Abstract: A rotary electric machine and a turbine system including a housing, and a hydrogen generator arranged into or on the housing. The hydrogen generator electrolytically generates hydrogen from water. The hydrogen generator supplies the hydrogen into the housing.

Abstract: A semiconductor apparatus includes: an insulating substrate including a circuit pattern on an upper surface side and a metal plate on a lower surface side; a semiconductor device joined to the circuit pattern via a conductive component; a case located to surround the insulating substrate; a sealing material sealing the semiconductor device and the insulating substrate in a section surrounded by the case; and a bonding agent bonding the case and the metal plate on a side face of the insulating substrate.

Abstract: An electromagnetic valve and a flow path device are provided, and the electromagnetic valve includes: a main body, a tube member and a connection flow path portion. A movable portion has a shaft portion, a valve body and a partitioning portion. The partitioning portion is located on the one side in the axial direction beyond the valve body and partitions the inner portion of the tube member into a first accommodation portion and a second accommodation portion. The second flow path portion is connected to the second accommodation portion in the opened state. The connection flow path portion is provided at the movable portion and connects the first flow path portion to the first accommodation portion in the closed state. The first accommodation portion is able to accommodate a fluid flowing through the first flow path portion and is disconnected from the second flow path portion in the closed state.

Abstract: A vehicle cooling system includes a circulation flow path section which has a first flow path section and a second flow path section, and a solenoid valve which can switch between an open state in which the first flow path section and the second flow path section are connected and a closed state in which the first flow path section and the second flow path section are blocked. The circulation flow path section includes a valve body accommodating section configured to include a first accommodating section and a second accommodating section which connects the first flow path section and the second flow path section in the open state, and a connection flow path section whose one end is connected to the first flow path section. The other end of the connection flow path section opens to the first accommodating section.

Abstract: The object of the present invention is to provide a semiconductor device capable of reducing the influence of gas generated from a resin to which a fire retardant is not added, and a power conversion device including the semiconductor device. The semiconductor device according to the present invention includes: a semiconductor element disposed on an insulating substrate; a case disposed around an outer edge of the insulating substrate, the case including an opening facing the semiconductor element; a sealing resin sealing the semiconductor element in the case; and a lid closing the opening of the case, wherein the sealing resin does not contain a fire retardant, the lid contains the fire retardant, and a space is provided between the sealing resin and the lid.

Abstract: A semiconductor device includes semiconductor chips fixed to a board, an insulating plate having a through-hole formed therein, a first lower conductor including a lower main body formed on the lower surface of the insulating plate and soldered to any of the semiconductor chips, and a lower protrusion portion that connects with the lower main body, and extends to the outside of the insulating plate, a second lower conductor formed on a lower surface of the insulating plate and soldered to any of the semiconductor chips, an upper conductor including an upper main body formed on the upper surface of the insulating plate, and an upper protrusion portion that connects with the upper main body and extends to the outside of the insulating plate, and a connection portion provided in the through-hole and connects the upper main body and the second lower conductor.

Abstract: A semiconductor device includes: an insulating substrate; an aluminum pattern made of a pure aluminum or alloy aluminum material and formed on the insulating substrate; a plating formed on a surface of the aluminum pattern; and a semiconductor element joined to the plating, wherein a thickness of the plating is 10 ?m or more.

Abstract: A semiconductor device according to the present invention includes a ceramic substrate, a plurality of circuit patterns arranged on a surface of the ceramic substrate, a semiconductor element arranged on an upper surface of at least one circuit pattern, and a sealing resin for sealing the ceramic substrate, the plurality of circuit patterns, and the semiconductor element, in which an undercut part is formed in opposed side surfaces of the circuit patterns adjacent to one another, the undercut part is configured such that an end of an upper surface of the circuit pattern protrudes outside the circuit pattern more than an end of a lower surface of the circuit pattern on the ceramic substrate, and the undercut part is also filled with the sealing resin.

Abstract: A semiconductor device includes semiconductor chips fixed to a board, an insulating plate having a through-hole formed therein, a first lower conductor including a lower main body formed on the lower surface of the insulating plate and soldered to any of the semiconductor chips, and a lower protrusion portion that connects with the lower main body, and extends to the outside of the insulating plate, a second lower conductor formed on a lower surface of the insulating plate and soldered to any of the semiconductor chips, an upper conductor including an upper main body formed on the upper surface of the insulating plate, and an upper protrusion portion that connects with the upper main body and extends to the outside of the insulating plate, and a connection portion provided in the through-hole and connects the upper main body and the second lower conductor.

Abstract: A relay substrate in which a circuit pattern and an external electrode are integrated on a insulating plate is used in the semiconductor device. Such configuration makes it possible to reduce a resistance in a current path while preventing the problems occurring when the external electrode is soldered on the semiconductor chip.

