nm, wherein the first and mth layers are the thinnest and thickest layers with optical thicknesses of 100 nm or more and 190 nm or less, respectively. A series of the isotropic layers has an optical thickness monotonically increasing region in which the 0.8×nth layer has an optical thickness of 150-280 nm, wherein the first and nth layers are the thinnest and thickest layers with optical thicknesses of 120 nm or more and 350 nm or less, respectively.
    Type: Application
    Filed: February 21, 2019
    Publication date: January 7, 2021
    Applicant: TOYOBO FILM SOLUTIONS LIMITED
    Inventors: Dai NAKAGAWA, Nobuyuki NAKANISHI, Mitsuo TOJO
  • Patent number: 10847306
    Abstract: A front-end circuit (1), which is a high-frequency module, includes an input-output terminal (4); a duplexer (14) electrically connected to the input-output terminal (4); an LNA (171) electrically connected to the duplexer (14); a PA (161) electrically connected to the duplexer (14); a matching network (23) provided between the input-output terminal (4) and the duplexer (14) and including an inductor (231); and a matching network provided between the duplexer (14) and the PA (161) and including an inductor (162). The matching network including the inductor (162) is an output matching network configured to perform impedance matching between an output terminal of the PA (161) and the duplexer (14), and the inductor (231) includes a plurality of inductors (231a and 231b) connected in series.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: November 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Dai Nakagawa
  • Publication number: 20200211998
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Shou MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20200058436
    Abstract: A front-end circuit (1), which is a high-frequency module, includes an input-output terminal (4); a duplexer (14) electrically connected to the input-output terminal (4); an LNA (171) electrically connected to the duplexer (14); a PA (161) electrically connected to the duplexer (14); a matching network (23) provided between the input-output terminal (4) and the duplexer (14) and including an inductor (231); and a matching network provided between the duplexer (14) and the PA (161) and including an inductor (162). The matching network including the inductor (162) is an output matching network configured to perform impedance matching between an output terminal of the PA (161) and the duplexer (14), and the inductor (231) includes a plurality of inductors (231a and 231b) connected in series.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 20, 2020
    Inventor: Dai NAKAGAWA
  • Publication number: 20200051943
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20200051941
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
    Type: Application
    Filed: July 15, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuki FUKUDA
  • Publication number: 20200051942
    Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
    Type: Application
    Filed: July 16, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuki FUKUDA
  • Publication number: 20200044683
    Abstract: A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Inventor: Dai Nakagawa
  • Publication number: 20200025991
    Abstract: A multi-layer, layered film includes a multi-layer, alternately layered body containing birefringent first layers including a first resin and isotropic second layers including a second resin, in which the multi-layer, layered film has a layer thickness profile with which light at a wavelength of from 380 to 780 nm can be reflected due to optical interference between each of the first layers and each of the second layers, in which a layer thickness profile for an optical thickness of the first layers has a first monotonically increasing region which meets specific requirements, and in which a layer thickness profile for an optical thickness of the second layers has a second monotonically increasing region which meets specific requirements.
    Type: Application
    Filed: March 29, 2018
    Publication date: January 23, 2020
    Applicant: TEIJIN FILM SOLUTIONS LIMITED
    Inventors: Amane HIROSE, Nobuyuki NAKANISHI, Mitsuo TOJO, Dai NAKAGAWA
  • Publication number: 20190322087
    Abstract: A laminated film has a multilayer structure with outermost layers 1 and 2 composed mainly of a resin, wherein the multilayer structure has first and second layers alternately laminated in the thickness direction so that the total number of the first and second layers is 30 or more, the first layer is a birefringent layer composed mainly of a resin and is 10-1,000 nm thick, the second layer is an isotropic layer composed mainly of a resin and is 10-1,000 nm thick, the thicknesses of the first and second layers increase along the thickness direction from the outermost layer 2 side to the outermost layer 1 side, the total thickness of the outermost layers is 10% or more of the total thickness of the multilayer structure, and the thickness of the outermost layer 1 is larger than the thickness of the outermost layer 2.
    Type: Application
    Filed: November 28, 2017
    Publication date: October 24, 2019
    Applicant: TEIJIN FILM SOLUTIONS LIMITED
    Inventors: Dai NAKAGAWA, Nobuyuki NAKANISHI, Tomoka YOSHIMURA, Mitsuo TOJO
  • Patent number: 10438746
    Abstract: Provided is a highly insulating film having excellent electrical characteristics (breakdown voltage), heat resistance, and handling properties such as windability and processability. The highly insulating film is a biaxially stretched film made of a styrene polymer having a syndiotactic structure as a main component. The highly insulating film contains specific inert fine particles A, antioxidant, and polymer Y having a glass transition temperature Tg by DSC of 130° C. or more each in a specific amount, and has a refractive index in the thickness direction of 1.5750 or more and 1.6350 or less.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: October 8, 2019
    Assignee: TEIJIN LIMITED
    Inventors: Shigeyoshi Masuda, Dai Nakagawa, Kinji Hasegawa, Masanori Nishiyama
  • Patent number: 9617407
    Abstract: This invention is a highly insulating film, which is characterized by including a biaxially stretched film containing a styrene polymer having a syndiotactic structure as a main component, containing a thermoplastic amorphous resin Y having a glass transition temperature Tg by DSC of 130° C. or higher in an amount of 5% by mass or more and 48% by mass or less, and having a plane orientation coefficient (AP) represented by the following equation (1) of ?0.027 or less: ?P=(Nx+Ny)/2?Nz (1). In equation (1), Nx represents the minimum value of the refractive index in the plane direction of the film, Ny represents the refractive index in the direction perpendicular to Nx in the plane direction of the film, and Nz represents the refractive index in the thickness direction of the film.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: April 11, 2017
    Assignee: TEIJIN LIMITED
    Inventors: Takashi Nakahiro, Dai Nakagawa, Tetsuo Yoshida, Masanori Nishiyama
  • Publication number: 20150202722
    Abstract: Provided are a low-cost and highly-precise structure-molding die that only requires a short production time, and a method of producing the die. The die is characterized by including: a plate-like first member 10 that serves as a base; a second member 2 that has cells 2 of a shape matching a to-be-molded structure and is joined to the first member 10; molding grooves 7 that have a predetermined depth and are disposed between the cells 2; and a supply hole 6 that communicates with the first member 10 at a predetermined intersection of the molding grooves 7 from an opposite side from the cells 2 joined.
    Type: Application
    Filed: January 21, 2015
    Publication date: July 23, 2015
    Applicant: HODEN SEIMITSU KAKO KENKYUSHO CO., LTD.
    Inventor: Dai NAKAGAWA
  • Patent number: 8859087
    Abstract: The present invention is to provide an insulating film having a high breakdown voltage and excellent heat resistance and handling properties. The present invention is a biaxially oriented insulating film which contains (i) a styrene-based polymer having a syndiotactic structure and (ii) particles and which has a refractive index in the thickness direction of 1.6050 to 1.6550.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: October 14, 2014
    Assignee: Teijin Limited
    Inventors: Shigeyoshi Masuda, Dai Nakagawa, Kinji Hasegawa