Abstract: A optical connection structure that includes a plurality of optical connectors and a housing is disclosed. In the optical connection structure, each optical connector includes a first and a second end surfaces. Each connector hole of the housing includes first and second inner wall surfaces facing each other. The first end surface includes a first guide rail. The second end surface includes a second guide rail or a latch. The first inner wall surface includes first guide rail fitting sections provided corresponding to the respective optical connectors, the first guide rail fitting sections being slidably fitted to the first guide rails. The second inner wall surface includes second guide rail fitting sections provided corresponding to the respective optical connectors and being slidably fitted to the second guide rails, or latch engagement sections provided corresponding to the respective optical connectors, the latches being engaged with the latch engagement sections.

Abstract: A fusion splicer for fusion-splicing a first group of optical fibers and a second group of optical fibers by arc discharge is disclosed. The fusion splicer includes first and second electrode rods, first and second fiber holding parts, and a first shield. The electrode rods generate the arc discharge therebetween. The first fiber holding part has a first plurality of V-grooves positioning the first group of optical fibers. The second fiber holding part has a second plurality of V-grooves positioning the second group of optical fibers. The first shield is located between the first and second plurality of V-grooves and the first electrode rod in a direction along a center line connecting a tip of the first electrode rod to a tip of the second electrode rod. The first shield is formed of an insulating material having heat resisting properties withstanding 1000 or more degrees Celsius.

Abstract: Some embodiments include an apparatus having a first chip and a second chip. Each of the first and second chips comprises a multilevel wiring structure and a redistribution wiring layer over the multilevel wiring structure. The redistribution wiring layers include redistribution wiring and pads electrically coupled to the redistribution wiring. The first chip is mounted above the second chip so that the redistribution wiring layer of the first chip faces the redistribution wiring layer of the second chip. The pad of the first chip faces the pad of the second chip, and is vertically spaced from the pad of the second chip by an intervening insulative region. The redistribution wiring of the second chip is electrically coupled to the redistribution wiring of the first chip through a bonding region.

Abstract: Some embodiments include an apparatus having a first chip and a second chip. Each of the first and second chips comprises a multilevel wiring structure and a redistribution wiring layer over the multilevel wiring structure. The redistribution wiring layers include redistribution wiring and pads electrically coupled to the redistribution wiring. The first chip is mounted above the second chip so that the redistribution wiring layer of the first chip faces the redistribution wiring layer of the second chip. The pad of the first chip faces the pad of the second chip, and is vertically spaced from the pad of the second chip by an intervening insulative region. The redistribution wiring of the second chip is electrically coupled to the redistribution wiring of the first chip through a bonding region.

Abstract: A receptacle connector comprises a receptacle ferrule, and a receptacle housing including a cavity housing the receptacle ferrule and a cavity housing a plug connector. The receptacle ferrule includes an optical coupling surface (front surface). An opening area of the cavity on a cross section vertical to an inserting direction of the plug connector to the receptacle housing is smaller than an opening area of the cavity on the cross section vertical to the inserting direction. In a second state after being optically coupled, the optical coupling surface (front surface) is positioned inside the cavity.

Abstract: Some embodiments include an apparatus having a first chip and a second chip. Each of the first and second chips comprises a multilevel wiring structure and a redistribution wiring layer over the multilevel wiring structure. The redistribution wiring layers include redistribution wiring and pads electrically coupled to the redistribution wiring. The first chip is mounted above the second chip so that the redistribution wiring layer of the first chip faces the redistribution wiring layer of the second chip. The pad of the first chip faces the pad of the second chip, and is vertically spaced from the pad of the second chip by an intervening insulative region. The redistribution wiring of the second chip is electrically coupled to the redistribution wiring of the first chip through a bonding region.

Abstract: Disclosed is an optical connector, the optical connector being one of a pair of optical connectors connected to face each other along a first direction. This optical connector comprises a ferrule that holds an optical fiber, the ferrule exposing an end surface of the optical fiber from a ferrule end surface closer to the other optical connector in the first direction, and a ferrule cap that covers the ferrule. The ferrule cap has a light transmission portion through which a light path extending from the end surface of the optical fiber is made to pass. An end of the ferrule cap except for the light transmission portion is positioned closer to the other optical connector with respect to the end surface of the optical fiber and the light transmission portion in the first direction.

Abstract: An optical connector having a shutter is disclosed. The optical connector comprises an optical connection component configured to hold one or a plurality of optical fibers, and having a light incidence/emission end surface being movable in the connection direction with respect to the optical connection component; a second member having a shutter part that performs opening/closing of an opening, the second member being attached to the first member in a state of being rotatable around a rotation axis; a first sealing member contacting the first member over a whole circumference of the opening, the first sealing member also contacting the shutter part over the whole circumference of the opening when the shutter part is in a closed state; and a linkage mechanism that rotates the second member in conjunction with movement of the first member along the connection direction with respect to the optical connection component.

Abstract: A connector structure of an OCT catheter includes an outer casing that has an inner space extending in an axial direction and that has an opening at one end in the axial direction, a connector that is disposed in the inner space so as to be rotatable around the axis in a state in which a connection end is oriented toward the opening, and a stopper that is disposed in the inner space and that restricts rotation of the connector relative to the outer casing. When a part of the outer casing including the one end is pushed into a connection port of a rotational driving device that performs rotational driving, the connector is connectable to an adapter of the rotational driving device; and, when the outer casing is pushed into the connection port, restriction on rotation of the connector by the stopper is removed.

