Abstract: The present invention is to provide an insulating film having a high breakdown voltage and excellent heat resistance and handling properties. The present invention is a biaxially oriented insulating film which contains (i) a styrene-based polymer having a syndiotactic structure and (ii) particles and which has a refractive index in the thickness direction of 1.6050 to 1.6550.

Abstract: Provided are a low-cost and highly-precise structure-molding die that only requires a short production time, and a method of producing the die. The die is characterized by including: a plate-like first member 10 that serves as a base; a second member 2 that has cells 2 of a shape matching a to-be-molded structure and is joined to the first member 10; molding grooves 7 that have a predetermined depth and are disposed between the cells 2; and a supply hole 6 that communicates with the first member 10 at a predetermined intersection of the molding grooves 7 from an opposite side from the cells 2 joined.

Abstract: An object of this invention is to provide a highly insulating film, which is excellent in the heat resistance and has increased breakdown voltage. This invention is a highly insulating film, which is characterized by comprising a biaxially stretched film containing a styrene polymer having a syndiotactic structure as a main component, containing a thermoplastic amorphous resin Y having a glass transition temperature Tg by DSC of 130° C. or higher in an amount of 5% by mass or more and 48% by mass or less, and having a plane orientation coefficient (?P) represented by the following equation (1) of ?0.027 or less. ?P=(Nx+Ny)/2?Nz (1) (Here, in the equation (1), Nx represents the minimum value of the refractive index in the plane direction of the film, Ny represents the refractive index in the direction perpendicular to Nx in the plane direction of the film, and Nz represents the refractive index in the thickness direction of the film.

Abstract: Provided is a highly insulating film having excellent electrical characteristics (breakdown voltage), heat resistance, and handling properties such as windability and processability. The highly insulating film is a biaxially stretched film made of a styrene polymer having a syndiotactic structure as a main component. The highly insulating film contains specific inert fine particles A, antioxidant, and polymer Y having a glass transition temperature Tg by DSC of 130° C. or more each in a specific amount, and has a refractive index in the thickness direction of 1.5750 or more and 1.6350 or less.

Abstract: In a transmission/reception selection switch, a first diode is arranged in series with a transmission signal line and a second diode is arranged in shunt with a reception signal line. A first current route where a direct current passes through the first diode is connected in parallel to a second current route where a direct current passes through the second diode. When a predetermined positive voltage is applied to a control terminal, the diodes are turned ON and a direct current flows through, in order, the control terminal, a resistor, an inductor, the diode, a strip line, and an inductor), and a direct current flows through, in order, the control terminal, the resistor, the second diode, and the inductor.

Abstract: An object of the present invention is to provide an insulating film having a high breakdown voltage and excellent heat resistance and handling properties. The present invention is a biaxially oriented insulating film which contains (i) a styrene-based polymer having a syndiotactic structure and (ii) particles and which has a refractive index in the thickness direction of 1.6050 to 1.6550.

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

Abstract: In a transmission/reception selection switch, a first diode is arranged in series with a transmission signal line and a second diode is arranged in shunt with a reception signal line. A first current route where a direct current passes through the first diode is connected in parallel to a second current route where a direct current passes through the second diode. When a predetermined positive voltage is applied to a control terminal, the diodes are turned ON and a direct current flows through, in order, the control terminal, a resistor, an inductor, the diode, a strip line, and an inductor), and a direct current flows through, in order, the control terminal, the resistor, the second diode, and the inductor.

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.