Patents by Inventor Daisuke Koizumi

Daisuke Koizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10681735
    Abstract: Provided is a wireless environment evaluation method including a step 1 acquiring a transmission and reception history of wireless signals transmitted and received between the plurality of wireless stations and acquiring or estimating a number of wireless stations in transmission standby, based on the transmission and reception history; a step 2 calculating a normal reception rate S in a congesting situation in reception according to the number of wireless stations in transmission standby; a step 3 acquiring a normal reception rate S? of the wireless signals per a fixed channel use time from the transmission and reception history in the prescribed wireless station; and a step 4 determining a degree of the exposed situation in reception according to a ratio of the normal reception rate S? to the normal reception rate S.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: June 9, 2020
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Akiyoshi Inoki, Hirantha Abeysekera, Munehiro Matsui, Takeo Ichikawa, Masato Mizoguchi, Akira Kishida, Daisuke Koizumi, Akira Yamada, Yoshifumi Morihiro, Takahiro Asai
  • Publication number: 20200038479
    Abstract: An object of the present invention is to provide an active ingredient for a wound healing agent that has high biocompatibility and an antimicrobial activity, as well as a wound healing accelerating activity, which can be applied to supply of a wound healing agent comprising a single active ingredient, which can be produced by a simple production process and production apparatus. According to the present invention, at least one compound selected from a protamine and pharmaceutically acceptable salts thereof is used as an active ingredient for antibacterial activity and wound healing acceleration of a wound healing agent.
    Type: Application
    Filed: October 4, 2017
    Publication date: February 6, 2020
    Applicant: MARUHA NICHIRO CORPORATION
    Inventors: Hiroyuki ENARI, Keishi IOHARA, Akira KAMATA, Daisuke KOIZUMI
  • Publication number: 20190059107
    Abstract: Provided is a wireless environment evaluation method including a step 1 acquiring a transmission and reception history of wireless signals transmitted and received between the plurality of wireless stations and acquiring or estimating a number of wireless stations in transmission standby, based on the transmission and reception history; a step 2 calculating a normal reception rate S in a congesting situation in reception according to the number of wireless stations in transmission standby; a step 3 acquiring a normal reception rate S? of the wireless signals per a fixed channel use time from the transmission and reception history in the prescribed wireless station; and a step 4 determining a degree of the exposed situation in reception according to a ratio of the normal reception rate S? to the normal reception rate S.
    Type: Application
    Filed: February 23, 2017
    Publication date: February 21, 2019
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Akiyoshi INOKI, Hirantha Sithira ABEYSEKERA, Munehiro MATSUI, Takeo ICHIKAWA, Masato MIZOGUCHI, Akira KISHIDA, Daisuke KOIZUMI, Akira YAMADA, Yoshifumi MORIHIRO, Takahiro ASAI
  • Patent number: 8671557
    Abstract: A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: March 18, 2014
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Daisuke Koizumi, Shigeyuki Maruyama, Kazuhiro Tashiro, Naoyuki Watanabe
  • Patent number: 8428651
    Abstract: A shared transmission/reception apparatus (OF-TRX) includes: a transmission/reception processor section (TRX-B) for a mobile communication system B configured to perform frequency conversion processing on a transmission baseband signal for the mobile communication system B outputted from a signal converter section (E/O), and to output a transmission radio frequency signal for the mobile communication system B; a power level adjuster section (VA) configured to adjust a power level of a transmission radio frequency signal for a mobile communication system A inputted from a transmission/reception processor section (TRX-A) for the mobile communication system A; a combiner section (COM) configured to generate a transmission radio frequency signal by combining the transmission radio frequency signal for the mobile communication system A outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the mobile communication system B outputted from the transmission/reception proc
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: April 23, 2013
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Masayuki Motegi, Yoshitsugu Shimazu, Seizo Onoe, Naoki Nakaminami
  • Patent number: 8213992
