Patents by Inventor Daisuke Suetsugu
Daisuke Suetsugu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240175764Abstract: A temperature sensor according to the present disclosure includes an alumina substrate, a planarization film, a first resistive portion, and at least one second resistive portion. The planarization film contains alumina as a main component thereof and is formed on the alumina substrate. The first resistive portion is formed on the planarization film. The at least one second resistive portion is formed on the planarization film and forms a bridge circuit along with the first resistive portion.Type: ApplicationFiled: March 28, 2022Publication date: May 30, 2024Inventors: Norimichi NOGUCHI, Daisuke SUETSUGU, Yuki OHYAMA, Kazuhiro KANDA, Yuji YASUOKA
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Publication number: 20230411051Abstract: A chip resistor includes an insulating substrate, a resistance element, and an electrode. The resistance element includes Cr, Si, and N and is disposed on the insulating substrate. The electrode includes at least one refractory metal and is disposed on the resistance element. An atomic ratio of Si to Cr in the resistance element is greater than or equal to ? and less than or equal to 4 at least at a center of the resistance element in a thickness direction defined with respect to the resistance element. An atom percentage of N in the resistance element is lower than or equal to 50 atom % at least at the center of the resistance element in the thickness direction.Type: ApplicationFiled: October 4, 2021Publication date: December 21, 2023Inventors: Daisuke SUETSUGU, Norimichi NOGUCHI, Tatsuya URAKAWA, Hiroki ODA, Daisuke UEYAMA
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Patent number: 11765824Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.Type: GrantFiled: June 24, 2021Date of Patent: September 19, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Norimichi Noguchi, Masateru Mikami, Kenji Toyoshima, Hiroki Oda, Daisuke Suetsugu, Tatsuya Urakawa
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Patent number: 11692958Abstract: A gas sensor device includes: a first electrode; a second electrode; a metal oxide layer that is disposed between the first electrode and the second electrode and is in contact with the first electrode and the second electrode; an interlayer insulating film that covers a part of the first electrode, a part of the second electrode, and a part of the metal oxide layer; and a hydrogen permeable film that allows only hydrogen to permeate, a local region that is in contact with the second electrode is provided inside the metal oxide layer, the local region having a higher oxygen deficiency than an oxygen deficiency of the other region in the metal oxide layer, an opening that exposes a gas contact portion which is a part of a main surface of the second electrode is provided in the interlayer insulating film, and the hydrogen permeable film is provided to cover at least the gas contact portion.Type: GrantFiled: June 22, 2021Date of Patent: July 4, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shinya Suzuki, Kiyokazu Itoi, Daisuke Suetsugu, Norimichi Noguchi, Nobutoshi Takagi
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Patent number: 11626218Abstract: The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.Type: GrantFiled: June 22, 2021Date of Patent: April 11, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masateru Mikami, Daisuke Suetsugu, Norimichi Noguchi
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Patent number: 11504931Abstract: A powder supplier, which supplies a powder material to a pressure molding mechanism that continuously generates a molded body, including: a casing having an inlet to which the powder material is supplied and an outlet from which the powder material is discharged; one or a plurality of screws being disposed inside the casing and rotationally driven to transport the powder material in an axial direction; motors being disposed outside the casing and rotationally driving screws; and a regulator being disposed between the screws, and the outlet inside the casing, and regulating a flow of the powder material. The regulator has a rotation shaft perpendicular to the axial direction of the screws, and a width direction of the powder material discharged from the outlet, and being configured to rotate about the rotation shaft.Type: GrantFiled: March 26, 2020Date of Patent: November 22, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoshiki Shimata, Yoshinori Shishida, Daisuke Suetsugu, Kazuto Fukuda, Toshiya Hiramatsu, Motoi Hatanaka
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Patent number: 11280027Abstract: A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.Type: GrantFiled: November 21, 2018Date of Patent: March 22, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takahide Hirasaki, Daisuke Suetsugu, Takafumi Okuma
