Patents by Inventor Dang CHENG

Dang CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method of laser sintering dies and dies sintered by laser sintering
    Publication number: 20030203209
    Abstract: A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.
    Type: Application
    Filed: May 21, 2003
    Publication date: October 30, 2003
    Applicant: Chipbond Technology Corporation
    Inventors: Lu-Chen Hwan, Dang-Cheng Yiu
  • System and method of laser sintering dies and dies sintered by laser sintering
    Patent number: 6602762
    Abstract: A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: August 5, 2003
    Assignee: Chipbond Technology Corporation
    Inventors: Lu-Chen Hwan, Dang-Cheng Yiu
  • System and method of laser sintering dies and dies sintered by laser sintering
    Publication number: 20030008529
    Abstract: A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.
    Type: Application
    Filed: March 25, 2002
    Publication date: January 9, 2003
    Applicant: Chipbond Technology Corporation
    Inventors: Lu-Chen Hwan, Dang-Cheng Yiu