Patents by Inventor Daniel Brunner

Daniel Brunner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250226136
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: March 31, 2025
    Publication date: July 10, 2025
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Publication number: 20250182913
    Abstract: Some aspects relate to a toroidal field (TF) coil for a tokamak. The TF coil includes a first inner leg having teeth on a side of the first inner leg. The corresponds to an interface between the TF coil and a second TF coil. The teeth extend along a direction having a component in a radial direction of the tokamak. The teeth are configured to mechanically engage with second teeth of a second inner leg of the second TF coil.
    Type: Application
    Filed: January 20, 2023
    Publication date: June 5, 2025
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LaBombard, Alexey Radovinsky, Daniel Brunner, Christopher J. Lammi, Robert Mumgaard, Nicoli Ames, Frank Kan, Valeria Riccardo, Edwin Bolz
  • Patent number: 12293871
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: May 6, 2025
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Patent number: 12265006
    Abstract: Fluid property sensors described herein may include a resonator configured to be immersed in a fluid or flowable medium and a vibrator coupled to the resonator, such that vibrations of the vibrator are transmitted to the resonator, e.g., to discourage and/or remove any buildup or deposits on the resonator and/or increase accuracy of the sensors. The frequency of the vibrator is configured to be substantially lower than the frequency of the resonator, such that operation of the resonator is not negatively affected. The vibrator may be located internal to, or external to, a chassis of the device.
    Type: Grant
    Filed: July 11, 2024
    Date of Patent: April 1, 2025
    Assignee: Rheonics GmbH
    Inventors: Joe Goodbread, Daniel Brunner, Sunil Kumar
  • Publication number: 20250052657
    Abstract: Fluid property sensors described herein may include a resonator configured to be immersed in a fluid or flowable medium and a vibrator coupled to the resonator, such that vibrations of the vibrator are transmitted to the resonator, e.g., to discourage and/or remove any buildup or deposits on the resonator and/or increase accuracy of the sensors. The frequency of the vibrator is configured to be substantially lower than the frequency of the resonator, such that operation of the resonator is not negatively affected. The vibrator may be located internal to, or external to, a chassis of the device.
    Type: Application
    Filed: July 11, 2024
    Publication date: February 13, 2025
    Inventors: Joe GOODBREAD, Daniel BRUNNER, Sunil KUMAR
  • Publication number: 20240387063
    Abstract: Techniques are described for automatically removing and replacing components, including a vacuum vessel, from a tokamak. The inventors have recognized that schemes for automatically removing and replacing components from a tokamak should preferably be simple (e.g., using proven equipment to perform a series of non-mechanically complex tasks) and have a very low risk of damaging components. Techniques described herein may include splitting a tokamak into multiple pieces, separating the pieces, and removing the now separate pieces of the vacuum vessel from within the pieces of the tokamak. A new vacuum vessel can be inserted in multiple pieces and the tokamak rejoined to complete the replacement process.
    Type: Application
    Filed: May 16, 2023
    Publication date: November 21, 2024
    Applicant: Commonwealth Fusion Systems LLC
    Inventors: Brandon N. Sorbom, Robert Mumgaard, Daniel Brunner, Alexander Creely, Cody Dennett, Matthew Vernacchia, Caroline Sorensen, Theodore Wyeth
  • Publication number: 20240203628
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: September 28, 2023
    Publication date: June 20, 2024
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Patent number: 11973616
    Abstract: An EtherCAT bus system includes an EtherCAT master, EtherCAT nodes, and an EtherCAT star hub arranged and/or assembled on the same printed circuit board with the EtherCAT master.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: April 30, 2024
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Michael Schäfer, Daniel Brunner
  • Patent number: 11810712
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: November 7, 2023
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20230101820
    Abstract: Described is a cable comprising a plurality of high temperature superconductor (HTS) components, a plurality of electrically conductive segments extending along a length of the cable, each of the plurality of electrically conductive segments comprising one of the plurality of HTS components, and an electrically insulating material arranged between adjacent ones of the plurality of electrically conductive segments.
    Type: Application
    Filed: March 4, 2021
    Publication date: March 30, 2023
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Alexey RADOVINSKY, Charlie SANABRIA, Christopher CRAIGHILL, Krishna Kiran Kumar UPPALAPATI, Alexander CREELY, Daniel BRUNNER
  • Publication number: 20220407739
    Abstract: An EtherCAT bus system includes an EtherCAT master, EtherCAT nodes, and an EtherCAT star hub arranged and/or assembled on the same printed circuit board with the EtherCAT master.
    Type: Application
    Filed: August 6, 2020
    Publication date: December 22, 2022
    Applicant: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Michael SCHÄFER, Daniel BRUNNER
  • Publication number: 20220359111
    Abstract: A system comprises a superconducting magnet comprising a coil of superconducting material. The coil includes electrical terminals. The windings of the coil are separated by a metallic conductor. A control circuit is coupled to the terminals to drive a current through the coil to charge the superconducting magnet and configured to provide a current through the coil that is sufficiently small to avoid a quenching effect of the superconducting magnet but also large enough to charge the magnet within a predetermined time period. A cooling structure is thermally coupled to the coil to remove heat caused by charging the superconducting magnet with the current to allow for the current to be sufficiently large to charge the magnet within the predetermined time period without causing the quenching effect.
    Type: Application
    Filed: June 17, 2020
    Publication date: November 10, 2022
    Applicant: Massachusetts Institute of Technology
    Inventors: Daniel BRUNNER, Robert MUMGAARD
  • Publication number: 20220336130
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Patent number: 11417464
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: August 16, 2022
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20220068528
    Abstract: An electromagnetic pulse source comprises a superconducting magnet comprising a coil of superconducting material. At least a portion of the windings of the coil are separated by an electric conductor. A charging circuit is coupled to the two terminals to drive a current through the coil to charge the superconducting magnet and configured to charge the coil to a condition such that the coil enters a quench condition where current flows from one turn of the coil to another turn of the coil through the electric conductor. The quench event may cause a loss of inductance and resulting electromagnetic radiation. A receiver circuit comprising an inductive element is positioned so that the inductive element is mutually-coupled to the coil and the electromagnetic radiation causes a voltage to be induced across the inductive element.
    Type: Application
    Filed: December 18, 2019
    Publication date: March 3, 2022
    Inventor: Daniel BRUNNER
  • Patent number: 11251097
    Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: February 15, 2022
    Assignee: Infineon Technologies AG
    Inventors: Walter Leitgeb, Daniel Brunner, Lukas Ferlan
  • Publication number: 20210313104
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: June 11, 2021
    Publication date: October 7, 2021
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Patent number: 11094439
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 17, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Patent number: 11088009
    Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: August 10, 2021
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Goller, Walter Leitgeb, Daniel Brunner, Lukas Ferlan, Markus Ottowitz
  • Publication number: 20200402692
    Abstract: A system comprises a superconducting magnet comprising a coil of superconducting material. The coil includes two electrical terminals. The windings of the coil are separated by a metallic conductor. A control circuit is coupled to the two terminals to drive a current through the coil to charge the superconducting magnet and configured to provide a current through the coil that is sufficiently small to avoid a quenching effect of the superconducting magnet but also large enough to charge the magnet within a predetermined time period. A cooling structure is thermally coupled to the coil to remove heat caused by charging the superconducting magnet with the current to allow for the current to be sufficiently large to charge the magnet within the predetermined time period without causing the quenching effect.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 24, 2020
    Inventors: Daniel BRUNNER, Robert MUMGAARD