Abstract: According to one embodiment, a semiconductor device includes the following structure. The semiconductor chip is provided between first and second conductors. A joint component is provided between the chip and the second conductor. The thin film is provided on the second conductor and contains a material different from a material of the joint component. The second conductor includes first, second and third plates. The first plate extends in a first direction along a first surface of the chip and is connected to the chip via the joint component. The second plate extends from the first plate obliquely with respect to the first direction. The third plate extends from the second plate in the first direction. The thin film is arranged on a surface of the second plate continuous from a surface on which the joint component is provided.

Abstract: A semiconductor device includes: a semiconductor chip having a first surface, a second surface, a first electrode provided on the first surface, a second electrode provided on the second surface, and a third electrode provided on the second surface; a first conductor including a fourth conductor and a fifth conductor; a conductive first connector provided between the first conductor and the first electrode; a second conductor including a sixth conductor and a seventh conductor; a conductive second connector provided between the second electrode and the sixth conductor; a third conductor including an eighth conductor, an intermediate conductor, and a ninth conductor, the intermediate conductor being provided between the eighth conductor and the ninth conductor, the eighth conductor being provided between the semiconductor chip and the intermediate conductor, and the intermediate conductor having a through hole; and a conductive third connector.

Abstract: The electronic device includes a semiconductor module provided on a heat sink including a first joined surface portion. The semiconductor module includes a heat dissipation plate including a second joined surface portion joined to the first joined surface portion via a thermally-conductive bonding material, and a transistor chip placed on a side of the heat dissipation plate which is opposite to the second joined surface portion. At least one joined surface portion out of the first joined surface portion and the second joined surface portion includes a plurality of protrusions protruding toward the other joined surface portion out of the first joined surface portion and the second joined surface portion, a first recess placed between the protrusions and recessed in a direction away from the other joined surface portion, and a second recess placed outward of the plurality of protrusions and recessed in a direction away from the other joined surface portion.

Abstract: An image forming apparatus includes an image forming section, a fixing device, and circuitry. The image forming section forms an image on a recording medium. The fixing device includes a rotator including a flexible endless belt, a pressure rotator pressed against the rotator to form a nip between the rotator and the pressure rotator, a heater heating the rotator, and a movable shield. The movable shield is disposed between the heater and the rotator to shield the rotator from radiant heat generated from the heater and is movable according to a size of the recording medium. The circuitry is configured to control the image forming section to form the image on the recording medium based on an image forming condition and change at least one of an operating temperature of the movable shield or a shielding amount of the movable shield based on the image forming condition.

Abstract: A battery including a self-supporting laminate structure is provided. The laminate structure includes a solid electrolyte sheet containing a solid electrolyte, a first active material layer containing a first active material on one major surface of the solid electrolyte sheet, and a second active material layer containing a second active material on the other major surface of the solid electrolyte sheet. The solid electrolyte sheet preferably has a first extending portion extending outwardly from the periphery of the first active material layer or, a second extending portion extending outwardly from the periphery of the second active material layer.

Abstract: A semiconductor device, including: a semiconductor chip including an electrode on an upper surface thereof; and a wiring member including a bonding portion, a rising portion, and a connecting portion, the bonding portion being bonded to the electrode via a bonding material, the rising portion being of a shape of a flat plate and extending upward from the bonding portion, the connecting portion connecting the bonding portion to the rising portion. The rising portion includes a lower region connected to the connecting portion and an upper region located above the lower region. Both the lower region and the connecting portion have a first thickness, and the upper region has a second thickness that is larger than the first thickness.

Abstract: An image forming apparatus includes a processor; and a memory that includes instructions, which when executed, cause the processor to execute forming, by an image former, an image on a recording medium; fixing, by a fixer including a rotatable fixing member, the image onto the recording medium, by causing the recording medium on which the image is formed by the image former to be disposed against the fixing member; driving, by a driver, the fixing member; and acquiring, by control circuitry, life information related to a life of the fixer based on either a driving current or a torque of the driver and an operation state of the fixer, and outputting the acquired life information.

Abstract: A semiconductor laser element includes a laser section configured to cause light to perform laser oscillation, an amplification section configured to amplify the light, an active region extending to the laser section and the amplification section, a first anti-reflection coating provided on an end face of the laser section opposite to the amplification section with respect to the laser section, and a second anti-reflection coating provided on an end face of the amplification section opposite to the laser section with respect to the amplification section. In a plan view, an area of the active region in the amplification section is larger than an area of the active region in the laser section.

Abstract: An active material contains at least one element M selected from the group consisting of nickel, cobalt, manganese, and lithium and an element X different from the element M. The element X comprises at least one member selected from metals of groups 2 and 15 in the second period, metals of groups 3, 11, and 13 to 16 in the fourth period, metals of groups 1 to 3, 7 to 13, and 15 to 17 in the fifth period, metals of groups 1 to 3 and 7 to 17 in the sixth period, and metals of groups 1 to 17 in the seventh period of the periodic table.

