Patents by Inventor Daniel Kim

Daniel Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TECHNIQUES TO ASSOCIATE USER DATA WITH A MOBILE DEVICE
    Publication number: 20160150395
    Abstract: Techniques to associate user data with a mobile device are described. In one embodiment, for example, an apparatus may comprise a service support component and a storage component. The services support component may be operative to receive a data package request from a service, the data package request comprising a network identifier for a mobile device associated with a user, and exchange a data package with the service in response to the data package request. The storage component may be operative to access the data package associated with the user based on the network identifier. Other embodiments are described and claimed. Other embodiments are described and claimed.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 26, 2016
    Applicant: Facebook, Inc.
    Inventors: Daniel Kim, Yen-Ting Tung
  • Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
    Patent number: 9343399
    Abstract: An integrated circuit device includes a substrate, and a first interlayer dielectric layer on the substrate that includes a first conductive layer and a second conductive layer. The integrated circuit device also includes a first conductive stack including a third conductive layer coupled to a portion of the second conductive layer with a first via. The integrated circuit device further includes a second conductive stack comprising a fourth conductive layer directly on a portion of the third conductive layer that is isolated from the substrate. The integrated circuit device also includes a second interlayer dielectric layer surrounding the third conductive layer and the fourth conductive layer.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 17, 2016
    Assignee: QUALCOMM INCORPORATED
    Inventors: Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim, Mario Francisco Velez, Robert Paul Mikulka, Niranjan Sunil Mudakatte
  • Stress mitigation structure for wafer warpage reduction
    Patent number: 9343403
    Abstract: An integrated circuit device includes a substrate. The integrated circuit device also includes a first conductive stack including a back-end-of-line (BEOL) conductive layer at a first elevation with reference to the substrate. The integrated circuit device also includes a second conductive stack including the BEOL conductive layer at a second elevation with reference to the substrate. The second elevation differs from the first elevation.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: May 17, 2016
    Assignee: QUALCOMM INCORPORATED
    Inventors: Je-Hsiung Jeffrey Lan, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Niranjan Sunil Mudakatte, Robert Paul Mikulka, Jonghae Kim
  • Toroid inductor in an integrated device
    Patent number: 9324779
    Abstract: Some novel features pertain to an integrated device that includes a substrate, a first cavity through the substrate, and a toroid inductor configured around the first cavity of the substrate. The toroid inductor includes a set of windings configured around the first cavity. The set of windings includes a first set of interconnects on a first surface of the substrate, a set of though substrate vias (TSVs), and a second set of interconnects on a second surface of the substrate. The first set of interconnects is coupled to the second set of interconnects through the set TSVs. In some implementations, the integrated device further includes an interconnect material (e.g., solder ball) located within the first cavity. The interconnect material is configured to couple a die to a printed circuit board. In some implementations, the interconnect material is part of the toroid inductor.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: April 26, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Young Kyu Song, Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Ryan David Lane, Mario Francisco Velez, Chengjie Zuo, Changhan Hobie Yun
  • DEVICES AND METHODS TO REDUCE STRESS IN AN ELECTRONIC DEVICE
    Publication number: 20160095208
    Abstract: A device includes a stress relief region between at least two stress domains of a substrate (e.g., of a semiconductor die or other integrated circuit). The stress relief region includes a conductive structure electrically coupling circuitries of the stress domains between which the conductive structure is disposed.
    Type: Application
    Filed: September 26, 2014
    Publication date: March 31, 2016
    Inventors: Daeik Daniel Kim, Je-Hsiung Jeffrey Lan, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim, David Francis Berdy
  • VARACTOR DEVICE WITH BACKSIDE CONTACT
    Publication number: 20160093750
    Abstract: An apparatus includes a varactor having a first contact that is located on a first side of a substrate. The varactor includes a second contact that is located on a second side of the substrate, and the second side is opposite the first side. The apparatus further includes a signal path between the first contact and the second contact.
