Abstract: A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

Abstract: In a yaw rate sensor with a substrate having a main extent plane and with a first and second partial structure disposed parallel to the main extent plane, the first partial structure includes a first driving structure and the second partial structure includes a second driving structure, the first and second partial structure being excitable by a driving device, via the first and second driving structure, into oscillation parallel to a first axis parallel to the main extent plane, the first partial structure having a first Coriolis element and the second partial structure having a second Coriolis element, the yaw rate sensor being characterized in that the first and second Coriolis elements are displaceable by a Coriolis force parallel to a second axis, which is perpendicular to the first axis, and parallel to a third axis, which is perpendicular to the first and second axis, the second axis extending parallel to the main extent plane, and the first Coriolis element being connected to the second Coriolis eleme

Abstract: A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.

Abstract: A yaw rate sensor, including a substrate and a main extension plane, for detecting a yaw rate around a first direction in parallel to the main extension plane, a first Coriolis mass, and a second Coriolis mass, and a drive device configured to drive the first and second Coriolis masses in parallel to a drive direction perpendicular to the first direction, the first and second Coriolis masses, for a yaw rate around the first direction, experiencing a Coriolis acceleration in parallel to a detection direction, which is perpendicular to the drive and first directions, the first and second Coriolis masses having first/second partial areas and third/fourth partial areas, respectively. The first and third partial areas are farther from the axis of symmetry in parallel to the first direction, and the second and fourth partial areas are closer to the axis of symmetry in parallel to the first direction.

Abstract: A micromechanical sensor having at least one movably mounted measuring element which is opposite at least one stationary electrode, the electrode being situated in a first plane, and being contacted by at least one printed conductor track which is situated in a second plane. A third plane is located between the first plane and the second plane, the third plane including an electrically conductive material.

Abstract: A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element.

Abstract: A micromechanical inertial sensor includes an ASIC element having a processed front side, an MEMS element having a micromechanical sensor structure, and a cap wafer mounted above the micromechanical sensor structure, which sensor structure includes a seismic mass and extends over the entire thickness of the MEMS substrate. The MEMS element is mounted on the processed front side of the ASIC element above a standoff structure and is electrically connected to the ASIC element via through-contacts in the MEMS substrate and in adjacent supports of the standoff structure. A blind hole is formed in the MEMS substrate in the area of the seismic mass, which blind hole is filled with the same electrically conductive material as the through-contacts, the conductive material having a greater density than the MEMS substrate.

Abstract: A yaw-rate sensor, having a substrate which has a main extension plane, for detecting a yaw rate about a first direction extending either parallel to the main extension plane or perpendicular to the main extension plane. The yaw-rate sensor has a drive device, a first Coriolis mass and a second Coriolis mass, the drive device being configured to drive at least one part of the first Coriolis mass and at least one part of the second Coriolis mass in a direction parallel to a drive direction extending perpendicular to the first direction.

Abstract: A rotation rate sensor includes: a mounting device; a first drive frame having a drive, which is designed to set the first drive frame into a first oscillatory motion along an axis of oscillation relative to the mounting device; a first stator electrode; a first actuator electrode coupled to the first drive frame in such a way that in a rotary motion of the rotation rate sensor due to a Coriolis force, the first actuator electrode being displaceable in a first deflection direction relative to the first stator electrode; and an evaluation device configured to determine a voltage applied between the first stator electrode and the first actuator electrode, and to specify information regarding the rotary motion of the rotation rate sensor while taking the determined voltage value into account.

Abstract: A micromechanical yaw-rate sensor comprising a first yaw-rate sensor element, which outputs a first sensor signal, which contains information about a rotation around a first rotational axis, a second yaw-rate sensor element, which outputs a second sensor signal, which contains information about a rotation around a second rotational axis, which is perpendicular to the first rotational axis, a drive, which drives the first yaw-rate sensor element, and a coupling link, which mechanically couples the first yaw-rate sensor element and the second yaw-rate sensor element to one another, so that driving of the first yaw-rate sensor element also causes driving of the second yaw-rate sensor element.

Abstract: A micromechanical yaw rate sensor includes a substrate having a main plane of extension and two Coriolis elements. The first Coriolis element may be driven to a first vibration along a second direction which is parallel to the main plane of extension. The second Coriolis element may be driven to a second vibration which is antiparallel to the first vibration. A first deflection of the first Coriolis element and a second deflection of the second Coriolis element, in each case along a first direction which is parallel to the main plane of extension and perpendicular to the second direction, may be detected. The micromechanical sensor also has a rocker element indirectly or directly coupled to the first Coriolis element and to the second Coriolis element, which rocker element has a torsional axis essentially parallel to the second direction.

Abstract: A yaw rate sensor having a substrate, a first Coriolis element and a second Coriolis element is described, the first Coriolis element being excitable to a first vibration by first excitation means, and the second Coriolis element being excitable to a second vibration by second excitation means, and the first and second Coriolis elements being connected to one another by a spring structure, and the spring structure also including at least one rocker structure, the rocker structure being anchored on the substrate by at least one spring element.

Abstract: A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

Abstract: A rotation rate sensor includes a substrate having a main extension plane, and a Coriolis element movable relative to the substrate, the Coriolis element being provided to be excitable to perform an oscillation deflection substantially parallel to the main extension plane; and the Coriolis element further being provided to be deflectable, by way of a Coriolis force acting on the Coriolis element, to perform a detectable Coriolis deflection perpendicular to the main extension plane; and the rotation rate sensor further including at least one compensation electrode that is provided for at least partial compensation, as a function of the oscillation deflection, for a levitation force acting on the Coriolis element.

Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.

Abstract: The disclosure relates to a micromechanical rotary acceleration sensor including a substrate with at least one anchoring device and at least two flywheel masses. At least one of the flywheel masses is connected to at least one anchoring device by means of a coupling element. The at least one anchoring device is designed in such a manner that the at least two flywheel masses are elastically deflectable from a respective rest position about at least one axis of rotation. The at least two flywheel masses is designed in such a manner that they have different natural frequencies.

Abstract: A yaw-rate sensor is described as having a substrate which has a main plane of extension for detecting a yaw rate about a first axis extending parallel to the main plane of extension is provided, the yaw-rate sensor having a first rotation element and a second rotation element, the first rotation element being drivable about a first axis of rotation, the second rotation element being drivable about a second axis of rotation, the first axis of rotation being situated perpendicularly to the main plane of extension, the second axis of rotation being situated perpendicularly to the main plane of extension, the first rotation element and the second rotation element being drivable in opposite directions.

Abstract: A rotational rate sensor includes: a substrate having a main plane of extension; a first Coriolis element; and a second Coriolis element. The first Coriolis element and the second Coriolis element have a first and a second center of gravity, respectively, and the elements are drivable along a drive direction. In the idle state of the rotational rate sensor, (i) the distance between the first center of gravity and the second center of gravity along the detection direction is less than a first value, and (ii) the distance between the first center of gravity and the second center of gravity along the third direction is less than a second value.

Abstract: A yaw-rate sensor includes: a substrate having a main extension plane for detecting a yaw rate about a first axis extending parallel to the main extension plane; a first Coriolis element; a second Coriolis element; a third Coriolis element; and a fourth Coriolis element. The first Coriolis element and the fourth Coriolis element are drivable in the same direction parallel to a second axis extending parallel to the main extension plane and perpendicularly to the first axis. The first Coriolis element and the second Coriolis element are drivable in opposite directions parallel to the second axis. The first Coriolis element and the third Coriolis element are drivable in opposite directions parallel to the second axis.

Abstract: A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.