Patents by Inventor Dal-Hee LEE

Dal-Hee LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955471
    Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: April 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Ho Do, Dal-Hee Lee, Jin-Young Lim, Tae-Joong Song, Jong-Hoon Jung
  • Publication number: 20220345118
    Abstract: A master latch circuit, including a first p-type transistor, a first n-type transistor, and a second n-type transistor connected in series; a first node connected to the first p-type transistor and the first n-type transistor, and a NAND circuit configured to receive a signal of the first node and a clock signal and output a result of a NAND operation to a second node, wherein a gate of the first p-type transistor is connected to the second node.
    Type: Application
    Filed: July 11, 2022
    Publication date: October 27, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Gon KANG, Woo Kyu KIM, Tae Jun YOO, Dal Hee LEE
  • Patent number: 11387817
    Abstract: A master latch circuit, including a first p-type transistor, a first n-type transistor, and a second n-type transistor connected in series; a first node connected to the first p-type transistor and the first n-type transistor, and a NAND circuit configured to receive a signal of the first node and a clock signal and output a result of a NAND operation to a second node, wherein a gate of the first p-type transistor is connected to the second node.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: July 12, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Gon Kang, Woo Kyu Kim, Tae Jun Yoo, Dal Hee Lee
  • Patent number: 11335673
    Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: May 17, 2022
    Inventors: Jung-Ho Do, Dal-Hee Lee, Jin-Young Lim, Tae-Joong Song, Jong-Hoon Jung
  • Publication number: 20220149032
    Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
    Type: Application
    Filed: January 26, 2022
    Publication date: May 12, 2022
    Inventors: Jung-Ho Do, Dal-Hee Lee, Jin-Young Lim, Tae-Joong Song, Jong-Hoon Jung
  • Patent number: 11287474
    Abstract: A scan flip-flop includes an input unit and a flip-flop. The input unit is configured to select one signal from among a data input signal and a scan input signal to supply the selected one signal as an internal signal according to an operation mode. The flip-flop is configured to latch the internal signal according to a clock signal. The flip-flop includes a cross coupled structure that includes first and second tri-state inverters which share a first output node and face each other.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: March 29, 2022
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Ha-Young Kim, Sung-We Cho, Dal-Hee Lee, Jae-Ha Lee
  • Patent number: 11189639
    Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha-young Kim, Chang-beom Kim, Hyun-jeong Roh, Tae-joong Song, Dal-hee Lee, Sung-we Cho
  • Publication number: 20210328582
    Abstract: A master latch circuit, including a first p-type transistor, a first n-type transistor, and a second n-type transistor connected in series; a first node connected to the first p-type transistor and the first n-type transistor, and a NAND circuit configured to receive a signal of the first node and a clock signal and output a result of a NAND operation to a second node, wherein a gate of the first p-type transistor is connected to the second node.
    Type: Application
    Filed: March 29, 2021
    Publication date: October 21, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Gon KANG, Woo Kyu KIM, Tae Jun YOO, Dal Hee LEE
  • Patent number: 11101267
    Abstract: Provided is an integrated circuit including: at least one active region extending in a first row in a first direction; at least one active region extending in a second row in the first direction; and a multiple height cell including the at least one active region in the first row, the at least one active region in the second row, at least one gate line extending in a second direction crossing the first direction, wherein each of the at least one active region in the first row and the at least one active region in the second row is terminated by a diffusion break.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: August 24, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-young Lim, Jae-ho Park, Sang-hoon Baek, Hyeon-gyu You, Dal-hee Lee
  • Patent number: 11031385
    Abstract: An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin, a second metal pin, and a third metal pin on a first layer, the first metal pin and the second metal pin having a first minimum metal center-to-metal center pitch therebetween less than or equal to 80 nm, a fourth metal pin and a fifth metal pin at a second layer, the fourth metal pin and the fifth metal pin extending in a second direction, the second direction being perpendicular to the first direction, a first via between the first metal pin and the fourth metal pin, and a second via between the third metal pin and the fifth metal pin such that a first via center-to-via center space between the first via and the second via is greater than double the first minimum metal center-to-metal center pitch.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: June 8, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Woo Seo, Jin Tae Kim, Tae Joong Song, Hyoung-Suk Oh, Keun Ho Lee, Dal Hee Lee, Sung We Cho
  • Publication number: 20200235126
    Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha-young KIM, Chang-beom Kim, Hyun-jeong Roh, Tae-joong Song, Dal-hee Lee, Sung-we Cho
  • Patent number: 10651201
    Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: May 12, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha-young Kim, Chang-beom Kim, Hyun-jeong Roh, Tae-joong Song, Dal-hee Lee, Sung-we Cho
  • Publication number: 20200126968
    Abstract: An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin, a second metal pin, and a third metal pin on a first layer, the first metal pin and the second metal pin having a first minimum metal center-to-metal center pitch therebetween less than or equal to 80 nm, a fourth metal pin and a fifth metal pin at a second layer, the fourth metal pin and the fifth metal pin extending in a second direction, the second direction being perpendicular to the first direction, a first via between the first metal pin and the fourth metal pin, and a second via between the third metal pin and the fifth metal pin such that a first via center-to-via center space between the first via and the second via is greater than double the first minimum metal center-to-metal center pitch.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 23, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae-Woo SEO, Jin Tae KIM, Tae Joong SONG, Hyoung-Suk OH, Keun Ho LEE, Dal Hee LEE, Sung We CHO
  • Publication number: 20200051977
    Abstract: Provided is an integrated circuit including: at least one active region extending in a first row in a first direction; at least one active region extending in a second row in the first direction; and a multiple height cell including the at least one active region in the first row, the at least one active region in the second row, at least one gate line extending in a second direction crossing the first direction, wherein each of the at least one active region in the first row and the at least one active region in the second row is terminated by a diffusion break.
