Patents by Inventor Daisuke Yamauchi

Daisuke Yamauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110011626
    Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.
    Type: Application
    Filed: July 16, 2010
    Publication date: January 20, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke YAMAUCHI, Tetsuya OOSAWA, Mitsuru HONJO, Masami INOUE
  • Publication number: 20100277835
    Abstract: A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 ?m, and the distance between the adjacent wiring traces is set to not less than 8 ?m. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10? and not more than 50?.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mitsuru Honjo, Daisuke Yamauchi, Kei Nakamura
  • Publication number: 20100276183
    Abstract: An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 ?.
    Type: Application
    Filed: April 27, 2010
    Publication date: November 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tadao OOKAWA, Mitsuru HONJO, Daisuke YAMAUCHI
  • Publication number: 20040261123
    Abstract: A decoding apparatus is provided for decoding transport streams in which compressed video and audio data, a program association table (PAT), and program map tables (PMTs) are multiplexed. The apparatus comprises a specification unit, a search unit, and decoding circuits. The specification unit allows a user to specify a service ID and program IDs corresponding to user's desired video and audio data. The search unit searches service IDs described on the PAT and program IDs on the PMT for the service ID and the program IDs specified through the specification unit. Determinations for consistency are made between the service ID described on the PAT and the user's desired service ID and between the program IDs on the PMT and the user's desired program IDs. The decoding circuits decode compressed video and audio data corresponding to the service ID and the program IDs searched by the search unit.
    Type: Application
    Filed: June 9, 2004
    Publication date: December 23, 2004
    Inventors: Kazuya Yamada, Terumasa Kuramoto, Daisuke Yamauchi, Yasuo Masuda, Mutsumi Yamamoto