Patents by Inventor Dandan ZHANG
Dandan ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200091692Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.Type: ApplicationFiled: November 18, 2019Publication date: March 19, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Publication number: 20200080944Abstract: An image acquisition system includes a feeding unit supplying a product, a product pickup platform onto which the product is supplied by the feeding unit, and a camera capturing an image of the product on the product pickup platform. The camera identifies a position and an angle of the product based on the image. The image acquisition system includes a robot gripping the product from the product pickup platform based on the position and the angle identified by the camera and an image acquisition platform onto which the product is placed by the robot. An imaging microscope of the image acquisition system captures an image of a surface of the product facing upwards on the image acquisition platform and a computer stores the image of the surface of the product captured by the imaging microscope.Type: ApplicationFiled: September 11, 2019Publication date: March 12, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity CorporationInventors: Hongtao Liu, Dandan Zhang, Roberto Francisco-Yi Lu, Changjun Wang, Lei Zhou, Zongjie Tao
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Publication number: 20200081429Abstract: A terminal insertion quality monitoring system includes an acceleration sensor disposed on a gripper of a terminal insertion equipment and configured to detect a dynamic acceleration of the gripper while using the gripper to insert a terminal into a housing, a control parameter acquisition device configured to acquire a plurality of control parameters of the terminal insertion equipment while inserting the terminal into the housing, and an artificial intelligence system adapted to classify the detected dynamic acceleration and the acquired control parameters into a plurality of different insertion modes by analyzing and calculating the detected dynamic acceleration and the acquired control parameters. The different insertion modes have a plurality of different grades of terminal insertion quality.Type: ApplicationFiled: September 12, 2019Publication date: March 12, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity CorporationInventors: Hongtao Liu, Dandan Zhang, Roberto Francisco-Yi Lu, Zongjie Tao, Changjun Wang, Lei Zhou, Lvhai Hu
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Publication number: 20200075210Abstract: A magnetic adsorption device includes an electromagnet, a pickup member made of a magnetizable material and disposed in a magnetic field of the electromagnet, and a magnetic shield sleeve sleeved on the pickup member and movable back and forth with respect to the pickup member. The pickup member is adapted to adsorb an electronic device by a magnetic force. A length of a portion of the pickup member exposed from the magnetic shield sleeve is adjustable by moving the magnetic shield sleeve to adjust the magnetic force of the pickup member.Type: ApplicationFiled: August 29, 2019Publication date: March 5, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity CorporationInventors: Chun Wei Huang, Zongjie Tao, Lvhai Hu, Dandan Zhang, Roberto Francisco-Yi Lu
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Publication number: 20200072602Abstract: A concentricity detection system is adapted to detect a concentricity of an annular component. The concentricity detection system includes a support base having a recess on a top surface, a transparent plate received and positioned in the recess, a vision detection device located above the support base and facing the transparent plate, and a backlight source located below the support base and facing the transparent plate. The annular component is disposed in the recess of the support base and supported on a top surface of the transparent plate. The vision detection device is configured to detect the concentricity of the annular component supported on the transparent plate. A through hole is formed in a bottom portion of the recess and a light from the backlight source passes through the support base via the through hole and the transparent plate to provide backlighting for the annular component.Type: ApplicationFiled: August 29, 2019Publication date: March 5, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity CorporationInventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu
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Publication number: 20200052451Abstract: A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.Type: ApplicationFiled: August 6, 2019Publication date: February 13, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity CorporationInventors: Changjun Wang, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Yun Liu, Fengchun Xie
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Publication number: 20200009783Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.Type: ApplicationFiled: September 23, 2019Publication date: January 9, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd., Measurement Specialities (Chengdu) Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying
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Publication number: 20200015359Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.Type: ApplicationFiled: September 16, 2019Publication date: January 9, 2020Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Patent number: 10512172Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.Type: GrantFiled: October 27, 2016Date of Patent: December 17, 2019Assignees: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd., TE Connectivity Germany GmbHInventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
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Publication number: 20190358722Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.Type: ApplicationFiled: August 6, 2019Publication date: November 28, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
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Publication number: 20190337736Abstract: A system for feeding a diaphragm comprises a diaphragm separating device adapted to separate a single diaphragm from a stack of diaphragms and a visual device adapted to identify the single diaphragm and a position of the single diaphragm separated from the stack.Type: ApplicationFiled: July 16, 2019Publication date: November 7, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (China) Ltd., Innogetic Technology Co., Ltd.Inventors: Yingcong Deng, Ziqing Liao, Ke Ning, Dandan Zhang, Lvhai Hu, Kok Wai Wong
