Semiconductor module

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Description

FIG. 1 is a front perspective view of the semiconductor module, showing the new design;

FIG. 2 is a rear perspective view of the semiconductor module;

FIG. 3 is a front view of the semiconductor module;

FIG. 4 is a rear view of the semiconductor module;

FIG. 5 is a left side view of the semiconductor module;

FIG. 6 is a right view of the semiconductor module;

FIG. 7 is a top view of the semiconductor module; and,

FIG. 8 is a bottom view of the semiconductor module.

Claims

The ornamental design for a semiconductor module as shown and described.

Referenced Cited
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Patent History
Patent number: D1114754
Type: Grant
Filed: Nov 1, 2024
Date of Patent: Feb 24, 2026
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Taisuke Fukuda (Matsumoto), Daisuke Inoue (Matsumoto)
Primary Examiner: Rosemary K Tarcza
Application Number: 29/971,235