Patents by Inventor Daisuke Suetsugu

Daisuke Suetsugu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411051
    Abstract: A chip resistor includes an insulating substrate, a resistance element, and an electrode. The resistance element includes Cr, Si, and N and is disposed on the insulating substrate. The electrode includes at least one refractory metal and is disposed on the resistance element. An atomic ratio of Si to Cr in the resistance element is greater than or equal to ? and less than or equal to 4 at least at a center of the resistance element in a thickness direction defined with respect to the resistance element. An atom percentage of N in the resistance element is lower than or equal to 50 atom % at least at the center of the resistance element in the thickness direction.
    Type: Application
    Filed: October 4, 2021
    Publication date: December 21, 2023
    Inventors: Daisuke SUETSUGU, Norimichi NOGUCHI, Tatsuya URAKAWA, Hiroki ODA, Daisuke UEYAMA
  • Patent number: 11765824
    Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: September 19, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Norimichi Noguchi, Masateru Mikami, Kenji Toyoshima, Hiroki Oda, Daisuke Suetsugu, Tatsuya Urakawa
  • Patent number: 11692958
    Abstract: A gas sensor device includes: a first electrode; a second electrode; a metal oxide layer that is disposed between the first electrode and the second electrode and is in contact with the first electrode and the second electrode; an interlayer insulating film that covers a part of the first electrode, a part of the second electrode, and a part of the metal oxide layer; and a hydrogen permeable film that allows only hydrogen to permeate, a local region that is in contact with the second electrode is provided inside the metal oxide layer, the local region having a higher oxygen deficiency than an oxygen deficiency of the other region in the metal oxide layer, an opening that exposes a gas contact portion which is a part of a main surface of the second electrode is provided in the interlayer insulating film, and the hydrogen permeable film is provided to cover at least the gas contact portion.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: July 4, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinya Suzuki, Kiyokazu Itoi, Daisuke Suetsugu, Norimichi Noguchi, Nobutoshi Takagi
  • Patent number: 11626218
    Abstract: The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 11, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masateru Mikami, Daisuke Suetsugu, Norimichi Noguchi
  • Patent number: 11504931
    Abstract: A powder supplier, which supplies a powder material to a pressure molding mechanism that continuously generates a molded body, including: a casing having an inlet to which the powder material is supplied and an outlet from which the powder material is discharged; one or a plurality of screws being disposed inside the casing and rotationally driven to transport the powder material in an axial direction; motors being disposed outside the casing and rotationally driving screws; and a regulator being disposed between the screws, and the outlet inside the casing, and regulating a flow of the powder material. The regulator has a rotation shaft perpendicular to the axial direction of the screws, and a width direction of the powder material discharged from the outlet, and being configured to rotate about the rotation shaft.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: November 22, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshiki Shimata, Yoshinori Shishida, Daisuke Suetsugu, Kazuto Fukuda, Toshiya Hiramatsu, Motoi Hatanaka
  • Patent number: 11280027
    Abstract: A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: March 22, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takahide Hirasaki, Daisuke Suetsugu, Takafumi Okuma
  • Publication number: 20220030707
    Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
    Type: Application
    Filed: June 24, 2021
    Publication date: January 27, 2022
    Inventors: NORIMICHI NOGUCHI, MASATERU MIKAMI, KENJI TOYOSHIMA, HIROKI ODA, DAISUKE SUETSUGU, TATSUYA URAKAWA
  • Publication number: 20220028586
    Abstract: The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.
    Type: Application
    Filed: June 22, 2021
    Publication date: January 27, 2022
    Inventors: MASATERU MIKAMI, DAISUKE SUETSUGU, NORIMICHI NOGUCHI
  • Publication number: 20220005680
    Abstract: A sputtering device includes: a vacuum chamber in which a target material and a substrate are disposable in a manner of facing each other; a DC power supply being electrically connectable to the target material; a gas supply source configured to introduce a film forming gas containing a nitrogen gas into the vacuum chamber; and a pulsing unit configured to pulse a current flowing from the DC power supply to the target material. The sputtering device forms a nitride thin film having a ternary or more composition containing nitrogen on the substrate by generating plasma in the vacuum chamber using a sintered alloy target material having a binary or more composition as the target material.
