Patents by Inventor Daiki Komatsu

Daiki Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210096344
    Abstract: An extender lens changes a focal length of an entire lens system after replacement to a longer focal length side than a focal length of a master lens by replacing a part of the master lens with the extender lens. The extender lens consists of, in order from an object side to an image side, a first lens group, and a negative second lens group. The first lens group is a lens group that has a positive refractive power as a whole and has a shortest focal length among lens groups consisting of one lens component or a plurality of consecutively arranged lens components. The extender lens satisfies a predetermined conditional expression.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 1, 2021
    Applicant: FUJIFILM Corporation
    Inventor: Daiki KOMATSU
  • Patent number: 10880473
    Abstract: Provided are an imaging apparatus, a signal processing method for an imaging apparatus, and a non-transitory computer readable recording medium storing a signal processing program for an imaging apparatus capable of capturing a high quality image with a compact configuration. An imaging lens 10A is composed of, in order from an object side, a first lens group G1 that is fixed during variable magnification, a second lens group G2 and a third lens group G3 that move during variable magnification, and a fourth lens group G4 that is fixed during variable magnification. The first lens group G1 is composed, in order from the object side, a first-a lens group G1a that is fixed during focusing, a first-b lens group G1b that moves during focusing, and a first lens group rear group G1c that is fixed during focusing. Fluctuation of an angle of view with focusing is corrected through image processing.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: December 29, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Daiki Komatsu, Yosuke Naruse, Kenkichi Hayashi, Yoshiaki Ishii, Yasunobu Kishine
  • Publication number: 20200388508
    Abstract: In described examples, a method of printing repassivation onto a substrate includes depositing an ink comprising particles of a repassivation material onto specified locations on a surface of the substrate using an inkjet printer, and curing the repassivation material.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 10, 2020
    Inventors: Makoto Shibuya, Daiki Komatsu, Yi Yan, Hau Nguyen, Luu Thanh Nguyen
  • Patent number: 10825562
    Abstract: According to one embodiment, a medical image display apparatus comprising a memory and processing circuitry. The memory configured to store a task management table associating a processing task executed for a medical image with state information representing whether or not the processing task has been executed. The processing circuitry configured to extract, from the task management table, state information that is associated with a processing task for a medical image requested to be displayed, and display, based on the extracted state information, information indicative of whether or not a processing task has been executed for the requested medical image.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: November 3, 2020
    Assignee: Canon Medical Systems Corporation
    Inventors: Naoki Sugiyama, Yosuke Yanagida, Daiki Komatsu
  • Patent number: 10807494
    Abstract: The state of internal resistance is appropriately expressed for a battery being energized. A battery management system includes a battery information acquisition section, a voltage calculation section, a current fluctuation amount calculation section 109 and a resistance correction amount calculation section. The battery information acquisition section acquires a voltage value V of a storage battery being energized. The voltage calculation section acquires a predicted battery voltage value Vmodel of the storage battery being energized by a method different from that of the battery information acquisition section. The current fluctuation amount calculation section calculates a current fluctuation amount dI/dt of the storage battery per unit time.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: October 20, 2020
    Assignee: Vehicle Energy Japan Inc.
    Inventors: Masahiro Yonemoto, Kei Sakabe, Ryohhei Nakao, Keiichiro Ohkawa, Daiki Komatsu
  • Publication number: 20200294210
    Abstract: An object of the present invention is provide a coded aperture imaging apparatus that has a refocusing function and can change an angle of view. An imaging apparatus includes an imaging apparatus main body including a coded aperture, an imaging element that outputs a signal indicating a projected image of a subject, and an image restoration unit that reconstructs an image of a spatial domain based on the signal, and a lens attached to the imaging apparatus main body on a subject side from the coded aperture and changes an imaging angle of view in a state where the lens is attached to the imaging apparatus main body with respect to an imaging angle of view in a state where the lens is not attached to the imaging apparatus main body, in which the projected image is formed on the imaging element by the lens and the coded aperture.
    Type: Application
    Filed: June 3, 2020
    Publication date: September 17, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Yasunobu KISHINE, Daiki KOMATSU
  • Publication number: 20200286816
    Abstract: An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.
    Type: Application
    Filed: March 20, 2020
    Publication date: September 10, 2020
    Inventors: Daiki Komatsu, Makoto Shibuya
  • Patent number: 10636729
    Abstract: An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: April 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Daiki Komatsu, Makoto Shibuya
  • Publication number: 20200064603
    Abstract: The zoom lens consists of, in order from an object side: a positive first lens group that does not move during zooming; a middle group that consists of two or more movable lens groups moving during zooming; and a subsequent group that has a lens group including a stop at a position closest to the object side. The middle group has at least two negative movable lens groups. The subsequent group includes at least one positive LA lens that satisfies predetermined conditional expressions relating to the refractive index, the Abbe number, and the partial dispersion ratio.
    Type: Application
    Filed: August 15, 2019
    Publication date: February 27, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Masaru YONEZAWA, Daiki KOMATSU, Takashi KUNUGISE
  • Publication number: 20200064601
    Abstract: The zoom lens consists of, in order from an object side: a positive first lens group that does not move during zooming; a middle group that consists of two or more movable lens groups moving during zooming; and a subsequent group that has a lens group including a stop at a position closest to the object side. The middle group has at least two negative movable lens groups. At least one negative movable lens group in the middle group includes at least one negative LN lens which satisfies predetermined conditional expressions relating to the refractive index, the Abbe number, and the partial dispersion ratio.