    Abstract: A shared AMP includes: a transmission/reception processor section (TRX-B) for a second mobile communication system configured to perform frequency conversion processing on an inputted transmission baseband signal for a mobile communication system B, and to output a transmission radio frequency signal for the second mobile communication system; a power level adjuster section (VA) configured to adjust a power level of an inputted transmission radio frequency signal for a first mobile communication system; a combiner section (COM) configured to generate a transmission radio frequency signal, by combining the transmission radio frequency signal for the first mobile communication system outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the second mobile communication system outputted from the transmission/reception processor section (TRX-B) for the second mobile communication system; and a common amplifier section (PA) configured to amplify a power level of the tr
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: July 3, 2012
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Masayuki Motegi, Yoshitsugu Shimazu, Seizo Onoe, Naoki Nakaminami
  • Publication number: 20120005883
    Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 12, 2012
    Applicant: FUJITSU SEMICONDUCTOR LIMITED
    Inventors: Daisuke Koizumi, Shigeyuki Maruyama, Kazuhiro Tashiro, Naoyuki Watanabe
  • Patent number: 8051554
    Abstract: An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the stan
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: November 8, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Daisuke Koizumi, Shigeyuki Maruyama, Kazuhiro Tashiro, Naoyuki Watanabe
  • Patent number: 7977961
    Abstract: A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: July 12, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Daisuke Koizumi, Naohito Kohashi, Yuji Akasaki
  • Patent number: 7978027
    Abstract: A coplanar waveguide resonator (100a) has a center conductor (101) formed on a dielectric substrate (105) that has a line conductor (a center line conductor) (101b) extending in the input/output direction, a ground conductor (103) that is disposed on the dielectric substrate (105) across a gap section from the center conductor (101), and a line conductor (a base stub) (104) formed as an extension line from the ground conductor (103), and a part of the base stub (104) constitutes a line conductor (a first collateral line conductor) (104a) disposed in parallel with the center line conductor (101b).
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: July 12, 2011
    Assignee: NTT DoCoMo, Inc.
    Inventors: Kei Satoh, Daisuke Koizumi, Shoichi Narahashi
  • Publication number: 20110026931
    Abstract: A shared transmission/reception apparatus (OF-TRX) includes: a transmission/reception processor section (TRX-B) for a mobile communication system B configured to perform frequency conversion processing on a transmission baseband signal for the mobile communication system B outputted from a signal converter section (E/O), and to output a transmission radio frequency signal for the mobile communication system B; a power level adjuster section (VA) configured to adjust a power level of a transmission radio frequency signal for a mobile communication system A inputted from a transmission/reception processor section (TRX-A) for the mobile communication system A; a combiner section (COM) configured to generate a transmission radio frequency signal by combining the transmission radio frequency signal for the mobile communication system A outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the mobile communication system B outputted from the transmission/reception proc
    Type: Application
    Filed: July 23, 2008
    Publication date: February 3, 2011
    Applicant: NTT DOCOMO, INC.
    Inventors: Daisuke Koizumi, Masayuki Motegi, Yoshitsugu Shimazu, Seizo Onoe, Naoki Nakaminami
  • Publication number: 20100304790
    Abstract: A shared AMP includes: a transmission/reception processor section (TRX-B) for a second mobile communication system configured to perform frequency convers ion processing on an inputted transmission baseband signal for a mobile communication system B, and to output a transmission radio frequency signal for the second mobile communication system; a power level adjuster section (VA) configured to adjust a power level of an inputted transmission radio frequency signal for a first mobile communication system; a combiner section (COM) configured to generate a transmission radio frequency signal, by combining the transmission radio frequency signal for the first mobile communication system outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the second mobile communication system outputted from the transmission/reception processor section (TRX-B) for the second mobile communication system; and a common amplifier section (PA) configured to amplify a power level of the t
    Type: Application
    Filed: July 23, 2008
    Publication date: December 2, 2010
    Applicant: NTT DOCOMO, INC.