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Publication number: 20190337738Abstract: A system for feeding a diaphragm includes a diaphragm separating device adapted to separate a diaphragm from a stack of diaphragms, a first visual device adapted to identify the diaphragm separated from the stack of diaphragms and a position of the diaphragm, a robot adapted to pick up the diaphragm separated from the stack of diaphragms under guidance of the first visual device, and a second visual device adapted to check whether the diaphragm picked up by the robot is a single diaphragm.Type: ApplicationFiled: July 16, 2019Publication date: November 7, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (China) Ltd., Innogetic Technology Co., Ltd.Inventors: Yingcong Deng, Ziqing Liao, Ke Ning, Dandan Zhang, Lvhai Hu, Kok Wai Wong
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Publication number: 20190321833Abstract: A separation device, comprising: a third-stage cyclone housing, a separating unit, and a granule recycle and regeneration unit, wherein, the separating unit is disposed inside the third-stage cyclone housing and comprises: a cyclone separator and a moving bed coupled to each other; the granule recycle and regeneration unit comprises: a riser, a spouted bed regenerator, and a regeneration pipe connecting the spouted bed regenerator with the moving bed; the spouted bed regenerator has upper and lower ends opposing to each other, wherein, the upper end of the spouted bed regenerator is provided with a sleeve which opens downwardly, the sleeve divides an interior of the spouted bed regenerator into a fountain area and an annular gap area, and a regenerating gas outlet which is in communication with the annular gap area is provided on a side wall of the spouted bed regenerator.Type: ApplicationFiled: August 6, 2018Publication date: October 24, 2019Inventors: Chunxi Lu, Sihong Gao, Yiping Fan, Dandan Zhang, Min Dai, Lijun Zhou
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Patent number: 10378879Abstract: A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. The motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thus, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without debugging online, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.Type: GrantFiled: October 31, 2017Date of Patent: August 13, 2019Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Qinglong Zeng
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Publication number: 20190243219Abstract: An imaging apparatus comprises an imaging device configured to capture an image of an object, a display device configured to display the image captured by the imaging device, a base having a support rod extending in a vertical direction, and a mechanical arm mechanism mounted on the support rod. The mechanical arm mechanism has a plurality of motion degrees of freedom. The display device or the imaging device is connected to an end arm of the mechanical arm mechanism.Type: ApplicationFiled: February 8, 2019Publication date: August 8, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity CorporationInventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Yun Liu
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Patent number: 10363581Abstract: An automatic distributor is disclosed. The automatic distributor comprises a base, a storage device mounted on the base to store a plurality of components with different shapes thereon, a recognition device configured to recognize the components stored on the storage device, and a pickup device configured to pick up the components based on a recognition result of the recognition device.Type: GrantFiled: November 14, 2016Date of Patent: July 30, 2019Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., TE Connectivity Corporation, Zhuhai Yingzhi Tech Co. Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, Roberto Francisco-Yi Lu, George Dubniczki
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Patent number: 10352687Abstract: An online thickness detection platform having a first laser sensor and a second laser sensor that detect a thickness of a product passing between the first arm and the second arm of a C-type frame on which the first laser sensor and a second laser sensor, respectively are adjustably mounted. The first laser sensor and the second laser sensor do not contact the product during detecting the thickness of the product. Because the thickness of the product is detected online, the thickness of the product is monitored in real-time. When the thickness of the product exceeds or falls below an allowed value range, production of the product is stopped, thereby avoiding producing a large number of unqualified products with a thickness out of the allowed value range and waste is prevented.Type: GrantFiled: October 31, 2017Date of Patent: July 16, 2019Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Qinglong Zeng
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Patent number: 10350717Abstract: An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.Type: GrantFiled: November 14, 2016Date of Patent: July 16, 2019Assignees: TE Connectivity Corporation, Tyco Electronics (Dongguan) Co. Ltd., Zhuhai Yingzhi Tech Co. Ltd., Tyco Electronics (Shanghai) Co. Ltd.Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, George Dubniczki
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Publication number: 20190198205Abstract: A calibration system adapted to calibrate a resistance of an electrical device having a lead wire comprises a resistance detector adapted to detect the resistance of the electrical device, a first container containing an etching solution adapted to etch the lead wire, and a heater configured to heat the electrical device. If a first resistance of the electrical device detected by the resistance detector at a first temperature is within a first predetermined range, the electrical device is heated with the heater to a second temperature higher than the first temperature. A second resistance of the electrical device is detected by the resistance detector at the second temperature. If the second resistance is beyond a second predetermined range, the lead wire is etched by the etching solution to adjust the resistance of the electrical device until the second resistance at the second temperature is within the second predetermined range.Type: ApplicationFiled: December 26, 2018Publication date: June 27, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Kunshan League Automechanism Co., Ltd.Inventors: Fengchun Xie, Yingcong Deng, Dandan Zhang, Lvhai Hu, Yun Liu, Roberto Francisco-Yi Lu, Haidong Wu, Hui Xiao
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Publication number: 20190187070Abstract: A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.Type: ApplicationFiled: February 22, 2019Publication date: June 20, 2019Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Ltd., TE Connectivity CorporationInventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Hongzhou Shen, Jian Zeng