Patents by Inventor Daigo Aoki

Daigo Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210394539
    Abstract: There is provided a printing apparatus which includes the following: A printhead including a plurality of nozzles that discharge ink to a print medium. A first detection unit that detects a distance between the printhead and a platen. An adjustment unit that adjusts the distance between the printhead and the platen. An acquisition unit that acquires difference information concerning a difference of a distance between the platen and each of the nozzle on an upstream side and the nozzle on a downstream side in a conveyance direction of the print medium. The adjustment unit adjusts the distance based on a detection result of the first detection unit and the difference information acquired by the acquisition unit.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 23, 2021
    Inventors: Tomohito Abe, Daigo Kuronuma, Ryutaro Takahashi, Naoaki Wada, Noriyuki Aoki, Ryohei Maruyama, Masakazu Nagashima, Toshiaki Yamaguchi
  • Publication number: 20210348265
    Abstract: A standard mask apparatus includes at least one standard mask including at least one through-hole. The standard mask apparatus may include standard regions each including the at least one through-hole. The standard regions may be arranged in a first direction and in a second direction that intersects with the first direction. A ratio of a dimension of each standard region in the first direction to a dimension of an interval between two of the standard regions in the first direction may be higher than or equal to 0.1. A ratio of a dimension of each standard region in the second direction to a dimension of an interval between the two standard regions in the second direction may be higher than or equal to 0.1.
    Type: Application
    Filed: March 8, 2021
    Publication date: November 11, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hideyuki OKAMOTO, Chikao IKENAGA, Yoshihiro BABA, Daigo AOKI
  • Publication number: 20210317562
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo AOKI, Chikao IKENAGA, Isao INOUE
  • Publication number: 20200308688
    Abstract: A wall surface of an opening of a deposition mask includes a first wall surface that extends from a first end toward a second surface, a second wall surface that extends from a second end toward a first surface, and a connection at which the first wall surface is connected to the second wall surface. When the opening is viewed from the first surface side along a normal direction of the first surface, the first end of the opening includes a first portion that extends in a first direction and has a first dimension and a second portion that extends in a second direction intersecting the first direction and a second dimension shorter than the first dimension. The first wall surface includes a first wall surface section that extends from the first portion toward the connection and a second wall surface section that extends from the second portion toward the connection. A height of the first wall surface section is lower than a height of the second wall surface section.
    Type: Application
    Filed: March 24, 2020
    Publication date: October 1, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Daigo AOKI
  • Publication number: 20200291509
    Abstract: A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer peripheral area that is adjacent to the outer frame part, and a central area which is surrounded by the outer peripheral area and has a thickness larger than a thickness of the outer peripheral area.
    Type: Application
    Filed: April 22, 2020
    Publication date: September 17, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao MIYATANI, Daigo AOKI, Masato USHIKUSA, Yoshinori MURATA, Hideyuki OKAMOTO
  • Publication number: 20200248297
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 6, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
  • Publication number: 20190238993
    Abstract: A sound generating device includes an armature having a fixing part facing a first direction and overlapped on an outer surface of a yoke, an extension part extending from the fixing part in a second direction opposite to the first direction, and a movable part bent from the extension part and extending in the first direction, inserted into a coil to oppose a magnet, and connected to an oscillator. The fixing part includes two opposing edge parts that are spot-welded to the outer surface of the yoke at two reference weld areas separated in a perpendicular direction that is perpendicular to the first and second directions. The two opposing edge parts of the fixing part and the outer surface of the yoke are spot-welded at at least one additional weld area at a position separated in the first direction from the reference weld areas.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Inventors: Kiyoshi SATO, Taishi NUMATA, Daigo AOKI, Yutaka SATO
  • Publication number: 20190182602
    Abstract: A sound-producing device includes, in a case, a yoke formed of a magnetic material, a magnet supported by the yoke, a coil, an armature extending through the coil and facing the magnet, and a vibrator configured to vibrate in response to operation of the armature. The yoke is formed of an Fe—Ni alloy containing 32% by mass to 40% by mass of Ni.
    Type: Application
    Filed: February 15, 2019
    Publication date: June 13, 2019
    Inventors: Taishi NUMATA, Daigo AOKI, Kiyoshi SATO, Yutaka SATO
  • Publication number: 20180317016
    Abstract: A magnetic-field-generating unit and a coil vibrates an armature. The armature drives a diaphragm. The armature is formed of a rolled metal plate made of Permalloy. A workpiece is cut out of an unannealed metal plate with a wire saw or by etching such that the long-side direction of the workpiece corresponds to a transverse direction that is orthogonal to the direction of rolling performed on the metal plate. The cut-out workpiece is bent and is then annealed. Through this process, the warp of the armature is minimized.
    Type: Application
    Filed: June 21, 2018
    Publication date: November 1, 2018
    Inventors: Daigo Aoki, Taishi Numata, Kiyoshi Sato
  • Patent number: 8815130
    Abstract: A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: August 26, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hironori Kobayashi, Manabu Yamamoto, Daigo Aoki, Hironori Kamiyama, Shinichi Hikosaka, Mitsuhiro Kashiwabara
  • Patent number: 8785108
    Abstract: A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: July 22, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hironori Kobayashi, Manabu Yamamoto, Daigo Aoki, Hironori Kamiyama, Shinichi Hikosaka, Mitsuhiro Kashiwabara
  • Patent number: 8735880
    Abstract: A static induction light emitting transistor comprising: on a substrate: a source electrode; a hole transporting layer in which a slit-shaped gate electrode is embedded; an equipotential layer; light emitting layer; and a transparent or semitransparent drain electrode, provided in this order. In this light emitting transistor, the drain electrode provided on the opposite side of the gate electrode, viewing from the light emitting layer, is transparent or semitransparent.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: May 27, 2014
    Assignees: Dai Nippon Printing Co., Ltd.