    Type: Application
    Filed: September 26, 2014
    Publication date: March 31, 2016
    Inventors: Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Matthew Michael Nowak, Robert Paul Mikulka
  • Superposed structure 3D orthogonal through substrate inductor
    Patent number: 9275786
    Abstract: A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: March 1, 2016
    Assignee: QUALCOMM INCORPORATED
    Inventors: David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Jonghae Kim
  • DYNAMIC TIRE AIR PRESSURE SYSTEM
    Publication number: 20160052351
    Abstract: In one embodiment, a dynamic tire air pressure system for a vehicle is disclosed. The system includes a tire pressure sensor that measures an air pressure of a tire. The system also includes a first reservoir tank maintaining a lower air pressure than the measured air pressure of the tire. The system further includes a second reservoir tank maintaining a higher air pressure than the measured air pressure of the tire. The system additionally includes one or more valves that control deflation and inflation of the tire by selectively coupling the tire to the first or second reservoir tanks.
    Type: Application
    Filed: August 19, 2014
    Publication date: February 25, 2016
    Inventors: Angelo Dilisio, Joel Myers, Todd Nelson, Daniel Kim
  • Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
    Patent number: 9264013
    Abstract: Systems for reducing magnetic coupling in integrated circuits (ICs) are disclosed. Related components and methods are also disclosed. The ICs have a plurality of inductors. Each inductor generates a magnetic flux that has a discernible axis. To reduce magnetic coupling between the inductors, the flux axes are designed so as to be non-parallel. In particular, by making the flux axes of the inductors non-parallel to one another, magnetic coupling between the inductors is reduced relative to the situation where the flux axes are parallel. This arrangement may be particularly well suited for use in diplexers having a low pass and a high pass filter.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: February 16, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Je-Hsiung Jeffrey Lan, Robert Paul Mikulka, Matthew Michael Nowak
  • SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR
    Publication number: 20160020013
    Abstract: A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 21, 2016
    Inventors: David Francis BERDY, Chengjie ZUO, Daeik Daniel KIM, Changhan Hobie YUN, Mario Francisco VELEZ, Robert Paul MIKULKA, Jonghae KIM
  • PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE
    Publication number: 20160020193
    Abstract: Some features pertain to an integrated device (e.g., package-on-package (PoP) device) that includes a substrate, a first die, a first encapsulation layer, a first redistribution portion, a second die, a second encapsulation layer, and a second redistribution portion. The substrate includes a first surface and a second surface. The substrate includes a capacitor. The first die is coupled to the first surface of the substrate. The first encapsulation layer encapsulates the first die. The first redistribution portion is coupled to the first encapsulation. The second die is coupled to the second surface of the substrate. The second encapsulation layer encapsulates the second die. The second redistribution portion is coupled to the second encapsulation layer.
    Type: Application
    Filed: July 17, 2014
    Publication date: January 21, 2016
    Inventors: Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow, Mario Francisco Velez, Jonghae Kim, Xiaonan Zhang, Ryan David Lane
  • SERVER INCLUDING COMPONENTS FOR ACCESSING AND DISPLAYING INTERNET CONTENT AND FOR PROVIDING SAME TO A CLIENT
    Publication number: 20150373152
    Abstract: A server maintains and provides access to application media packages for accessing and displaying Internet content. These packages include a definition for rendering a graphical user interface within which Internet content may be presented outside of and without utilization of a web browser application. The packages also include a network reference, such as a URL, pointing to the Internet content such that the Internet Content may be downloaded and presented within said user interface. A representation of each package on the server available for downloading is provided. A user may select one or more desired packages for downloading. An application media viewer may also be made available for downloading.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 24, 2015
    Inventors: John Albert KEMBEL, George Andrew KEMBEL, Daniel KIM, John RUSSELL, Jake WOBBROCK, Geoffrey S. KEMBEL, Jeremy L. KEMBEL, Joseph A. BELLA, Sridhar T. DEVULKAR, Mark WALLIN
  • VERTICAL SPIRAL INDUCTOR
    Publication number: 20150371751
    Abstract: Methods and apparatuses, wherein the method forms a first plurality of vias in a substrate, further comprising forming the first plurality of vias to be substantially the same height. The method forms a plurality of conductive traces external to the substrate and couples the plurality of conductive traces to the first plurality of vias: wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns and wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 24, 2015