Abstract: A power module includes: a relay substrate including a first conductor layer provided on a front surface and a second conductor layer provided on a back surface; copper blocks provided in holes penetrating through the relay substrate in a thickness direction and connecting the first conductor layer to the second conductor layer; semiconductor devices wherein each semiconductor device includes a main electrode provided at a location facing an end face of the corresponding copper block and only one copper block is electrically connected to one main electrode; an insulating substrate connected to back-surfaces of the semiconductor devices via joining materials; and a sealer sealing the relay substrate, the copper blocks, and the semiconductor devices.

Abstract: A relay substrate in which a circuit pattern and an external electrode are integrated on a insulating plate is used in the semiconductor device. Such configuration makes it possible to reduce a resistance in a current path while preventing the problems occurring when the external electrode is soldered on the semiconductor chip.

Abstract: A semiconductor device includes: an insulating substrate; an aluminum pattern made of a pure aluminum or alloy aluminum material and formed on the insulating substrate; a plating formed on a surface of the aluminum pattern; and a semiconductor element joined to the plating, wherein a thickness of the plating is 10 ?m or more.

Abstract: According to one embodiment, a rotating electrical machine has a vibrating-element. The vibrating-element has spring bars and circular members which cover spring bars while a part is connected to spring bars. The spring bars are connected to first stator core connection portions, which are formed so as to be spaced out in a circumferential direction from each other at two locations on a side surface of the stator core. The stator frame is connected by the second stator core connection portions, which are formed by two locations which are different from the first stator core connection portions, of the stator core. The second stator core connection portions contain a position adjacent to a node portion of a circular mode of vibration of the stator core, in which antinodes and nodes of vibration alternately appear in the circumferential direction as the vibrating-element is attached to the stator core.

Abstract: A semiconductor device includes: a first heat spreader; a second heat spreader separated from the first heat spreader; a first semiconductor element on the first heat spreader and having a back face jointed to the first heat spreader; a second semiconductor element on the second heat spreader and having a back face jointed to the second heat spreader; a resin coating the first and second heat spreaders and the first and second semiconductor elements; and a reinforcing member provided across a region between the first and second heat spreaders in the resin, and having rigidity higher than rigidity of the resin.

Abstract: A semiconductor device according to the present invention includes a ceramic substrate, a plurality of circuit patterns arranged on a surface of the ceramic substrate, a semiconductor element arranged on an upper surface of at least one circuit pattern, and a sealing resin for sealing the ceramic substrate, the plurality of circuit patterns, and the semiconductor element, in which an undercut part is formed in opposed side surfaces of the circuit patterns adjacent to one another, the undercut part is configured such that an end of an upper surface of the circuit pattern protrudes outside the circuit pattern more than an end of a lower surface of the circuit pattern on the ceramic substrate, and the undercut part is also filled with the sealing resin.

Abstract: A semiconductor device includes: a first heat spreader; a second heat spreader separated from the first heat spreader; a first semiconductor element on the first heat spreader and having a back face jointed to the first heat spreader; a second semiconductor element on the second heat spreader and having a back face jointed to the second heat spreader; a resin coating the first and second heat spreaders and the first and second semiconductor elements; and a reinforcing member provided across a region between the first and second heat spreaders in the resin, and having rigidity higher than rigidity of the resin.

Abstract: According to one embodiment, a rotating electrical machine has a vibrating-element. The vibrating-element has spring bars and circular members which cover spring bars while a part is connected to spring bars. The spring bars are connected to first stator core connection portions, which are formed so as to be spaced out in a circumferential direction from each other at two locations on a side surface of the stator core. The stator frame is connected by the second stator core connection portions, which are formed by two locations which are different from the first stator core connection portions, of the stator core. The second stator core connection portions contain a position adjacent to a node portion of a circular mode of vibration of the stator core, in which antinodes and nodes of vibration alternately appear in the circumferential direction as the vibrating-element is attached to the stator core.

Abstract: A parking brake apparatus includes: an operating handle including an operating pushbutton; a base bracket including a ratchet plate having a ratchet; a brake cable for actuating a brake when the operating handle is pulled along a longitudinal direction of the base bracket; and a shaft retained in the base bracket and having a base end part fixed to the operating handle and a nose part connected to the brake cable. The shaft includes a seizing and releasing mechanism connected to the brake cable and having a seizing pawl for seizing and releasing the ratchet, and a releasing mechanism connected to the operating handle and having a release pawl for reorienting the seizing pawl seizing the ratchet through the operating pushbutton to release the seizing pawl from the ratchet.

Abstract: An output apparatus capable of receiving multi-level dot information of a first recording dot density, generating multi-level dot information of a second recording dot density, and transmitting the thus-generated second dot information in a visible way. The output apparatus comprises: a receiving device capable of receiving multi-level dot information of a first recording dot density; a generating device capable of generating multi-level interpolation dot information by applying a predetermined calculation to the thus-received multi-level dot information; and a dot density conversion device capable of generating multi-level dot information of a second, higher recording dot density from said interpolation dot information and the received multi-level dot information, whereby high density image data can be generated from low density image data.