Abstract: A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

Abstract: A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding use resin partially inside the recess portion. Thereby, increases of a placement area for a fillet portion (foot spreading portion) of the sealing-bonding use resin are suppressed while its inclination angle is increased. Thus, stress loads that occur to peripheral portions of the semiconductor device due to thermal expansion differences and thermal contraction differences among individual members caused by heating process and cooling process in mounting operation are relaxed, by which internal breakdown of the semiconductor device mounted structure is avoided.

Abstract: In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 ?m.

Abstract: Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing (10); shield electrode (11) provided in recess (10a); and ground electrode (13) provided on a part of the top and bottom surfaces of housing (10).

Abstract: The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

Abstract: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

Abstract: Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

Abstract: When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Abstract: A sheet-shaped heat pipe including working fluid, a partition plate having a vapor flow path which is formed by a concave portion provided in a spacer and through which vapor of the working fluid passes and a fluid flow path provided on an inner surface of the concave portion through which the working fluid passes, a container with an opening portion, which includes the working fluid and the partition plate inside thereof, and a sealed portion for hermetically sealing the opening portion of the container. Since container has a laminated structure of at least a metal film and a resin film, it realizes a sheet-shaped heat pipe with high flexibility and little deterioration of a sealing performance.

Abstract: The electronic component mounting apparatus has a board holding part for holding a circuit board, a mounting mechanism for mounting an electronic component on the circuit board, and a grinding part for grinding a suction surface of a suction nozzle of the mounting mechanism. After mounting of the electronic components on the circuit board are repeated a predetermined number of times, the suction surface is ground. In the electronic component mounting apparatus, by continuously moving the suction nozzle in the Y-direction relative to the grinding part and moving the suction nozzle up and down, and bringing the suction surface of the suction nozzle in intermittent contact with the grinding surface of the grinding member with ultrasonic vibrations applied, the suction surface can be ground while preventing the occurrence of a large deformation of the suction nozzle.

Abstract: In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 ?m.

Abstract: When a component that has a connection portion to be connected to the electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than the fusing point of a connection material for connecting the electrode of the board with the connection portion is connected to the board with interposition of the connection material between the electrode of the board and the connection portion, a cooling member is brought in contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and the quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, carrying out the fusing of the connection material while preventing the occurrence of thermal damage to the weak heat-resistant portion.

Abstract: A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.

Abstract: A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.

Abstract: It is a object of this invention to provide a graphite cladding sheet having an excellent mechanical strength and applicable to wide use and a graphite device using said sheet. The graphite cladding sheet 10 comprises a flexible thin graphite sheet having a high orientation and a supporting sheet 12 fixedly laminated on one surface of the graphite film 11. If necessary, the graphite film may be sandwiched between the supporting sheet and the interlocking element by binding them with an adhesive filled in the hole which pass through the graphite film.

Abstract: To increase heat dissipation from a plasma display panel, a heat sinking unit 2 bonded to a curved back surface 11 of a panel unit includes a large number of fin blocks 21 arranged spaced apart from each other by a prescribed distance and a flexible thin-wall portion 22, and a joining section 221, which consists of fin anchoring portions 212 and thin-wall portions 22, is capable of being bent between the fin blocks 21, thus allowing the heat sinking unit 2 to conform to the curvature of the panel unit back surface 11.

Abstract: To increase heat dissipation from a plasma display panel, a heat sinking unit 2 bonded to a curved back surface 11 of a panel unit includes a large number of fin blocks 21 arranged spaced apart from each other by a prescribed distance and a flexible thin-wall portion 22, and a joining section 221, which consists of fin anchoring portions 212 and thin-wall portions 22, is capable of being bent between the fin blocks 21, thus allowing the heat sinking unit 2 to conform to the curvature of the panel unit back surface 11. When using a heat sinking unit not structured to conform to the curvature of the panel unit back surface 11, a high-orientation graphite film as a heat equalizing layer is interposed between the panel unit back surface and the heat sinking unit.

Abstract: A film-like heater which has a graphite film made of a polymer film baked at a temperature higher than 2,000 .degree. C. and having a good thermal conductivity, a good flexibility and a good resistance to high temperature, so that it is applicable to a thin face heat-retaining or heating means having various designs such as a seat heater fittable to a body shape, a vapor deposition boat operable at a high temperature and a compact heating device or apparatus.