    Type: Application
    Filed: June 18, 2019
    Publication date: February 13, 2020
    Inventors: Jin-young Lim, Jae-ho Park, Sang-hoon Baek, Hyeon-gyu You, Dal-hee Lee
  • Patent number: 10553574
    Abstract: An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin, a second metal pin, and a third metal pin on a first layer, the first metal pin and the second metal pin having a first minimum metal center-to-metal center pitch therebetween less than or equal to 80 nm, a fourth metal pin and a fifth metal pin at a second layer, the fourth metal pin and the fifth metal pin extending in a second direction, the second direction being perpendicular to the first direction, a first via between the first metal pin and the fourth metal pin, and a second via between the third metal pin and the fifth metal pin such that a first via center-to-via center space between the first via and the second via is greater than double the first minimum metal center-to-metal center pitch.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: February 4, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Woo Seo, Jin Tae Kim, Tae Joong Song, Hyoung-Suk Oh, Keun Ho Lee, Dal Hee Lee, Sung We Cho
  • Publication number: 20190383875
    Abstract: A scan flip-flop includes an input unit and a flip-flop. The input unit is configured to select one signal from among a data input signal and a scan input signal to supply the selected one signal as an internal signal according to an operation mode. The flip-flop is configured to latch the internal signal according to a clock signal. The flip-flop includes a cross coupled structure that includes first and second tri-state inverters which share a first output node and face each other.
    Type: Application
    Filed: August 27, 2019
    Publication date: December 19, 2019
    Inventors: HA-YOUNG KIM, SUNG-WEE CHO, DAL-HEE LEE, JAE-HA LEE
  • Patent number: 10429443
    Abstract: A scan flip-flop includes an input unit and a flip-flop. The input unit is configured to select one signal from among a data input signal and a scan input signal to supply the selected one signal as an internal signal according to an operation mode. The flip-flop is configured to latch the internal signal according to a clock signal. The flip-flop includes a cross coupled structure that includes first and second tri-state inverters which share a first output node and face each other.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: October 1, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ha-Young Kim, Sung-Wee Cho, Dal-Hee Lee, Jae-Ha Lee
  • Publication number: 20190198491
    Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
    Type: Application
    Filed: November 15, 2018
    Publication date: June 27, 2019
    Inventors: Jung-Ho Do, Dal-Hee Lee, Jin-Young Lim, Tae-Joong Song, Jong-Hoon Jung
  • Patent number: 10192860
    Abstract: An engineering change order (ECO) base cell and an integrated circuit (IC) including the ECO base cell are provided. The IC includes a plurality of standard cells and at least one engineering change order (ECO) base cell. The ECO base cell has a layout that is generated based on a layout of a functional cell corresponding to a first circuit including a plurality of logic gates.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: January 29, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-woo Seo, Dal-hee Lee
  • Patent number: 10108772
    Abstract: Methods of generating an integrated circuit layout include forming a standard cell by providing a first active area adjacent to a first cell boundary line. The first active area is spaced apart from the first cell boundary line by a first distance. A second active area is provided adjacent to a second cell boundary line. The second cell boundary line opposes the first cell boundary line. The second active area is spaced apart from the second cell boundary line by a second distance. Fins are formed on the first and second active areas. The fins extend in a first direction and parallel to one another in a second direction substantially perpendicular to the first direction. The first cell boundary line is parallel to the fins. The first distance and the second distance remain constant when a number of the fins on the first and second active areas is changed.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-hoon Baek, Jae-woo Seo, Gi-young Yang, Dal-hee Lee, Sung-wee Cho