Patents by Inventor Dana Gronbeck
Dana Gronbeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8373241Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.Type: GrantFiled: October 20, 2009Date of Patent: February 12, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
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Publication number: 20100297539Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.Type: ApplicationFiled: October 20, 2009Publication date: November 25, 2010Applicant: ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C.Inventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
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Patent number: 7723850Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.Type: GrantFiled: August 13, 2007Date of Patent: May 25, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
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Patent number: 7605439Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.Type: GrantFiled: August 29, 2006Date of Patent: October 20, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
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Patent number: 7582412Abstract: Multilayer photoresist systems are provided. In particular aspects, the invention relates to underlayer composition for an overcoated photoresist, particularly an overcoated silicon-containing photoresist. Preferred underlayer compositions comprise one or more resins or other components that impart etch-resistant and antireflective properties, such as one or more resins that contain phenyl or other etch-resistant groups and anthracene or other moieties that are effective anti-reflective chromophores for photoresist exposure radiation.Type: GrantFiled: November 20, 2003Date of Patent: September 1, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: James F. Cameron, Dana A. Gronbeck, George G. Barclay
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Publication number: 20080038518Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.Type: ApplicationFiled: August 13, 2007Publication date: February 14, 2008Applicant: Shipley Company, L.L.C.Inventors: Michael Gallagher, Dana Gronbeck, Timothy Adams, Jeffrey Calvert
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Patent number: 7256127Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.Type: GrantFiled: September 13, 2003Date of Patent: August 14, 2007Assignee: Shipley Company, L.L.C.Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
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Publication number: 20070057253Abstract: The invention includes new organic-containing compositions that can finction as. an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.Type: ApplicationFiled: August 29, 2006Publication date: March 15, 2007Applicant: Rohm and Haas Electronic Materials LLCInventors: Dana Gronbeck, Amy Kwok, Chi Truong, Michael Gallagher, Anthony Zampini
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Publication number: 20060204742Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.Type: ApplicationFiled: March 23, 2006Publication date: September 14, 2006Applicant: Shipley Company, L.L.C.Inventors: Dana Gronbeck, Michael Gallagher, Jeffrey Calvert, Gregory Prokopowicz, Timothy Adams
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Patent number: 7018678Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.Type: GrantFiled: June 3, 2003Date of Patent: March 28, 2006Assignee: Shipley Company, L.L.C.Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams
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Publication number: 20050211978Abstract: Disclosed herein is an electric field programmable film comprising a polymer bonded to an electroactive moiety. Disclosed herein too is a method of manufacturing an electric field programmable film comprising depositing upon a substrate, a composition comprising a polymer and an electroactive moiety that is bonded to the polymer. Disclosed herein too is a data processing machine comprising a processor for executing an instruction; and a memory device comprising an electric field programmable film, wherein the electric field programmable film comprises a polymer bonded to an electroactive moiety, and further wherein the memory device is in electrical and/or optical communication with the processor.Type: ApplicationFiled: March 22, 2005Publication date: September 29, 2005Inventors: Lujia Bu, Emine Cagin, Chandra Cutler, Dana Gronbeck, Charles Szmanda
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Publication number: 20050026077Abstract: Disclosed are photoimageable compositions containing silsesquioxane binder polymers and photoactive compounds, methods of forming relief images using such compositions and methods of manufacturing electronic devices using such compositions. Such compositions are useful as photoresists and in the manufacture of optoelectronic devices.Type: ApplicationFiled: August 23, 2004Publication date: February 3, 2005Applicant: Shipley Company, L.L.C.Inventors: Dana Gronbeck, George Barclay, Leo Linehan, Kao Xiong, Subbareddy Kanagasabapathy
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Publication number: 20040253535Abstract: Multilayer photoresist systems are provided. In particular aspects, the invention relates to underlayer composition for an overcoated photoresist, particularly an overcoated silicon-containing photoresist. Preferred underlayer compositions comprise one or more resins or other components that impart etch-resistant and antireflective properties, such as one or more resins that contain phenyl or other etch-resistant groups and anthracene or other moieties that are effective anti-reflective chromophores for photoresist exposure radiation.Type: ApplicationFiled: November 20, 2003Publication date: December 16, 2004Applicant: Shipley Company, L.L.C.Inventors: James F. Cameron, Dana A. Gronbeck, George G. Barclay
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Patent number: 6803171Abstract: Disclosed are photoimageable compositions containing silsesquioxane binder polymers and photoactive compounds, methods of forming relief images using such compositions and methods of manufacturing electronic devices using such compositions. Such compositions are useful as photoresists and in the manufacture of optoelectronic devices.Type: GrantFiled: May 8, 2002Date of Patent: October 12, 2004Assignee: Shipley Company L.L.C.Inventors: Dana A. Gronbeck, George G. Barclay, Leo L. Linehan, Kao Xiong, Subbareddy Kanagasabapathy
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Patent number: 6773872Abstract: The present invention provides polymers which are substantially or completely free of inorganic contaminants and the use of such polymers as a resin component for photoresist compositions, particularly chemically-amplified positive-acting resists. Polymers of the invention also are suitable for use as a resin component for antireflective coating compositions (ARCs). More particularly, the invention provides methods for reducing such contaminants in polymerization initiators, particularly free radical initiators.Type: GrantFiled: December 27, 2001Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: Dana A. Gronbeck, Suzanne Coley, Chi Q. Truong, Ashish Pandya
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Publication number: 20040137728Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.Type: ApplicationFiled: September 13, 2003Publication date: July 15, 2004Applicant: Shipley Company, L.L.C.Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
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Publication number: 20040130032Abstract: A method for manufacturing electronic devices using multiple layers of pre-porous dielectric materials that are made porous subsequent to etching and metal filling of apertures is provided. The pre-porous layers may be made porous sequentially or during a single processing step. Such pre-porous dielectric layers are selected not only to provide low dielectric constants after being made porous, but also to provide a difference in etch rates. Structures having such multiple layers of pre-porous dielectric layers are also provided.Type: ApplicationFiled: September 24, 2003Publication date: July 8, 2004Applicant: Shipley Company, L.L.C.Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Timothy G. Adams
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Publication number: 20040109950Abstract: Organic polysilica materials containing one or more silicon-containing cross-linking agents having improved modulus and low dielectric constants and methods of preparing such materials are provided. These materials are useful in the manufacture of devices, such as electronic or optoelectronic devices, requiring low dielectric constant materials having good mechanical properties.Type: ApplicationFiled: September 13, 2003Publication date: June 10, 2004Applicant: Shipley Company, L.L.C.Inventors: Timothy G. Adams, Gregory P. Prokopowicz, Dana A. Gronbeck, Michael K. Gallagher
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Publication number: 20040052948Abstract: Treatment procedures for organic polysilica layers are provided that improve the adhesion of layers of material that are subsequently applied to the treated organic polysilica layers. In particular, layers of organic polymeric material have improved adhesion to such treated organic polysilica layers. These treatment procedures are particularly useful in the manufacture of electronic devices, such as integrated circuits, wherein the organic polysilica layers are used as dielectric materials, cap layers, etch stops and the like.Type: ApplicationFiled: June 3, 2003Publication date: March 18, 2004Applicant: Shipley Company, L.L.C.Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Christopher P. Sullivan
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Publication number: 20040033700Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.Type: ApplicationFiled: June 3, 2003Publication date: February 19, 2004Applicant: Shipley Company, L.L.C.Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams