Abstract: A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).

Abstract: Disclosed is a method for modifying an insulating film with plasma using a plasma processing apparatus which introduces a microwave into a processing chamber through a plane antenna having a plurality of holes. Processing gas containing a noble gas and oxygen is introduced into the processing chamber and microwave is introduced into the processing chamber through the plane antenna. Plasma composed mainly of O2+ ions and O(1D2) radicals is generated in a pressure condition within a range of 6.7 Pa to 267 Pa to modify the insulating film with the plasma.

Abstract: A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound.

Abstract: A conveyance path for conveying articles though an accumulation conveyor, then through a carry-out conveyor, and then through a joining station is disclosed. After a flow of articles and at a time when there are no articles present on a portion of the conveyance path, an article spacing control of the carry-out conveyor and the carry-out of an article to the joining station are stopped. In the conveyance path where an article is present on a portion of the conveyance path, the speed control of an article in the accumulation conveyor is conducted at a speed higher than a constant speed, the speed control of the carry-out conveyor is conducted at a speed higher than the constant speed, and the article spacing control is conducted at a spacing narrower than a prescribed spacing.

Abstract: When article is conveyed only with one conveyance path, in a conveyance path where article is not conveyed, the article spacing control of a carry-out conveyor and the carry-out of article to a joining apparatus are stopped. In a conveyance path where article is conveyed, the speed control of article in the accumulation conveyor is conducted at a speed higher than the constant speed, the speed control of the carry-out conveyor is conducted at a speed higher than the constant speed, and the article spacing control is conducted at a spacing narrower than the prescribed spacing.