Abstract: The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, a means for providing CMP information positioned near the substrate, and a transmitter positioned near the substrate and adapted to transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner having a means for communicating CMP information, a CMP process monitoring system, and a method for conditioning a CMP pad.

Abstract: Edge modifying apparatuses that include a disc chuck, a disc edge modifying unit having an abrasive article support, and a uniform velocity linear oscillation driver coupled to at least one of the disc chuck and the abrasive article support are described. The uniform velocity linear oscillation driver provides a substantially constant velocity for at least 80% of each half-cycle of oscillation. Methods of modifying the edge of disc using such apparatuses are also described.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abstract: A micrometer sized multi-directional thermal actuator capable of repeatable and rapid displacement in a substantially horizontal direction, a substantially vertical direction, and/or a combination thereof. The multi-directional thermal actuator constructed on a surface of a substrate includes three or more beams each cantilevered from one or more anchors at a first end to extend generally parallel to the surface of the substrate. A member mechanically and electrically couples the distal ends of the beams. Application of current to a circuit comprising combinations of any two or more of the beams displaces the member in one of three or more non-parallel radial directions, respectively.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.