    Inventors: Daeik Daniel KIM, Changhan Hobie YUN, Mario Francisco VELEZ, Chengjie ZUO, David Francis BERDY, Jonghae KIM
  • PANNIER MOUNTING SYSTEM
    Publication number: 20150344089
    Abstract: A pannier mounting system enables a pannier container to be quickly and easily attached to and detached from a rack of a bicycle, motorcycle, or the like. In an embodiment, the system includes a rack attachment bracket that attaches to the rack, a first pair of connectors attached to the bracket, and a second pair of connectors attached to a side of the pannier container. Each of the first pair of connectors includes a magnet, and each of the second pair of connectors includes a magnet. Attraction between magnets of the first pair of connectors and magnets of the second pair of connectors cause the first and second pairs of connectors to align with and connect to one another when brought within close proximity to one another, thereby attaching the pannier container to the bracket. A pannier release handle is used to detach the pannier container from the bracket.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 3, 2015
    Inventors: Ulliyada Bopanna, Daniel Kim, Greg Bass
  • Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
    Patent number: 9202789
    Abstract: Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 1, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Daeik Daniel Kim, Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak, Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Robert Paul Mikulka
  • Associating User Interactions Across Multiple Applications On A Client Device
    Publication number: 20150326651
    Abstract: An online system transmits third-party content originating from a third-party system to a client device. The third-party content includes a pointer to a third-party application associated with the third-party system. When the client device receives an interaction with the third-party content from a user of the client device, the client device executes the third-party application and generates an attribution identifier from which the user's identity cannot be determined. The attribution identifier is transmitted to the online system. Subsequently, the client device determines information describing interactions by the user with the third-party application that is transmitted to the third-party system along with the attribution identifier.
    Type: Application
    Filed: August 27, 2014
    Publication date: November 12, 2015
    Inventors: Holly Marie Ormseth, Daniel Kim, Matthew Michael Willis, Jaed Uavechanichkul, Chen Chen, Sean Elliott Dy, Shayne Mikel Sweeney
  • FREQUENCY MULTIPLEXER
    Publication number: 20150304059
    Abstract: An apparatus is disclosed that includes a frequency multiplexer circuit coupled to an input node and configured to receive an input signal via the input node. The frequency multiplexer circuit comprises a first filter circuit, a second filter circuit, and a third filter circuit. The apparatus also includes a switching circuit that is configurable to couple at least two of a first output of the first filter circuit, a second output of the second filter circuit, or a third output of the third filter circuit to a single output port.
    Type: Application
    Filed: April 8, 2015
    Publication date: October 22, 2015
    Inventors: Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Jeffrey Lan, Robert Paul Mikulka, Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak, Ryan Scott C. Spring, Xiangdong Zhang
  • DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONNECTOR CONFIGURED TO COUPLE TO A DIE PACKAGE
    Publication number: 20150303148
    Abstract: Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer.
    Type: Application
    Filed: April 16, 2014
    Publication date: October 22, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Daeik Daniel Kim, Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak, Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Robert Paul Mikulka
  • Resilient pad composite having bound reinforcing structure
    Patent number: 9155342
    Abstract: The present application discloses a composite pad structure that includes a substrate bonded to a plurality of discrete, spaced-apart, resilient elements engaged to at least one reinforcing structure.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: October 13, 2015
    Assignee: Applied FT Composite Solutions Inc.
    Inventor: Daniel Kim
  • STRESS MITIGATION STRUCTURE FOR WAFER WARPAGE REDUCTION
    Publication number: 20150287677
    Abstract: An integrated circuit device includes a substrate. The integrated circuit device also includes a first conductive stack including a back-end-of-line (BEOL) conductive layer at a first elevation with reference to the substrate. The integrated circuit device also includes a second conductive stack including the BEOL conductive layer at a second elevation with reference to the substrate. The second elevation differs from the first elevation.
    Type: Application
    Filed: September 11, 2014
    Publication date: October 8, 2015
    Inventors: Je-Hsiung Jeffrey LAN, David Francis BERDY, Chengjie ZUO, Daeik Daniel KIM, Changhan Hobie YUN, Mario Francisco VELEZ, Niranjan Sunil MUDAKATTE, Robert Paul MIKULKA, Jonghae KIM