    Type: Application
    Filed: August 15, 2019
    Publication date: February 27, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Masaru YONEZAWA, Daiki KOMATSU, Takashi KUNUGISE
  • Publication number: 20200043878
    Abstract: Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 6, 2020
    Applicant: Texas Instruments Incorporated
    Inventors: Daiki Komatsu, Makoto Shibuya, Yi Yan, Hau Nguyen, Luu Thanh Nguyen, Anindya Poddar
  • Publication number: 20200043778
    Abstract: Disclosed examples provide methods that include forming a conductive structure at least partially above a conductive feature of a wafer, attaching a solder ball structure to a side of the conductive structure, and thereafter forming a repassivation layer on a side of the wafer proximate the side of the conductive structure. Further examples provide microelectronic devices and integrated circuits that include a conductive structure coupled with a conductive feature of a metallization structure, a solder ball structure connected to the conductive structure, and a printed repassivation layer disposed on the side of the metallization structure proximate a side of the conductive structure.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 6, 2020
    Inventors: Daiki Komatsu, Makoto Shibuya
  • Patent number: 10541220
    Abstract: Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: January 21, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Daiki Komatsu, Makoto Shibuya, Yi Yan, Hau Nguyen, Luu Thanh Nguyen, Anindya Poddar
  • Publication number: 20190377166
    Abstract: Provided are an imaging apparatus, a signal processing method for an imaging apparatus, and a non-transitory computer readable recording medium storing a signal processing program for an imaging apparatus capable of capturing a high quality image with a compact configuration. An imaging lens 10A is composed of, in order from an object side, a first lens group G1 that is fixed during variable magnification, a second lens group G2 and a third lens group G3 that move during variable magnification, and a fourth lens group G4 that is fixed during variable magnification. The first lens group G1 is composed, in order from the object side, a first-a lens group G1a that is fixed during focusing, a first-b lens group G1b that moves during focusing, and a first lens group rear group G1c that is fixed during focusing. Fluctuation of an angle of view with focusing is corrected through image processing.
    Type: Application
    Filed: August 23, 2019
    Publication date: December 12, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Daiki KOMATSU, Yosuke NARUSE, Kenkichi HAYASHI, Yoshiaki ISHII, Yasunobu KISHINE
  • Publication number: 20190353871
    Abstract: Provided are an imaging apparatus, an image processing apparatus, an image processing method, and a non-transitory computer readable recording medium storing an image processing program capable of appropriately correcting both of focus breathing and distortion. Focus breathing is corrected by subjecting image data to magnification/reduction processing according to a magnification/reduction rate determined for each focus position. Distortion is corrected through image processing to the image data with focus breathing corrected. In correcting distortion, distortion appearing in image data after correction of focus breathing is corrected.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 21, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Kenkichi Hayashi, Yosuke Naruse, Yasunobu Kishine, Daiki Komatsu
  • Publication number: 20190242948
    Abstract: In an existing permissible current computation algorithm, an excessive current is caused to flow by controlling the battery having a steep change region in the battery characteristic. On the other hand, when the current is reduced and the output is suppressed, the battery performance cannot be sufficiently utilized. Moreover, with countermeasures to increase the number of data points, the amount of data increases and thus can not be installed in the microcomputer.
    Type: Application
    Filed: July 28, 2017
    Publication date: August 8, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Daiki KOMATSU, Kei SAKABE, Masahiro YONEMOTO, Shin YAMAUCHI, Keiichiro OHKAWA, Ryohhei NAKAO
  • Publication number: 20190207406
    Abstract: Provided is a battery system in which a battery cell does not exceed a use limit temperature, and a time taken for returning to the charging/discharging process is shortened even if a frequency for the battery system to stop a charging/discharging process is reduced and the charging/discharging process is stopped. The battery system disclosed in the invention includes a plurality of battery cells and a control circuit which controls a charging/discharging current of the battery cell. The control circuit performs a plurality of temperature rising estimations on the basis of a battery temperature, a charging/discharging current, and a time width of a time window. The control circuit selects the charging/discharging current corresponding to a temperature rising estimation in which the temperature of the battery cell does not exceed a use limit temperature among the temperature rising estimations.
    Type: Application
    Filed: February 6, 2018
    Publication date: July 4, 2019
    Inventors: Fanny MATTHEY, Shin YAMAUCHI, Kei SAKABE, Ryohhei NAKAO, Daiki KOMATSU, Keiichiro OHKAWA
  • Publication number: 20190206768
    Abstract: Leadframes, integrated circuit packaging with wettable flanks, and methods of manufacturing the same are disclosed. An example packaged device having a leadframe includes a die pad and a lead spaced apart from the die pad. The lead has a proximal end adjacent the die pad and a distal end extending away from the die pad. The lead has a thickness at the distal end that is less than a full thickness of the leadframe between a first outer surface on a die attach side of the leadframe and a second outer surface on a mounting side of the leadframe.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: Makoto Shibuya, Daiki Komatsu
  • Publication number: 20190023132
    Abstract: The state of internal resistance is appropriately expressed for a battery being energized. A battery management system includes a battery information acquisition section, a voltage calculation section, a current fluctuation amount calculation section 109 and a resistance correction amount calculation section. The battery information acquisition section acquires a voltage value V of a storage battery being energized. The voltage calculation section acquires a predicted battery voltage value Vmodel of the storage battery being energized by a method different from that of the battery information acquisition section. The current fluctuation amount calculation section calculates a current fluctuation amount dI/dt of the storage battery per unit time.
    Type: Application
    Filed: February 1, 2017
    Publication date: January 24, 2019
    Inventors: Masahiro YONEMOTO, Kei SAKABE, Ryohhei NAKAO, Keiichiro OHKAWA, Daiki KOMATSU
  • Publication number: 20180366396
    Abstract: An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.
    Type: Application
    Filed: June 19, 2017
    Publication date: December 20, 2018
    Inventors: Daiki Komatsu, Makoto Shibuya