Abstract: Systems and methods support a server rack mechanically and gather sensor data from the server rack. For instance, the system may include an apparatus having a frame that is configured to add stiffening to a server rack. On the frame may be disposed various sensors and a computing system to measure stress and strain of the server rack as well as any other appropriate characteristic. The frame may include struts having strain gauges therein, where the strain gauges provide a measurement of stress or strain. Various sensor data may be transmitted from the apparatus to a component outside of the apparatus, such as a data center monitoring application.

Abstract: A mounting width conversion bracket system. The mounting width conversion bracket system includes a left rail adapter assembly, the left rail adapter assembly having a width designed to fill a left portion of a gap between a wider width server rack and a standard width information handling system; and, a right rail adapter assembly, the right rail adapter assembly having a width designed to fill a right portion of the gap between the wider width server rack and the standard width information handling system.

Abstract: A cooling liquid distribution system for an immersion cooled server type information handling system. The cooling liquid distribution system includes an information handling system chassis and a top panel portion, the top panel portion comprising a top panel top wall and a top panel bottom component, the top panel top wall being configured to be hermetically sealed to the information handling system chassis when the top panel portion is installed on the information handling system chassis, the top panel top wall and the top panel bottom component being hermetically sealed along edges of the top panel bottom component to provide a liquid distribution chamber, the top panel bottom component defining a plurality of cold liquid outlets, the plurality of cold liquid outlets being positioned to direct cooling liquid flow across a top of an interior of an information handling system chassis of the immersion cooled server type information handling system.

Abstract: A power delivery system, including: a computing module having: a top surface including a first contact pad; a rail system including a first rail, wherein the first rail includes: a first end opposite to a second end; a first slot extending between the first end and the second end of the first rail, the first slot including a first surface positioned opposite to a second surface, the first surface of the first rail including a first contact finger; wherein, when the computing module is coupled to the rail system: the top surface of the computing module contacts the first surface of the first slot such that the first contact pad of the computing module contacts the first contact finger of the first rail to transfer power from a first power cable through the first contact finger to the first contact pad of the computing module.

Abstract: An information technology equipment enclosure comprises a plurality of IT components, cold plates disposed over at least two of the IT components, and a cooling fluid manifold disposed within the IT equipment enclosure. The coolant liquid manifold has multiple input connectors and multiple output connectors. Each of the cold plates are coupled to the cooling fluid manifold using a coolant line attached to one of the input connectors and a coolant line attached to one of the output connectors. An input cooling liquid line couples the coolant liquid manifold to an output of an external liquid cooling system, and an output liquid line couples the coolant liquid manifold to an input of the external liquid cooling system. The coolant liquid manifold is configured to receive cooling fluid from the external liquid cooling system and to distribute the cooling fluid to all of the cold plates via the input connectors.

Abstract: In one or more embodiments, one or more systems may comprise a system for leveraging a strain relief connector in a board connector or providing electrical power to a printed circuit board (PCB) retained in the board connector. A surface of the PCB is formed with a contact pad and a via is connected to the contact pad. The PCB is positioned in a first slot in the board connector and an electrically conductive bracket is positioned in a second slot in a strain relief connector. A bolt is advanced in a threaded passage to secure the PCB and the electrically conductive bracket in the board connector, wherein the electrically conductive bracket, the bolt and the contact pad form an electrical path from the electrical connector to the via in the PCB.

Abstract: A power delivery system, including: a computing module having: a top surface including a first contact pad; a rail system including a first rail, wherein the first rail includes: a first end opposite to a second end; a first slot extending between the first end and the second end of the first rail, the first slot including a first surface positioned opposite to a second surface, the first surface of the first rail including a first contact finger; wherein, when the computing module is coupled to the rail system: the top surface of the computing module contacts the first surface of the first slot such that the first contact pad of the computing module contacts the first contact finger of the first rail to transfer power from a first power cable through the first contact finger to the first contact pad of the computing module.

Abstract: A power interface component for a server type information handling system. The power interface component for a server type information handling system includes a power adapter structure, the power adapter structure converting a power supply based server type information handling system to function with a rack configured with a busbar power scheme, a portion of the power adapter structure being shaped to fit within a power supply unit bay of the server type information handling system.

Abstract: An open compute project mounting system. The open compute project mourning system includes an OCP mounting bay, the OCP mounting bay defining a plurality of guide slots; a first OCP card module, the first OCP card module being positioned within the OCP mounting bay via a first pair of the plurality of guide slots; and, a second OCP card module, the second OCP card module being positioned within the OCP mounting bay via a second pair of the plurality of guide slots.

Abstract: A floating open compute project retention system. The floating open compute project retention system includes a floating open compute project component guide device and a floating open compute project component retention device, the floating open compute project component retention device providing access to the floating open compute project component guide device when in an open position and fixedly mounting a floating open compute project receiving assembly within an open compute project mounting bay when in a closed position.

Abstract: Methods, systems, and devices for providing computer-implemented services are disclosed. To provide the computer-implemented services, hardware components that generate heat may be used. To manage the heat generated by the hardware components, a heat sink assembly may be used. The heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. By accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.