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Publication number: 20220030707Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.Type: ApplicationFiled: June 24, 2021Publication date: January 27, 2022Inventors: NORIMICHI NOGUCHI, MASATERU MIKAMI, KENJI TOYOSHIMA, HIROKI ODA, DAISUKE SUETSUGU, TATSUYA URAKAWA
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Publication number: 20220028586Abstract: The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.Type: ApplicationFiled: June 22, 2021Publication date: January 27, 2022Inventors: MASATERU MIKAMI, DAISUKE SUETSUGU, NORIMICHI NOGUCHI
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Publication number: 20220003706Abstract: A gas sensor device includes: a first electrode; a second electrode; a metal oxide layer that is disposed between the first electrode and the second electrode and is in contact with the first electrode and the second electrode; an interlayer insulating film that covers a part of the first electrode, a part of the second electrode, and a part of the metal oxide layer; and a hydrogen permeable film that allows only hydrogen to permeate, a local region that is in contact with the second electrode is provided inside the metal oxide layer, the local region having a higher oxygen deficiency than an oxygen deficiency of the other region in the metal oxide layer, an opening that exposes a gas contact portion which is a part of a main surface of the second electrode is provided in the interlayer insulating film, and the hydrogen permeable film is provided to cover at least the gas contact portion.Type: ApplicationFiled: June 22, 2021Publication date: January 6, 2022Inventors: SHINYA SUZUKI, KIYOKAZU ITOI, DAISUKE SUETSUGU, NORIMICHI NOGUCHI, NOBUTOSHI TAKAGI
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Publication number: 20220005680Abstract: A sputtering device includes: a vacuum chamber in which a target material and a substrate are disposable in a manner of facing each other; a DC power supply being electrically connectable to the target material; a gas supply source configured to introduce a film forming gas containing a nitrogen gas into the vacuum chamber; and a pulsing unit configured to pulse a current flowing from the DC power supply to the target material. The sputtering device forms a nitride thin film having a ternary or more composition containing nitrogen on the substrate by generating plasma in the vacuum chamber using a sintered alloy target material having a binary or more composition as the target material.Type: ApplicationFiled: June 22, 2021Publication date: January 6, 2022Inventors: DAISUKE SUETSUGU, NORIMICHI NOGUCHI
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Patent number: 11094515Abstract: A sputtering apparatus has a vacuum chamber capable of arranging a target material and a substrate therein so as to face each other, a DC power supply capable of electrically being connected to the target material, and a pulsing unit pulsing electric current flowing in the target material from the DC power supply, in which plasma is generated in the vacuum chamber to form a thin film on the substrate, including an ammeter measuring electric current flowing in the pulsing unit from the DC power supply, a power supply controller performing feedback control of the DC power supply so that a current value measured by the ammeter becomes a prescribed value and a pulse controller indicating a pulse cycle shifted from a control cycle of the DC power supply by the power supply controller to the pulsing unit.Type: GrantFiled: December 6, 2017Date of Patent: August 17, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Daisuke Suetsugu, Masaaki Tanabe, Akira Okuda, Yosimasa Takii
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Patent number: 11021788Abstract: A sputtering method of forming a thin film by allowing a target material to react with a gas includes narrowing down film deposition conditions from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.Type: GrantFiled: November 29, 2018Date of Patent: June 1, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takafumi Okuma, Daisuke Suetsugu, Takahide Hirasaki
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Publication number: 20200361168Abstract: A powder supplier, which supplies a powder material to a pressure molding mechanism that continuously generates a molded body, including: a casing having an inlet to which the powder material is supplied and an outlet from which the powder material is discharged; one or a plurality of screws being disposed inside the casing and rotationally driven to transport the powder material in an axial direction; motors being disposed outside the casing and rotationally driving screws; and a regulator being disposed between the screws, and the outlet inside the casing, and regulating a flow of the powder material. The regulator has a rotation shaft perpendicular to the axial direction of the screws, and a width direction of the powder material discharged from the outlet, and being configured to rotate about the rotation shaft.Type: ApplicationFiled: March 26, 2020Publication date: November 19, 2020Inventors: YOSHIKI SHIMATA, YOSHINORI SHISHIDA, DAISUKE SUETSUGU, KAZUTO FUKUDA, TOSHIYA HIRAMATSU, MOTOI HATANAKA
