Abstract: This application relates to adhesives for use in electronic devices. Specifically, the embodiments discussed herein set forth stretch release conductive adhesives for adhering an electrical component to the surface of a housing of a computing device while also allowing current to flow through the electrical component. A stretch release conductive adhesive can include a graspable portion for providing a means to stretch and remove the stretch release conductive adhesive from an electronic device.

Abstract: An electronic device such as a handheld device may have a rectangular housing with a rectangular periphery. A conductive peripheral housing member may run along the rectangular periphery and may surround the rectangular housing. Radio-frequency transceiver circuitry within the electronic device may be coupled to antenna structures for transmitting and receiving radio-frequency signals. The conductive peripheral housing member may form part of the antenna structures. A gap in the conductive peripheral housing member may be filled with dielectric. The conductive peripheral housing member may be configured to form a recess. The recess may have the shape of a rectangle, oval, diamond, or other shape that overlaps and is bisected by the gap. The recess may also have the shape of a groove that extends around the entire periphery of the housing. The dielectric in the recess may include one or more different materials such as clear and opaque polymers.

Abstract: The described embodiments relate generally to improvements to injection molding equipment. More specifically, concepts for reducing sink and improving cosmetics of portions of injection molded parts in close proximity to gate areas of an injection mold are disclosed. A cold runner system is described in which molding material disposed in a mold cavity is separated from excess molding material in the runner system shortly after the mold is filled at a predetermined packing pressure.

Abstract: A method of using ultrasonic energy to secure a first and a second component is described, and an apparatus formed therefrom. A first layer is bonded to a second layer by converting ultrasonic energy into thermal energy. The energy conversions means is an energy director. A thermally sensitive layer receives the thermal energy and at least a portion of the thermally sensitive layer melts. The resultant melting bonds the first layer with the second layer. A different energy director may also be included and used to convert thermal energy in order to de-bond the first layer from the second layer in order to perform, for example, a rework.

Abstract: Devices, methods and graphical user interfaces for manipulating user interfaces based on fingerprint sensor inputs are provided. While a display of an electronic device with a fingerprint sensor displays a first user interface, the device may detect movement of a fingerprint on the fingerprint sensor. In accordance with a determination that the movement of the fingerprint is in a first direction, the device allows navigating through the first user interface, and in accordance with a determination that the movement of the fingerprint is in a second direction different from the first direction, the device allows displaying a second user interface different from the first user interface on the display.

Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing. A hybrid antenna is also described herein. The hybrid antenna can include first and second flexible members capable of facilitating wireless communication, where the first and second flexible members are affixed to one another via a metal member.

Abstract: Antenna related features of a mobile phone or computing device are disclosed. In one embodiment, wireless control and signal are fed separately through difference types of flexes to optimize performance and cost. In one embodiment, active switching and processing of differing conductive trace lengths are performed on an antenna flex so that antenna performance can be optimized for multiple wireless technologies covering a wide range of wavelengths. In one embodiment, a cantilever arm affixed to a ground screw can provide double grounding in a region with no available screw points due to high z constraint. In one embodiment, a device can provide double feed for antenna through a single screw. In one embodiment, a short pin can be configured to support thinner metal. In one embodiment, a “vibrator bracket/LDS short pin” structure can be used to share a common screw point.

Abstract: An electronic device such as a handheld device may have a rectangular housing with a rectangular periphery. A conductive peripheral housing member may run along the rectangular periphery and may surround the rectangular housing. Radio-frequency transceiver circuitry within the electronic device may be coupled to antenna structures for transmitting and receiving radio-frequency signals. The conductive peripheral housing member may form part of the antenna structures. A gap in the conductive peripheral housing member may be filled with dielectric. The conductive peripheral housing member may be configured to form a recess. The recess may have the shape of a rectangle, oval, diamond, or other shape that overlaps and is bisected by the gap. The recess may also have the shape of a groove that extends around the entire periphery of the housing. The dielectric in the recess may include one or more different materials such as clear and opaque polymers.

Abstract: The underside of an inactive portion of a display cover layer in an electronic device may be covered with an opaque masking material. Openings in the opaque masking material may be form ambient light sensor and proximity sensor windows. An ambient light sensor window may be filled with a material that transmits at least some visible light. A proximity sensor window may be filled with a material that transmits more infrared light relative to visible light than the material in the ambient light sensor window. The materials in the ambient light sensor window and proximity sensor window may include one or more layers of ink, patterns of holes, layers of material that are shared with the opaque masking layer, and materials that are black, white, or other colors. A light guide structure may be used to route light received from a sensor window to an associated sensor.

Abstract: A housing for a personal electronic device is described herein. The housing may include at least structural member configured to be arranged within an internal cavity of the housing. The at least structural member is aligned with a feature external to the housing. The at least one structural member is affixed to an interior surface of the internal cavity. Furthermore, the at least structural member and housing are co-machined to define a coaxial aperture for accepting the feature.

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.

Abstract: The described embodiments relate generally to improvements to injection molding equipment. More specifically, concepts for reducing sink and improving cosmetics of portions of injection molded parts in close proximity to gate areas of an injection mold are disclosed. A cold runner system is described in which molding material disposed in a mold cavity is separated from excess molding material in the runner system shortly after the mold is filled at a predetermined packing pressure.

Abstract: Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.

Abstract: Custom antenna structures may be used to improve antenna performance and to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may include an antenna tuning element and conductive structures formed from portions of a peripheral conductive housing member and other conductive antenna structures. The antenna tuning element may be connected across a gap in the peripheral conductive housing member. The custom antenna structures may be used to couple the antenna tuning element to a fixed custom location on the peripheral conductive housing member to help satisfy design criteria and to compensate for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance. Custom antenna structures may include springs and custom paths on dielectric supports.

Abstract: Certain embodiments may take the form of an electronic device having a metal housing encapsulating operative circuitry for the device. The electronic device includes an attachment member coupled to the metal housing at an attachment point. An antenna is coupled to the attachment member and communicatively coupled to the operative circuitry in the metal housing via the attachment point to enable the electronic device to communicate wirelessly.

Abstract: Electromechanical slide switches are provided. The electromechanical slide switches can include conductive components that are configured to change position relative to one another in response to a mechanical input. The electromechanical slide switch can include a number of cooperating intrusion barriers that combine to prevent intrusion of external agents, such as water or dust.

Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.