Abstract: Methods, systems, and devices for providing computer-implemented services are disclosed. To provide the computer-implemented services, hardware components that generate heat may be used. To manage the heat generated by the hardware components, a heat sink assembly may be used. The heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. By accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.

Abstract: A rotor bearing system configured to operatively couple a progressing cavity machine to an external device can comprise a housing including an inner surface defining a first bore extending through the housing along a central axis, a first bearing arranged on the inner surface, and a shaft member including an outer surface extending between a proximal portion and a distal portion of the shaft member and a second bearing arranged on the outer surface, the second bearing the second bearing configured to contact the first bearing to limit eccentric motion of the driveshaft of the external device and the rotor head of the progressing cavity machine relative to a stator of the progressing cavity machine during rotation of the rotor head, the shaft member, and the driveshaft.

Abstract: In one embodiment, an information technology (IT) equipment enclosure comprises a first portion of a chassis configured with one or more compute devices fixedly mounted to the chassis and a second portion of the chassis configured to receive a removable storage tray module, the storage tray module configured with one or more storage devices and one or more cooling devices. The removable storage tray module comprising a handle that is pivotable between a locked position and an unlocked position. The handle comprises a recessed portion that is configured to route cables to the storage devices when the handle is in the locked position. The handle may engage a sidewall of the chassis when in the locked position. The cooling devices are selected based upon the one or more storage devices on the storage tray module. The cooling devices may be fans.

Abstract: Systems provide a chassis that support interchangeable hardware accelerator baseboards. The geometry of a first accelerator baseboard tray corresponds to the geometry of a first accelerator baseboard. The geometry of a second accelerator baseboard tray corresponds to the geometry of a second accelerator baseboard. A chassis incudes an accelerator baseboard compartment that includes a plurality of structures mounted on its base, where these structures receive corresponding structures of the first tray and that also receive corresponding structures of the second tray. Installation of the first tray on the structures mounted on the base of the compartment and installation of the first accelerator baseboard on the first tray aligns the first accelerator baseboard within the compartment. Installation of the second tray on the structures mounted on the base of the compartment and installation of the second accelerator baseboard on the second tray aligns the second accelerator baseboard within the compartment.

Abstract: An information technology equipment enclosure comprises a plurality of IT components with cold plates coupled to the IT components. A cooling fluid manifold is disposed within the IT equipment enclosure, wherein each of the cold plates are coupled to the cooling fluid manifold via an input coolant line and an output coolant line. A liquid line routing assembly is disposed within the enclosure. The liquid line routing assembly comprises at least one sidewall and one or more openings in the at least one sidewall. The openings are configured to provide a path to route input coolant lines and output coolant lines to selected ones of the cold plates. The at least one sidewall includes a gate structure positioned over at least one of the openings. The gate structure is configured to pivot away from the at least one opening to provide access to the opening.

Abstract: An information technology equipment enclosure comprises a plurality of IT components, cold plates disposed over at least two of the IT components, and a cooling fluid manifold disposed within the IT equipment enclosure. The coolant liquid manifold has multiple input connectors and multiple output connectors. Each of the cold plates are coupled to the cooling fluid manifold using a coolant line attached to one of the input connectors and a coolant line attached to one of the output connectors. An input cooling liquid line couples the coolant liquid manifold to an output of an external liquid cooling system, and an output liquid line couples the coolant liquid manifold to an input of the external liquid cooling system. The coolant liquid manifold is configured to receive cooling fluid from the external liquid cooling system and to distribute the cooling fluid to all of the cold plates via the input connectors.

Abstract: A rotor bearing system configured to operatively couple a progressing cavity machine to an external device can comprise a housing including an inner surface defining a first bore extending through the housing along a central axis, a first bearing arranged on the inner surface, and a shaft member including an outer surface extending between a proximal portion and a distal portion of the shaft member and a second bearing arranged on the outer surface, the second bearing the second bearing configured to contact the first bearing to limit eccentric motion of the driveshaft of the external device and the rotor head of the progressing cavity machine relative to a stator of the progressing cavity machine during rotation of the rotor head, the shaft member, and the driveshaft.

Abstract: In one embodiment, an information technology (IT) equipment enclosure comprises a first portion of a chassis configured with one or more compute devices fixedly mounted to the chassis and a second portion of the chassis configured to receive a removable storage tray module, the storage tray module configured with one or more storage devices and one or more cooling devices. The removable storage tray module comprising a handle that is pivotable between a locked position and an unlocked position. The handle comprises a recessed portion that is configured to route cables to the storage devices when the handle is in the locked position. The handle may engage a sidewall of the chassis when in the locked position. The cooling devices are selected based upon the one or more storage devices on the storage tray module. The cooling devices may be fans.

Abstract: A rack assembly for physically supporting information technology (IT) devices is disclosed. The rack assembly includes a plurality of interconnected panels forming a volumetric space having a front access and a rear access with opposing side panels. The front access and the rear access extend from a bottom edge to a top edge. The plurality of interconnected panels allow air to flow in either direction between the front access and the rear access. An ambient temperature indicator is mounted adjacent to the front access or the rear access. The ambient temperature indicator is configured to visually indicate temperature values between the top edge and the bottom edge.