    Type: Application
    Filed: June 22, 2021
    Publication date: January 6, 2022
    Inventors: DAISUKE SUETSUGU, NORIMICHI NOGUCHI
  • Publication number: 20220003706
    Abstract: A gas sensor device includes: a first electrode; a second electrode; a metal oxide layer that is disposed between the first electrode and the second electrode and is in contact with the first electrode and the second electrode; an interlayer insulating film that covers a part of the first electrode, a part of the second electrode, and a part of the metal oxide layer; and a hydrogen permeable film that allows only hydrogen to permeate, a local region that is in contact with the second electrode is provided inside the metal oxide layer, the local region having a higher oxygen deficiency than an oxygen deficiency of the other region in the metal oxide layer, an opening that exposes a gas contact portion which is a part of a main surface of the second electrode is provided in the interlayer insulating film, and the hydrogen permeable film is provided to cover at least the gas contact portion.
    Type: Application
    Filed: June 22, 2021
    Publication date: January 6, 2022
    Inventors: SHINYA SUZUKI, KIYOKAZU ITOI, DAISUKE SUETSUGU, NORIMICHI NOGUCHI, NOBUTOSHI TAKAGI
  • Patent number: 11094515
    Abstract: A sputtering apparatus has a vacuum chamber capable of arranging a target material and a substrate therein so as to face each other, a DC power supply capable of electrically being connected to the target material, and a pulsing unit pulsing electric current flowing in the target material from the DC power supply, in which plasma is generated in the vacuum chamber to form a thin film on the substrate, including an ammeter measuring electric current flowing in the pulsing unit from the DC power supply, a power supply controller performing feedback control of the DC power supply so that a current value measured by the ammeter becomes a prescribed value and a pulse controller indicating a pulse cycle shifted from a control cycle of the DC power supply by the power supply controller to the pulsing unit.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 17, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Daisuke Suetsugu, Masaaki Tanabe, Akira Okuda, Yosimasa Takii
  • Patent number: 11021788
    Abstract: A sputtering method of forming a thin film by allowing a target material to react with a gas includes narrowing down film deposition conditions from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 1, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takafumi Okuma, Daisuke Suetsugu, Takahide Hirasaki
  • Publication number: 20200361168
    Abstract: A powder supplier, which supplies a powder material to a pressure molding mechanism that continuously generates a molded body, including: a casing having an inlet to which the powder material is supplied and an outlet from which the powder material is discharged; one or a plurality of screws being disposed inside the casing and rotationally driven to transport the powder material in an axial direction; motors being disposed outside the casing and rotationally driving screws; and a regulator being disposed between the screws, and the outlet inside the casing, and regulating a flow of the powder material. The regulator has a rotation shaft perpendicular to the axial direction of the screws, and a width direction of the powder material discharged from the outlet, and being configured to rotate about the rotation shaft.
    Type: Application
    Filed: March 26, 2020
    Publication date: November 19, 2020
    Inventors: YOSHIKI SHIMATA, YOSHINORI SHISHIDA, DAISUKE SUETSUGU, KAZUTO FUKUDA, TOSHIYA HIRAMATSU, MOTOI HATANAKA
  • Publication number: 20200255977
    Abstract: A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.
