Patents by Inventor Daniel Brunner
Daniel Brunner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240203628Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: September 28, 2023Publication date: June 20, 2024Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 11973616Abstract: An EtherCAT bus system includes an EtherCAT master, EtherCAT nodes, and an EtherCAT star hub arranged and/or assembled on the same printed circuit board with the EtherCAT master.Type: GrantFiled: August 6, 2020Date of Patent: April 30, 2024Assignee: SEW-EURODRIVE GMBH & CO. KGInventors: Michael Schäfer, Daniel Brunner
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Patent number: 11810712Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 30, 2022Date of Patent: November 7, 2023Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20230101820Abstract: Described is a cable comprising a plurality of high temperature superconductor (HTS) components, a plurality of electrically conductive segments extending along a length of the cable, each of the plurality of electrically conductive segments comprising one of the plurality of HTS components, and an electrically insulating material arranged between adjacent ones of the plurality of electrically conductive segments.Type: ApplicationFiled: March 4, 2021Publication date: March 30, 2023Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Alexey RADOVINSKY, Charlie SANABRIA, Christopher CRAIGHILL, Krishna Kiran Kumar UPPALAPATI, Alexander CREELY, Daniel BRUNNER
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Publication number: 20220407739Abstract: An EtherCAT bus system includes an EtherCAT master, EtherCAT nodes, and an EtherCAT star hub arranged and/or assembled on the same printed circuit board with the EtherCAT master.Type: ApplicationFiled: August 6, 2020Publication date: December 22, 2022Applicant: SEW-EURODRIVE GMBH & CO. KGInventors: Michael SCHÄFER, Daniel BRUNNER
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Publication number: 20220359111Abstract: A system comprises a superconducting magnet comprising a coil of superconducting material. The coil includes electrical terminals. The windings of the coil are separated by a metallic conductor. A control circuit is coupled to the terminals to drive a current through the coil to charge the superconducting magnet and configured to provide a current through the coil that is sufficiently small to avoid a quenching effect of the superconducting magnet but also large enough to charge the magnet within a predetermined time period. A cooling structure is thermally coupled to the coil to remove heat caused by charging the superconducting magnet with the current to allow for the current to be sufficiently large to charge the magnet within the predetermined time period without causing the quenching effect.Type: ApplicationFiled: June 17, 2020Publication date: November 10, 2022Applicant: Massachusetts Institute of TechnologyInventors: Daniel BRUNNER, Robert MUMGAARD
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Publication number: 20220336130Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 11417464Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 11, 2021Date of Patent: August 16, 2022Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20220068528Abstract: An electromagnetic pulse source comprises a superconducting magnet comprising a coil of superconducting material. At least a portion of the windings of the coil are separated by an electric conductor. A charging circuit is coupled to the two terminals to drive a current through the coil to charge the superconducting magnet and configured to charge the coil to a condition such that the coil enters a quench condition where current flows from one turn of the coil to another turn of the coil through the electric conductor. The quench event may cause a loss of inductance and resulting electromagnetic radiation. A receiver circuit comprising an inductive element is positioned so that the inductive element is mutually-coupled to the coil and the electromagnetic radiation causes a voltage to be induced across the inductive element.Type: ApplicationFiled: December 18, 2019Publication date: March 3, 2022Inventor: Daniel BRUNNER
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Patent number: 11251097Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.Type: GrantFiled: February 25, 2020Date of Patent: February 15, 2022Assignee: Infineon Technologies AGInventors: Walter Leitgeb, Daniel Brunner, Lukas Ferlan
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Publication number: 20210313104Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 11, 2021Publication date: October 7, 2021Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Patent number: 11094439Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: December 23, 2019Date of Patent: August 17, 2021Assignee: Massachusetts Institute of TechnologyInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Patent number: 11088009Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.Type: GrantFiled: July 17, 2019Date of Patent: August 10, 2021Assignee: Infineon Technologies AGInventors: Bernhard Goller, Walter Leitgeb, Daniel Brunner, Lukas Ferlan, Markus Ottowitz
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Publication number: 20200402692Abstract: A system comprises a superconducting magnet comprising a coil of superconducting material. The coil includes two electrical terminals. The windings of the coil are separated by a metallic conductor. A control circuit is coupled to the two terminals to drive a current through the coil to charge the superconducting magnet and configured to provide a current through the coil that is sufficiently small to avoid a quenching effect of the superconducting magnet but also large enough to charge the magnet within a predetermined time period. A cooling structure is thermally coupled to the coil to remove heat caused by charging the superconducting magnet with the current to allow for the current to be sufficiently large to charge the magnet within the predetermined time period without causing the quenching effect.Type: ApplicationFiled: June 18, 2019Publication date: December 24, 2020Inventors: Daniel BRUNNER, Robert MUMGAARD
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Publication number: 20200402693Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: December 23, 2019Publication date: December 24, 2020Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Daniel BRUNNER, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Publication number: 20200286795Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.Type: ApplicationFiled: February 25, 2020Publication date: September 10, 2020Inventors: Walter Leitgeb, Daniel Brunner, Lukas Ferlan
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Publication number: 20200279681Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: May 20, 2019Publication date: September 3, 2020Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Daniel BRUNNER
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Publication number: 20200211744Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: December 27, 2018Publication date: July 2, 2020Inventors: Brian LABOMBARD, Robert GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Publication number: 20200194153Abstract: An electromagnetic pulse source comprises a superconducting magnet comprising a coil of superconducting material. At least a portion of the windings of the coil are separated by an electric conductor. A charging circuit is coupled to the two terminals to drive a current through the coil to charge the superconducting magnet and configured to charge the coil to a condition such that the coil enters a quench condition where current flows from one turn of the coil to another turn of the coil through the electric conductor. The quench event may cause a loss of inductance and resulting electromagnetic radiation. A receiver circuit comprising an inductive element is positioned so that the inductive element is mutually-coupled to the coil and the electromagnetic radiation causes a voltage to be induced across the inductive element.Type: ApplicationFiled: December 18, 2018Publication date: June 18, 2020Applicant: Massachusetts Institute of TechnologyInventor: Daniel Brunner
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Publication number: 20200027774Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.Type: ApplicationFiled: July 17, 2019Publication date: January 23, 2020Inventors: Bernhard Goller, Walter Leitgeb, Daniel Brunner, Lukas Ferlan, Markus Ottowitz