    Inventors: Junji Kido, Daigo Aoki
  • Patent number: 8567255
    Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: October 29, 2013
    Assignee: Alps Electric Co., Ltd.
    Inventors: Daigo Aoki, Hideyuki Hashimoto, Tetsuya Kobayashi, Kunio Koizumi, Yoshiaki Shimizu, Yutaka Takashima, Shinya Yokoyama
  • Publication number: 20130270532
    Abstract: A static induction light emitting transistor comprising: on a substrate: a source electrode; a hole transporting layer in which a slit-shaped gate electrode is embedded; an equipotential layer; light emitting layer; and a transparent or semitransparent drain electrode, provided in this order. In this light emitting transistor, the drain electrode provided on the opposite side of the gate electrode, viewing from the light emitting layer, is transparent or semitransparent.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 17, 2013
    Applicants: DAI NIPPON PRINTING CO., LTD.
    Inventors: Junji KIDO, Daigo AOKI
  • Patent number: 8546948
    Abstract: A silicon structure includes a silicon substrate having an electric element; a wiring conductor and a bonding pad, connecting the electric element and an external circuit; a protective layer disposed on the silicon substrate; and a pad opening pattern provided in the protective layer to exposed the bonding pad, wherein a probe mark position and a wire bonding position differ, without increasing the size of the bonding pad in plan view. A substrate exposure part, which is not covered with the protective layer, is provided at part of an outer edge of the bonding pad disposed inside the pad opening pattern in the protective film, and the wiring conductor is not exposed through substrate exposure part.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: October 1, 2013
    Assignee: Alps Electric Co., Ltd.
    Inventor: Daigo Aoki
  • Patent number: 8426874
    Abstract: A main object of the present invention is to provide a static induction light emitting transistor having an organic EL element structure and a vertical FET structure which is possible to avoid a problem of the shielding of light and a problem of shielding of electric field by a gate electrode. The above object is achieved by providing a light emitting transistor 11 of a vertical FET structure comprising: on a substrate 12; a source electrode 13; a hole transporting layer 14 in which a slit-shaped gate electrode 15 is embedded; an equipotential layer 16; light emitting layer 17; and a transparent or semitransparent drain electrode 18, provided in this order. In this light emitting transistor, the drain electrode 18 provided on the opposite side of the gate electrode 15, viewing from the light emitting layer 17, is transparent or semitransparent. Therefore, light generated in the light emitting layer 17 can be taken out from the drain electrode side.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: April 23, 2013
    Assignees: Dai Nippon Printing Co., Ltd.
    Inventors: Junji Kido, Daigo Aoki
  • Patent number: 8314444
    Abstract: A piezoresistive pressure sensor is provided, which can prevent the occurrence of ESD breakdown due to the nearness of interconnection layers of a resistive element according to miniaturization thereof. The piezoresistive pressure sensor is so configured that respective semiconductor resistive layers on both sides of an arrangement are formed to be relatively longer than an adjacent semiconductor resistive layer, and thus a corner portion of a semiconductor connection layer that extends from the respective semiconductor resistive layers on both sides of the arrangement and a corner portion of the semiconductor interconnection layer that is nearest to the corner portion of the semiconductor connection layer, between which the ESD breakdown occurs easily, can be separated from each other.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: November 20, 2012
    Assignee: Alps Electric Co., Ltd.
    Inventors: Shinya Yokoyama, Daigo Aoki, Yutaka Takashima
  • Patent number: 8268546
    Abstract: A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: September 18, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hironori Kobayashi, Manabu Yamamoto, Daigo Aoki, Hironori Kamiyama, Shinichi Hikosaka, Mitsuhiro Kashiwabara
  • Publication number: 20120112369
    Abstract: A silicon structure includes a silicon substrate having an electric element; a wiring conductor and a bonding pad, connecting the electric element and an external circuit; a protective layer disposed on the silicon substrate; and a pad opening pattern provided in the protective layer to exposed the bonding pad, wherein a probe mark position and a wire bonding position differ, without increasing the size of the bonding pad in plan view. A substrate exposure part, which is not covered with the protective layer, is provided at part of an outer edge of the bonding pad disposed inside the pad opening pattern in the protective film, and the wiring conductor is not exposed through substrate exposure part.
    Type: Application
    Filed: January 18, 2012
    Publication date: May 10, 2012
    Applicant: ALPS ELECTRIC CO., LTD.
    Inventor: Daigo AOKI
  • Patent number: 8149540
    Abstract: In a magnetic head structure that forms a medium facing surface of a head element unit by polishing processing, a height monitor that is exposed in the vicinity of the head element unit during the polishing processing to index the height of the head element unit is provided in a planar rectangular shape.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: April 3, 2012
    Assignee: TDK Corporation
    Inventors: Daigo Aoki, Kenji Honda