Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A substrate delivery mechanism comprises a top ring 10, a substrate loader 50 for loading a substrate Wf, and a pusher mechanism 20, wherein the substrate loader 50 comprises a top ring guide 53 and the pusher mechanism 20 comprises a top ring guide lifting table 21, in which the top ring guide 53 and the top ring guide lifting table 21 together form a sealed space M below the substrate Wf held by the top ring 10 in a condition where the substrate loader 50 is moved up by the pusher mechanism 20, wherein the substrate Wf is detached from the top ring 10 by exhausting the sealed space M while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring 10.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.

Abstract: A duplex transmission and reception system wherein a local oscillator of the receiver is dispensed with by using the output of a modulated transmission oscillator, with its modulation cancelled, in lieu of a receiver local oscillator. The transmitter modulation signal is adjusted by appropriate level correction and phase inversion. The modulated output of the transmission oscillator is itself applied to a modulator, where it is modulated by the adjusted modulation signal. This results in substantially cancelling out the modulation component of the transmission oscillator output. This modulation-cancelled signal is supplied to the mixer of a superheterodyne receiver as a local oscillator signal.