Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using generative design processes, where three dimensional (3D) models of the physical structures can be produced to include lattices, hollows, holes, and combinations thereof, include: obtaining design criteria for an object; iteratively modifying 3D topology and shape(s) for the object using generative design process(es) that employ a macrostructure representation, e.g., using level-set method(s), in combination with physical simulation(s) that place void(s) in solid region(s) or solid(s) in void region(s) of the generative model of the object; and providing a 3D model of the generative design for the object for use in manufacturing a physical structure corresponding to the object using one or more computer-controlled manufacturing systems.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of dies on a package substrate, and a plurality of smart dies on the package substrate, where the plurality of smart dies include a plurality of interconnects and a plurality of capacitors. The semiconductor package also includes a plurality of routing lines coupled to the dies and the smart dies, where the routing lines are communicatively coupled to the interconnects of the smart dies, where each of the dies has at least two or more routing lines to communicatively couple the dies together, and where one of the routing lines is via the interconnects of the smart dies. The capacitors may be a plurality of metal-insulator-metal (MIM) capacitors. The dies may be a plurality of active dies. The routing lines may communicatively couple first and second active dies to first and second smart dies.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using data format conversion (e.g., of output(s) from generative design processes) and user interface techniques that facilitate the production of 3D models of physical structures that are readily usable with 2.5-axis subtractive manufacturing, include: modifying smooth curves, which have been fit to contours representing discrete height layers of an object, to facilitate the 2.5-axis subtractive manufacturing; preparing an editable model of the object using a parametric feature history, which includes a sketch feature, to combine extruded versions of the smooth curves to form a 3D model of the object in a boundary representation format; reshaping a subset of the smooth curves responsive to user input with respect to the sketch feature; and replaying the parametric feature history to reconstruct the 3D model of the object, as changed by the user input.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using data format conversion (e.g., of output(s) from generative design processes) and user interface techniques that facilitate the production of 3D models of physical structures that are readily usable with 2.5-axis subtractive manufacturing, include: modifying smooth curves, which have been fit to contours representing discrete height layers of an object, to facilitate the 2.5-axis subtractive manufacturing; preparing an editable model of the object using a parametric feature history, which includes a sketch feature, to combine extruded versions of the smooth curves to form a 3D model of the object in a boundary representation format; reshaping a subset of the smooth curves responsive to user input with respect to the sketch feature; and replaying the parametric feature history to reconstruct the 3D model of the object, as changed by the user input.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C1-C8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using generative design processes, where three dimensional (3D) models of the physical structures can be produced to include lattices, hollows, holes, and combinations thereof, include: obtaining design criteria for an object; iteratively modifying 3D topology and shape(s) for the object using generative design process(es) that employ a macrostructure representation, e.g., using level-set method(s), in combination with physical simulation(s) that place void(s) in solid region(s) or solid(s) in void region(s) of the generative model of the object; and providing a 3D model of the generative design for the object for use in manufacturing a physical structure corresponding to the object using one or more computer-controlled manufacturing systems.

Abstract: The systems and methods disclosed herein provide an improved processor package to determine a connection type between the package and an external circuit and to optimize processor performance based on the connection type. As a non-limiting example, a processor package consistent with the present disclosure may include a central processing unit (CPU) die and a plurality of pins (including two connection detection pins) to connect the package to a motherboard. The CPU die may include connection determination logic and execution policy logic, implemented via processor code (“p-code”), as well as a more typical processor.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of dies on a package substrate, and a plurality of smart dies on the package substrate, where the plurality of smart dies include a plurality of interconnects and a plurality of capacitors. The semiconductor package also includes a plurality of routing lines coupled to the dies and the smart dies, where the routing lines are communicatively coupled to the interconnects of the smart dies, where each of the dies has at least two or more routing lines to communicatively couple the dies together, and where one of the routing lines is via the interconnects of the smart dies. The capacitors may be a plurality of metal-insulator-metal (MIM) capacitors. The dies may be a plurality of active dies. The routing lines may communicatively couple first and second active dies to first and second smart dies.

Abstract: The present subject matter may include an electronic device. The electronic device may include a motherboard socket body. The motherboard socket body may be adapted to couple with a processor. The motherboard socket body may define an aperture in the motherboard socket body. The electronic device may include a socket insulator. The socket insulator may be coupled with the aperture in the motherboard socket body. The socket insulator may include an insulator body that may be sized and shaped to close the aperture in the motherboard socket body. The socket insulator may be configured to isolate electrical communication in portions of the motherboard socket body.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using generative design processes, where three dimensional (3D) models of the physical structures are produced to include lattices and hollows, include: obtaining design criteria for an object; iteratively modifying 3D topology and shape(s) for the object using a generative design process that represents the 3D topology as one or more boundaries between solid(s) and void(s), in combination with physical simulation(s) with a hollow structure and a lattice representation; adjusting a thickness of the hollow structure; adjusting lattice thickness or density; and providing a 3D model of the generative design for the object for use in manufacturing a physical structure corresponding to the object using one or more computer-controlled manufacturing systems.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using data format conversion (e.g., of output(s) from generative design processes) and user interface techniques that facilitate the production of 3D models of physical structures that are readily usable with 2.5-axis subtractive manufacturing, include: modifying smooth curves, which have been fit to contours representing discrete height layers of an object, to facilitate the 2.5-axis subtractive manufacturing; preparing an editable model of the object using a parametric feature history, which includes a sketch feature, to combine extruded versions of the smooth curves to form a 3D model of the object in a boundary representation format; reshaping a subset of the smooth curves responsive to user input with respect to the sketch feature; and replaying the parametric feature history to reconstruct the 3D model of the object, as changed by the user input.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using generative design processes, where three dimensional (3D) models of the physical structures are produced to include lattices and hollows, include: obtaining design criteria for an object; iteratively modifying 3D topology and shape(s) for the object using a generative design process that represents the 3D topology as one or more boundaries between solid(s) and void(s), in combination with physical simulation(s) with a hollow structure and a lattice representation; adjusting a thickness of the hollow structure; adjusting lattice thickness or density; and providing a 3D model of the generative design for the object for use in manufacturing a physical structure corresponding to the object using one or more computer-controlled manufacturing systems.

Abstract: The present subject matter may include an electronic device. The electronic device may include a motherboard socket body. The motherboard socket body may be adapted to couple with a processor. The motherboard socket body may define an aperture in the motherboard socket body. The electronic device may include a socket insulator. The socket insulator may be coupled with the aperture in the motherboard socket body. The socket insulator may include an insulator body that may be sized and shaped to close the aperture in the motherboard socket body. The socket insulator may be configured to isolate electrical communication in portions of the motherboard socket body.

Abstract: In accordance with a method a plurality of subscriber systems are provided, the systems being coupled via a Wide Area Network (WAN) and comprising a first subscriber system. The first subscriber system has processing and non-volatile storage and is suitably programmed for providing a subscriber service to a first subscriber. The first system is disposed in an unsecured location, which is associated with the first subscriber. Subsequently, the subscriber service is provided to the first subscriber. Separately, a task is provided to the first subscriber system via the WAN and is executed on the first subscriber system. An activity record for the execution of the task is logged, based on an amount of at least one of the processing and the non-volatile storage consumed on the first subscriber system during execution of the task.