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Publication number: 20200255977Abstract: A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.Type: ApplicationFiled: November 21, 2018Publication date: August 13, 2020Inventors: TAKAHIDE HIRASAKI, DAISUKE SUETSUGU, TAKAFUMI OKUMA
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Publication number: 20190169738Abstract: To provide a sputtering method as a reactive sputtering method of forming a thin film by allowing a target material to react with a gas, in which film deposition conditions are narrowed down from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.Type: ApplicationFiled: November 29, 2018Publication date: June 6, 2019Inventors: TAKAFUMI OKUMA, DAISUKE SUETSUGU, TAKAHIDE HIRASAKI
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Patent number: 10252339Abstract: To provide an apparatus and a method of producing fine particles capable of increasing evaporation efficiency of a material, increasing the production of fine particles and reducing costs by heating the inputted material by a gas heated by thermal plasma. A fine particle production apparatus includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles from a material feeding port into the vacuum chamber, electrodes arranged in the vacuum chamber for generating plasma and a collection device connected to the vacuum chamber and collecting fine particles, which produces the fine particles from the material by generating electric discharge inside the vacuum chamber, in which the collection device and the material feeding device are connected by piping, and a material heating and circulation device which heats the material by heat of a gas inside the chamber heated by the plasma through the piping is provided.Type: GrantFiled: August 30, 2016Date of Patent: April 9, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Hisao Nagai, Takeshi Koiwasaki, Daisuke Suetsugu, Takafumi Okuma
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Publication number: 20180174808Abstract: A sputtering apparatus has a vacuum chamber capable of arranging a target material and a substrate therein so as to face each other, a DC power supply capable of electrically being connected to the target material, and a pulsing unit pulsing electric current flowing in the target material from the DC power supply, in which plasma is generated in the vacuum chamber to form a thin film on the substrate, including an ammeter measuring electric current flowing in the pulsing unit from the DC power supply, a power supply controller performing feedback control of the DC power supply so that a current value measured by the ammeter becomes a prescribed value and a pulse controller indicating a pulse cycle shifted from a control cycle of the DC power supply by the power supply controller to the pulsing unit.Type: ApplicationFiled: December 6, 2017Publication date: June 21, 2018Inventors: DAISUKE SUETSUGU, MASAAKI TANABE, AKIRA OKUDA, YOSIMASA TAKII
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Publication number: 20170136546Abstract: To provide an apparatus and a method of producing fine particles capable of increasing evaporation efficiency of a material, increasing the production of fine particles and reducing costs by heating the inputted material by a gas heated by thermal plasma. A fine particle production apparatus includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles from a material feeding port into the vacuum chamber, electrodes arranged in the vacuum chamber for generating plasma and a collection device connected to the vacuum chamber and collecting fine particles, which produces the fine particles from the material by generating electric discharge inside the vacuum chamber, in which the collection device and the material feeding device are connected by piping, and a material heating and circulation device which heats the material by heat of a gas inside the chamber heated by the plasma through the piping is provided.Type: ApplicationFiled: August 30, 2016Publication date: May 18, 2017Inventors: HISAO NAGAI, TAKESHI KOIWASAKI, DAISUKE SUETSUGU, TAKAFUMI OKUMA
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Patent number: 9045819Abstract: Deterioration of the degree of vacuum in a vacuum chamber is prevented while securing adequate cooling performance by gas cooling. A substrate 21 is provided in a vacuum, and the cooling body 1 is provided close to a film non-formation surface of the substrate 21. A thin film is formed by depositing a film forming material on a film formation surface of the substrate 21 while introducing a cooling gas into between the substrate 21 and the cooling body 1. At this time, a gas which reacts with the film forming material is introduced as the cooling gas.Type: GrantFiled: December 10, 2009Date of Patent: June 2, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Kazuyoshi Honda, Yasuharu Shinokawa, Hiromasa Yagi, Satoshi Shibutani, Sadayuki Okazaki, Yuko Ogawa, Daisuke Suetsugu