    Inventors: Daisuke Koizumi, Masayuki Motegi, Yoshitsugu Shimazu, Seizo Onoe, Naoki Nakaminami
  • Patent number: 7825676
    Abstract: A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that contacts a terminal of an electronic part and a second contact part that contacts the electrically conductive part in a middle portion. When the contact terminal bends by the first contact part being pressed, the second contact part contacts the electrically conductive part of the contactor substrate and an appropriate degree of contact pressure is obtained.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: November 2, 2010
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Daisuke Koizumi, Naohito Kohashi, Kazuhiro Tashiro, Takumi Kumatabara
  • Patent number: 7774034
    Abstract: A signal switching device including a plurality of transmission paths connected to an input path, the signal switching device outputting a signal from the input path through one of the transmission paths, including a first variable impedance unit connected to a first transmission path, the first variable impedance unit including a first section formed from a superconducting material, the first section being set to a non-superconducting state when the signal is to be output through a second transmission path, the first section including a portion of a predetermined length at an input end, the portion having an area of a cross section less than an area of a cross section of the first section at an output end.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: August 10, 2010
    Assignee: NTT DoCoMo, Inc.
    Inventors: Kunihiro Kawai, Daisuke Koizumi, Kei Satoh, Shoichi Narahashi, Tetsuo Hirota
  • Patent number: 7764147
    Abstract: A coplanar resonator which is comprised of a dielectric substrate, a center conductor formed in the surface thereof, and a ground conductor formed so as to surround the same center conductor, wherein the same center conductor is comprised of a main line conductor 31, formed by extension in a rectilinear shape, and auxiliary line conductors 32a and 32b bifurcating from at least one end of the same main line conductor, folding back and being extended on both sides of the main line conductor.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: July 27, 2010
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Kei Satoh, Shoichi Narahashi
  • Patent number: 7710222
    Abstract: A signal input/output line 101 is used for input and output of a signal. A first resonating part 102 is connected to the signal input/output line 101 at one end and is opened at the other end. A second resonating part 103 is connected to a ground conductor 105 at one end and is opened at the other end. A connecting line 104 has a predetermined length and is connected to a point of connection between the signal input/output line 101 and the first resonating part 102 at one end and is connected to a predetermined point on the second resonating part 103 at the other end.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: May 4, 2010
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Kei Satoh, Shoichi Narahashi
  • Publication number: 20090302876
    Abstract: A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.
    Type: Application
    Filed: January 23, 2009
    Publication date: December 10, 2009
    Applicant: FUJITSU MICROELECTRONICS LIMITED
    Inventors: Daisuke KOIZUMI, Naohito KOHASHI, Yuji AKASAKI
  • Patent number: 7564699
    Abstract: A planar circuit housing (300) for containing a planar circuit (120) is disclosed. The planar circuit housing (300) comprises a support portion (341) for supporting edges of the planar circuit (120), the support portion (341) being provided on at least one housing internal surface substantially perpendicular to the planar circuit substrate (120); an upper cavity (380) in the housing (300) above the planar circuit (120); and a lower cavity (382) in the housing (300) below the planar circuit (120), the lower cavity (382) having the same sizes as the upper cavity (380) in directions parallel with the planar circuit substrate (120).
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: July 21, 2009
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Kei Satoh, Shoichi Narahashi, Tatsuro Masamura
  • Patent number: 7518388
    Abstract: A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: April 14, 2009
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Kazuhiro Tashiro, Shigeyuki Maruyama, Daisuke Koizumi, Takumi Kumatabara, Keisuke Fukuda
  • Publication number: 20080299790
    Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
    Type: Application
    Filed: April 16, 2008
    Publication date: December 4, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Daisuke KOIZUMI, Shigeyuki MARUYAMA, Kazuhiro TASHIRO, Naoyuki WATANABE