Patents by Inventor Dan Chilcott

Dan Chilcott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050098729
    Abstract: An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.
    Type: Application
    Filed: December 3, 2004
    Publication date: May 12, 2005
    Inventors: David Lambert, Han-Sheng Lee, Dan Chilcott, Hamid Borzabadi, Qin Jiang, James Logsdon
  • Publication number: 20050101047
    Abstract: A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.
    Type: Application
    Filed: December 13, 2004
    Publication date: May 12, 2005
    Inventors: John Freeman, William Baney, Timothy Betzner, Dan Chilcott, John Christenson, Timothy Vas, George Queen, Stephen Long
  • Publication number: 20050064619
    Abstract: A process using integrated sensor technology in which a micromachined sensing element and signal processing circuit are combined on a single semiconductor substrate to form, for example, an infrared sensor. The process is based on modifying a CMOS process to produce an improved layered micromachined member, such as a diaphragm, after the circuit fabrication process is completed. The process generally entails forming a circuit device on a substrate by processing steps that include forming multiple dielectric layers and at least one conductive layer on the substrate. The dielectric layers comprise an oxide layer on a surface of the substrate and at least two dielectric layers that are in tension, with the conductive layer being located between the two dielectric layers. The surface of the substrate is then dry etched to form a cavity and delineate the diaphragm and a frame surrounding the diaphragm.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 24, 2005
    Inventors: Abhijeet Chavan, James Logsdon, Dan Chilcott, John Christenson, Robert Speck
  • Publication number: 20050017175
    Abstract: An optical sensor package with a substrate that supports a membrane carrying an optical sensor and through which radiation passes to impinge the sensor. The substrate has a first surface in which a cavity is defined, a second surface opposite the first surface, and a wall between the cavity and the second surface. The optical sensor is supported on the membrane, which is bonded to the substrate and spans the cavity in the substrate. A window is defined at the second surface of the substrate for enabling infrared radiation to pass through the wall of the substrate to the optical sensor.
    Type: Application
    Filed: June 29, 2004
    Publication date: January 27, 2005
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Han-Sheng Lee, Dan Chilcott, James Logsdon
  • Publication number: 20050016576
    Abstract: A thermocouple structure capable of providing a more compact thermopile-based thermal sensor. The thermocouple structure has a stacked configuration that includes a plurality of first conductors on a surface, a dielectric layer on each of the first conductors, and a plurality of second conductors on the dielectric layer and formed of a different material than the first conductors. Each first conductor has first and second ends, and each second conductor has a first end overlying and contacting the first end of one of the first conductors, and a second end overlying but separated from the second end of the first conductor by the dielectric layer. A plurality of third conductors electrically interconnect one of the second ends of the second conductors with one of the second ends of the first conductors. Each third conductors is thicker than the second conductors to promote the robustness of the connection.
    Type: Application
    Filed: June 29, 2004
    Publication date: January 27, 2005
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Qin Jiang, Han Lee, James Logsdon, Dan Chilcott, David Lambert, Shih-Chia Chang