Abstract: Some embodiments include an apparatus having a first chip and a second chip. Each of the first and second chips comprises a multilevel wiring structure and a redistribution wiring layer over the multilevel wiring structure. The redistribution wiring layers include redistribution wiring and pads electrically coupled to the redistribution wiring. The first chip is mounted above the second chip so that the redistribution wiring layer of the first chip faces the redistribution wiring layer of the second chip. The pad of the first chip faces the pad of the second chip, and is vertically spaced from the pad of the second chip by an intervening insulative region. The redistribution wiring of the second chip is electrically coupled to the redistribution wiring of the first chip through a bonding region.

Abstract: Some embodiments include an apparatus having a first chip and a second chip. Each of the first and second chips comprises a multilevel wiring structure and a redistribution wiring layer over the multilevel wiring structure. The redistribution wiring layers include redistribution wiring and pads electrically coupled to the redistribution wiring. The first chip is mounted above the second chip so that the redistribution wiring layer of the first chip faces the redistribution wiring layer of the second chip. The pad of the first chip faces the pad of the second chip, and is vertically spaced from the pad of the second chip by an intervening insulative region. The redistribution wiring of the second chip is electrically coupled to the redistribution wiring of the first chip through a bonding region.

Abstract: An OCT catheter includes an interior member including a torque wire and an optical fiber, the torque wire transmitting rotation from a proximal end toward a distal end, the optical fiber being provided in a hollow portion of the torque wire and transmitting light. The OCT catheter further includes an outer housing 30 covering the interior member. The outer housing includes inside a pair of stepped portions that face each other in a lengthwise direction of the torque wire. The torque wire includes a torque-wire body and a flange provided on the torque-wire body. The flange is provided between the pair of stepped portions. A coil spring is provided between one of the pair of stepped portions and the flange. The flange is pressed toward the other of the pair of stepped portions by the coil spring.

Abstract: An optical probe includes an optical fiber, an optical connector connected to the optical fiber at the proximal end thereof and configured to connect to a measurement unit of the OCT device, a Grin lens corresponding to a light collection optical system and a light deflection optical system that are optically connected to the optical fiber at the distal end, a needle that rotatably accommodates the optical fiber and the Grin lens and configured to exit observation light, a handpiece that rotatably accommodates a part of the optical fiber between the proximal end and the distal end and that holds the needle, and a support tube that is secured to the optical connector on a proximal end side and that is rotatably accommodated in the handpiece on a distal end side. An outer diameter of the needle is less than an outer diameter of the support tube.

Abstract: An optical probe that is easy to manufacture and that can capture a tomographic image with high resolution has a proximal end to be connected to an OCT device and a distal end from which observation light exits, and includes an optical fiber, a light collection optical system and a light deflection optical system that are optically connected to the optical fiber at the distal end, a sheath that accommodates the optical fiber, the light collection optical system, and the light deflection optical system, and that causes the observation light deflected to exit through the curved surface portion laterally, and a compensation portion that is accommodated in the sheath, that extends in a first direction over a range including a part of the optical fiber and the Grin lens, and that compensates an optical aberration that occurs when the observation light passes through the curved surface portion.

Abstract: A receptacle connector comprises a receptacle ferrule, and a receptacle housing including a cavity housing the receptacle ferrule and a cavity housing a plug connector. The receptacle ferrule includes an optical coupling surface (front surface). An opening area of the cavity on a cross section vertical to an inserting direction of the plug connector to the receptacle housing is smaller than an opening area of the cavity on the cross section vertical to the inserting direction. In a second state after being optically coupled, the optical coupling surface (front surface) is positioned inside the cavity.

Abstract: A receptacle connector includes a receptacle ferrule, a receptacle housing and a spacer. The receptacle ferrule has a first front end portion having a receptacle interface part In the receptacle housing, the receptacle ferrule and a plug connector having a second front end portion having a plug interface part configured to be optically coupled with the receptacle interface part are to be accommodated. The spacer has a first surface configured to contact the first front end portion, and a second surface configured to contact the second front end portion. The spacer is arranged in the receptacle housing. At a state where the first front end portion is contacted to the first surface of the spacer and the second front end portion is contacted to the second surface of the spacer, the receptacle interface part and the plug interface part face each other at a predetermined interval.

Abstract: An adapter includes an optical connector accommodation part having a first cavity in which a first optical connector having a first front end portion is to be accommodated, and a second cavity in which a second optical connector having a second front end portion is to be accommodated, and a spacer having a first surface configured to contact the first front end portion, a second surface configured to contact the second front end portion, and a light transmission part configured to enable a light beam to pass therethrough. The spacer being arranged between the first cavity and the second cavity. At a state where the first front end portion is contacted to the first surface and the second front end portion is contacted to the second surface, the first optical interface part and the second optical interface part face each other at a predetermined interval.

Abstract: A GRIN lens array of an embodiment has a structure for enabling a coupling face in which lens end faces of GRIN lenses are arranged, to be accurately polished so as to have a desired angle relative to optical axes of the GRIN lenses. The GRIN lens array has the GRIN lenses and a main body portion. The main body portion comprises a holding portion having a coupling face, and an edge portion having a reference face to be used as a reference in polishing of the coupling face. The respective thicknesses of the holding portion and the edge portion along the longitudinal direction of the GRIN lenses are set so as to form a step between the coupling face and the reference face.

Abstract: A semiconductor device includes a package substrate, an IF chip, and a core chip. The package substrate has: first electrodes aligned and disposed on a first rear surface; second electrodes aligned and disposed in the first direction (Y direction) on a first front surface; and wiring that electrically connects the first electrodes and the second electrodes. The IF chip has third electrodes bonded to the second electrodes. The core chip is connected to the IF chip. In the first direction, the length of the IF chip is more than that of the core chip but equal to or less than that of the package substrate. One of the first electrodes is disposed further toward the outside than a core chip end portion in the first direction. At least one of the second electrodes is disposed further toward the outside than the core chip end portion in the first direction.