Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.

Abstract: Methods and systems for detecting and compensating for expansion of rechargeable batteries over time. An expansion detector may be coupled to or positioned proximate a rechargeable battery to monitor for expansion thereof. After expansion exceeding a selected threshold is detected, the expansion detector may report the expansion to an associated processing unit. The processing unit may undertake to arrest further rechargeable battery expansion by modifying or changing one or more characteristics of charging and/or discharging circuitry coupled to the rechargeable battery. For example, the processing unit may charge the rechargeable battery at a lower rate or with reduced voltage after detecting expansion.

Abstract: This application relates to an audio assembly that includes both a speaker assembly and a microphone. By mounting both the microphone and the speaker assembly to a unitary audio bracket, space savings can be achieved over a configuration that relies on separate brackets for each component. In some embodiments, an acoustic mesh can be embedded within the audio bracket and extending across an audio channel defined by the audio bracket. The microphone can be aligned with an opening in the audio bracket by an alignment clip that is coupled with the microphone. The alignment clip helps to achieve alignment of a sensor opening of the microphone with a channel defined by the audio bracket.

Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

Abstract: A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.

Abstract: An electronic device such as a handheld device may have a rectangular housing with a rectangular periphery. A conductive peripheral housing member may run along the rectangular periphery and may surround the rectangular housing. Radio-frequency transceiver circuitry within the electronic device may be coupled to antenna structures for transmitting and receiving radio-frequency signals. The conductive peripheral housing member may form part of the antenna structures. A gap in the conductive peripheral housing member may be filled with dielectric. The conductive peripheral housing member may be configured to form a recess. The recess may have the shape of a rectangle, oval, diamond, or other shape that overlaps and is bisected by the gap. The recess may also have the shape of a groove that extends around the entire periphery of the housing. The dielectric in the recess may include one or more different materials such as clear and opaque polymers.

Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

Abstract: This application relates to systems, methods, and apparatus for welding switches to a bracket for placement inside of a computing device. Each switch can include a metal region that can be welded to a metal surface of a bracket. The metal region of the switch can be a cover that is formed around a body of the switch, or an inserted molded region that is provided on a surface of the switch. The bracket can include recesses that can be used to identify when a switch is abutting the bracket before welding the switch to the bracket. Multiple welds can be provided on each switch to ensure a rigid connection exists between the bracket and switch. Welding can be performed in batches by loading multiple brackets and switches onto a pallet, and thereafter loading the pallet into a welding machine.

Abstract: This application relates to a portable electronic device includes at least a device housing having walls that define a cavity, the walls having edges that define an opening that leads into the cavity. Component assembly features used to secure components received through the opening to each other and/or to the walls during an assembly operation, and a protective cover formed of transparent material and disposed within the opening and secured to the housing.

Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.

Abstract: This application relates to an audio assembly that includes both a speaker assembly and a microphone. By mounting both the microphone and the speaker assembly to a unitary audio bracket, space savings can be achieved over a configuration that relies on separate brackets for each component. In some embodiments, an acoustic mesh can be embedded within the audio bracket and extending across an audio channel defined by the audio bracket. The microphone can be aligned with an opening in the audio bracket by an alignment clip that is coupled with the microphone. The alignment clip helps to achieve alignment of a sensor opening of the microphone with a channel defined by the audio bracket.

Abstract: Antenna related features of a mobile phone or computing device are disclosed. In one embodiment, wireless control and signal are fed separately through difference types of flexes to optimize performance and cost. In one embodiment, active switching and processing of differing conductive trace lengths are performed on an antenna flex so that antenna performance can be optimized for multiple wireless technologies covering a wide range of wavelengths. In one embodiment, a cantilever arm affixed to a ground screw can provide double grounding in a region with no available screw points due to high z constraint. In one embodiment, a device can provide double feed for antenna through a single screw. In one embodiment, a short pin can be configured to support thinner metal. In one embodiment, a “vibrator bracket/LDS short pin” structure can be used to share a common screw point.

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

Abstract: The described embodiments relate to embedding a threaded insert into a thin-walled housing. A recess can be formed with a machining tool that forms a recess in a thickened portion of the thin-walled housing. In some embodiments, the recess can be formed along one of the walls of the thin-walled housing in a location having highly a constrained amount of space available. Once the recess is formed a threaded insert can be pressed into the recess. An interference fit can be utilized to lodge the press-nut securely within the recess. Alternatively, a retaining member can be positioned across a front portion of the recess to trap the threaded insert between the retaining member and a rear surface of the recess.

Abstract: Methods and systems for manufacturing composite parts that include anodizable portions and non-anodizable portions such that an interface between the anodizable portions and non-anodizable portions are free of visible defects are described. The non-anodizable portions can be made of anodizable metals such as aluminum or aluminum alloy. The non-anodizable portions are made of material that do not generally form an anodic film, such as plastic, ceramic or glass materials. In particular, the methods described relate to manufacturing methods that are compatible with anodizing processes and avoid defects related to anodizing processes. In particular embodiments, the methods involve avoiding trapping of anodizing chemicals within a gap between an anodizable portion and a non-anodizable portion, which prevents the anodizing chemicals from disrupting the uptake of dye in a post-anodizing dyeing process.

Abstract: An electronic device may have a camera module for acquiring still and video digital images of a subject. A light source such as a light-emitting diode may serve as a flash for the camera module. A shutter may be mounted above the light-emitting diode. When the light-emitting diode is not being used to produce a flash of light for illuminating the subject, the shutter may be closed to block the light-emitting diode from view by a user. During image acquisition operations in which it is desired to illuminate the subject, the shutter may be opened to allow light from the light-emitting diode to exit the electronic device. The electronic device may have a touch screen display with an active region and an inactive region. The camera module and light source may be mounted under a portion of the inactive region of the display. The shutter may include a filter structure.

Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.