Abstract: A toner includes toner particles. Each of the toner particles includes a toner base particle including a binder resin, resin particles covering the toner base particle, and zinc stearate particles serving as an external additive. In each of the toner particles, a coverage rate of the toner base particle with the resin particles is 30% or greater and 70% or less. The zinc stearate particles have a volume average particle diameter of 3 ?m or greater and 20 ?m or less.

Abstract: An active material includes a core portion, and a coating portion arranged on a surface of the core portion. The core portion contains elemental lithium (Li), elemental manganese (Mn), and elemental oxygen (O). The coating portion contains an element A (A is at least one selected from the group consisting of Ti, Zr, Ta, Nb, and Al) and elemental oxygen (O). W/(T×S) is more than 0 and 15% by mass/(cm3/g) or less, wherein T (nm) represents an average thickness of the coating portion, S (m2/g) represents a specific surface area of the active material, and W (% by mass) represents an amount of element A contained in the coating portion.

Abstract: A semiconductor laser device includes a laser region that causes light to perform laser oscillation, an amplifier region adjacent to the laser region and amplifies the light, and a resistor provided in the laser region and heats the laser region. The resistor has at least one first portion and at least one second portion. The at least one second portion is connected to the at least one first portion and is closer to a boundary between the laser region and the amplifier region than the first portion. A resistance per unit length of the at least one second portion is higher than a resistance per unit length of the at least one first portion.

Abstract: An optical integrated laser device includes: an InP substrate; a distributed feedback laser unit having a first optical waveguide being an active region of a laser, and provided on the InP substrate; a semiconductor optical amplifier unit having a second optical waveguide being an active region of the amplifier, and provided on the InP substrate, the second optical waveguide being connected to the first optical waveguide and having a width wider than that of the first optical waveguide; and a highly reflective film having a reflectance of 70% or more, the highly reflective film being provided on an end face of the distributed feedback laser unit opposite to an end face of the semiconductor optical amplifier unit. A length of the second optical waveguide is at least 1.5 times and at most 7 times the length of the first optical waveguide.

Abstract: A fixing device includes a fixing rotator rotatable in a rotation direction, a heat source to heat the fixing rotator, a pressure rotator contacting the fixing rotator, a nip formation pad to form a fixing nip between the fixing rotator and the pressure rotator, a slide sheet, and an adhesive part. The slide sheet between the fixing rotator and the nip formation pad contacts an inner circumferential face of the fixing rotator. The slide sheet has a center part and both end parts in an axial direction orthogonal to the rotation direction. The adhesive part bonds the slide sheet to the nip formation pad. The adhesive part includes a first adhesive part on the center part and a second adhesive part on one of the end parts. The first adhesive part has a first area, and the second adhesive part has a second area smaller than the first area.

Abstract: A semiconductor device, including: a semiconductor chip having a first electrode and a second electrode respectively on a upper surface and a lower surface thereof; and a wiring member including a bonding portion having a bonding surface, which is bonded to the first electrode with a solder therebetween, and a rising portion extending from an outer periphery of the bonding portion, the bonding surface being located, in a plan view of the semiconductor device, within the upper surface of the semiconductor chip. The bonding surface has an outer edge area and a middle area. In a height direction of the semiconductor device, a first height from the outer edge area of the bonding surface to the upper surface of the semiconductor chip is greater than a second height from the middle area of the bonding surface to the upper surface of the semiconductor chip.

Abstract: A fixing device includes a fixing rotator to fix an unfixed image on a recording medium, a pressure member disposed opposite the fixing rotator to press an outer circumferential surface of the fixing rotator; a heating source disposed inside an inner circumferential surface of the fixing rotator to heat the fixing rotator, and a composite member disposed inside the inner circumferential surface. The composite member includes a first member, a second member attached to the first member, and an inspection region for measurement of glossiness. The first member and the second member have a difference in glossiness. The inspection region allows identification of which one of the first member and the second member is present on a surface of the inspection region based on the glossiness of the inspection region, and determination of that the fixing device has a desired fixing configuration based on a result of the identification.

Abstract: A toner is provided. The toner comprises toner particles each comprising a toner base particle and an external additive. The toner base particle comprises a binder resin and a colorant. The toner satisfies the following conditions (a) and (b): (a) an average surface roughness Ra [nm] of the toner particles, detected by a scanning probe microscope analyzer, satisfies the following formula (1): 10<Ra<200??Formula (1); and (b) the external additive comprises coalesced particles being non-spherical secondary particles in which primary particles are coalesced with each other, the coalesced particles having a number average particle diameter of 50 nm or more.

Abstract: The disclosure provides a flexographic printing original plate which comprises an adhesive layer that exhibits excellent solvent resistance and excellent adhesion to a supporting body. The disclosure provides a flexographic printing original plate 10 which sequentially comprises, on a surface of a supporting body 12, an elastic layer 16 and an adhesive layer 14, wherein the supporting body 12 contains a polyester resin and the adhesive layer 14 contains the components (a), (b) and (c) described below. (a) a polyester resin (b) an isocyanate compound (c) a xylene resin which has a melting point or softening point of 100° C. or less.