Abstract: A laminate shaping method includes: a unit step repeatedly performed, the unit step including a step of forming a laminate shaped portion by laminating metal layers formed of weld beads, and a step of forming a processed side surface by cutting a shaped portion side surface facing a second direction intersecting a first direction, in which, in the step of forming the processed side surface, the shaped portion side surface is cut so that a receiving portion projecting in the second direction with respect to the processed side surface is formed at an uppermost layer of the laminate shaped portion in the first direction, and when the unit step is repeated, in the step of forming the laminate shaped portion, a new metal layer is laminated so as to overlap an upper surface of the receiving portion in the first direction.

Abstract: A cochlear implant insertion-assisting device includes a tubular member configured to hold a cochlear implant. The tubular member includes a cut extending in a longitudinal direction. The cochlear implant insertion-assisting device can selectively switch between a first state in which the cochlear implant is held and a second state in which the cochlear implant can be released.

Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

Abstract: A cochlear implant insertion-assisting device includes a tubular member configured to hold a cochlear implant. The tubular member includes a cut extending in a longitudinal direction. The cochlear implant insertion-assisting device can selectively switch between a first state in which the cochlear implant is held and a second state in which the cochlear implant can be released.

Abstract: A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer, forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.

Abstract: A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

Abstract: A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Abstract: A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

Abstract: A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

Abstract: A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.

Abstract: A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.

Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.

Abstract: A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.