    Type: Application
    Filed: November 21, 2018
    Publication date: August 13, 2020
    Inventors: TAKAHIDE HIRASAKI, DAISUKE SUETSUGU, TAKAFUMI OKUMA
  • Publication number: 20190169738
    Abstract: To provide a sputtering method as a reactive sputtering method of forming a thin film by allowing a target material to react with a gas, in which film deposition conditions are narrowed down from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 6, 2019
    Inventors: TAKAFUMI OKUMA, DAISUKE SUETSUGU, TAKAHIDE HIRASAKI
  • Patent number: 10252339
    Abstract: To provide an apparatus and a method of producing fine particles capable of increasing evaporation efficiency of a material, increasing the production of fine particles and reducing costs by heating the inputted material by a gas heated by thermal plasma. A fine particle production apparatus includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles from a material feeding port into the vacuum chamber, electrodes arranged in the vacuum chamber for generating plasma and a collection device connected to the vacuum chamber and collecting fine particles, which produces the fine particles from the material by generating electric discharge inside the vacuum chamber, in which the collection device and the material feeding device are connected by piping, and a material heating and circulation device which heats the material by heat of a gas inside the chamber heated by the plasma through the piping is provided.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: April 9, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hisao Nagai, Takeshi Koiwasaki, Daisuke Suetsugu, Takafumi Okuma
  • Publication number: 20180174808
    Abstract: A sputtering apparatus has a vacuum chamber capable of arranging a target material and a substrate therein so as to face each other, a DC power supply capable of electrically being connected to the target material, and a pulsing unit pulsing electric current flowing in the target material from the DC power supply, in which plasma is generated in the vacuum chamber to form a thin film on the substrate, including an ammeter measuring electric current flowing in the pulsing unit from the DC power supply, a power supply controller performing feedback control of the DC power supply so that a current value measured by the ammeter becomes a prescribed value and a pulse controller indicating a pulse cycle shifted from a control cycle of the DC power supply by the power supply controller to the pulsing unit.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 21, 2018
    Inventors: DAISUKE SUETSUGU, MASAAKI TANABE, AKIRA OKUDA, YOSIMASA TAKII
  • Publication number: 20170136546
    Abstract: To provide an apparatus and a method of producing fine particles capable of increasing evaporation efficiency of a material, increasing the production of fine particles and reducing costs by heating the inputted material by a gas heated by thermal plasma. A fine particle production apparatus includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles from a material feeding port into the vacuum chamber, electrodes arranged in the vacuum chamber for generating plasma and a collection device connected to the vacuum chamber and collecting fine particles, which produces the fine particles from the material by generating electric discharge inside the vacuum chamber, in which the collection device and the material feeding device are connected by piping, and a material heating and circulation device which heats the material by heat of a gas inside the chamber heated by the plasma through the piping is provided.
    Type: Application
    Filed: August 30, 2016
    Publication date: May 18, 2017
    Inventors: HISAO NAGAI, TAKESHI KOIWASAKI, DAISUKE SUETSUGU, TAKAFUMI OKUMA
  • Patent number: 9045819
    Abstract: Deterioration of the degree of vacuum in a vacuum chamber is prevented while securing adequate cooling performance by gas cooling. A substrate 21 is provided in a vacuum, and the cooling body 1 is provided close to a film non-formation surface of the substrate 21. A thin film is formed by depositing a film forming material on a film formation surface of the substrate 21 while introducing a cooling gas into between the substrate 21 and the cooling body 1. At this time, a gas which reacts with the film forming material is introduced as the cooling gas.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: June 2, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kazuyoshi Honda, Yasuharu Shinokawa, Hiromasa Yagi, Satoshi Shibutani, Sadayuki Okazaki, Yuko Ogawa, Daisuke Suetsugu
  • Patent number: 8991217
    Abstract: Arnold (13) includes a recessed portion (21) for receiving a melt (2). The recessed portion (21) is constituted by an inner wall surface (29) for converting the melt (2) into a solidified portion when the inner wall surface (29) contacts the melt (2), and opens in a withdrawal direction (D1) of the solidified portion. A curved line formed by a first contour (23p) and a second contour (25p) has a cusp at a position of start points (43 and 45). The distance between the first contour (23p) and the second contour (25p) in a width direction (D2) increases continuously from an upstream side to a downstream side of the withdrawal direction (D1). The shape of the inner wall surface (29) of the recessed portion (21) is determined so that a cast rod (3) can be rotationally displaced clockwise or counterclockwise about an axis passing through a first end point (33) or a second end point (35) and perpendicular to a section of the mold 13.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: March 31, 2015
    Assignee: Panasonic Corporation
    Inventors: Yuma Kamiyama, Kazuyoshi Honda, Daisuke Suetsugu