Abstract: An electrically programmable memory array of the floating gate type with a high coupling ratio is made by a DMOS process which allows the edges of the floating gates to be self-aligned with the edges of the control gates and produces improved characteristics in the form of higher gain and lower body effect. The source and drain regions are formed prior to applying the first level polysilicon by a process which leaves these regions covered with thick oxide, rather than using the polysilicon as a mask to define the gate areas. Double-diffused regions are formed on one or both sides of the channel, also beneath thick oxide, instead of using a P+ tank. The ratio of the capacitance between the floating gate and control gate to the total capacitance at the floating gate is increased and the degradation in the cell performance usually caused by the P+ tank is avoided.

Abstract: A non-volatile semiconductor memory device of the electrically erasable type employs a floating gate which is programmed by application to high voltage across the source and drain so that hot electrons traverse the gate oxide. The floating gate is discharged by electron tunneling through an erase window which is separated from the control gate. Very small cell size is provided by a triple level polysilicon structure.

Abstract: A non-volatile semiconductor memory device of the electrically erasable type employs a floating gate which is programmed by application of high voltage across the source and drain so that hot electrons traverse the gate oxide. The floating gate is discharged by electron tunneling through an erase window which is separated from the control gate. An over-erase sensor transistor separate from the memory transistor prevents the floating gate from being discharged below a point where the memory transistor will be depletion mode.