Patents by Inventor Daniel Yohannes

Daniel Yohannes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991935
    Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: May 21, 2024
    Assignee: SeeQC, Inc.
    Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
  • Publication number: 20230380302
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 23, 2023
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Publication number: 20230337553
    Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.
    Type: Application
    Filed: November 21, 2022
    Publication date: October 19, 2023
    Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
  • Patent number: 11747196
    Abstract: Superconducting nanowire single photon detectors have recently been developed for a wide range of applications, including imaging and communications. An improved detection system is disclosed, whereby the detectors are monolithically integrated on the same chip with Josephson junctions for control and data processing. This enables an enhanced data rate, thereby facilitating several new and improved applications. A preferred embodiment comprises integrated digital processing based on single-flux-quantum pulses. An integrated multilayer fabrication method for manufacturing these integrated detectors is also disclosed. Preferred examples of systems comprising such integrated nanowire photon detectors include a time-correlated single photon counter, a quantum random number generator, an integrated single-photon imaging array, a sensitive digital communication receiver, and quantum-key distribution for a quantum communication system.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: September 5, 2023
    Assignee: SeeQC, Inc.
    Inventors: Amir Jafari-Salim, Daniel Yohannes, Oleg A. Mukhanov, Alan M. Kadin
  • Patent number: 11711985
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: July 25, 2023
    Assignee: SeeQC Inc
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaevskii, Igor Vernik, John Vivalda, Jason Walter
  • Publication number: 20220393089
    Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 8, 2022
    Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
  • Patent number: 11508896
    Abstract: Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 ?A/?m2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: November 22, 2022
    Assignee: Seeqc, inc.
    Inventors: Daniel Yohannes, Mario Renzullo, John Vivalda, Alexander Kirichenko
  • Publication number: 20220237495
    Abstract: The technology disclosed in this patent document can be implemented to combine quantum computing, classical qubit control/readout, and classical digital computing in a scalable computing system based on superconducting qubits and special interconnection designs for connecting hardware components within a multi-stage cryogenic system to provide fast communications between the quantum computing module and its controller while allowing efficient management of wiring with other modules.
    Type: Application
    Filed: October 14, 2021
    Publication date: July 28, 2022
    Inventors: Daniel Yohannes, Igor Vernik, Caleb Jordan, Patrick Truitt, Alex Kirichenko, Amir Jafari Salim, Naveen Katam, Oleg Mukhanov
  • Patent number: 11385099
    Abstract: Superconducting nanowire single photon detectors have recently been developed for a wide range of applications, including imaging and communications. An improved detection system is disclosed, whereby the detectors are monolithically integrated on the same chip with Josephson junctions for control and data processing. This enables an enhanced data rate, thereby facilitating several new and improved applications. A preferred embodiment comprises integrated digital processing based on single-flux-quantum pulses. An integrated multilayer fabrication method for manufacturing these integrated detectors is also disclosed. Preferred examples of systems comprising such integrated nanowire photon detectors include a time-correlated single photon counter, a quantum random number generator, an integrated single-photon imaging array, a sensitive digital communication receiver, and quantum-key distribution for a quantum communication system.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 12, 2022
    Assignee: SeeQC Inc.
    Inventors: Amir Jafari-Salim, Daniel Yohannes, Oleg A. Mukhanov, Alan M. Kadin
  • Publication number: 20210408355
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Patent number: 11121302
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: September 14, 2021
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Patent number: 10833243
    Abstract: Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and/or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 10, 2020
    Assignee: SeeQC Inc.
    Inventors: Sergey K. Tolpygo, Denis Amparo, Richard Hunt, John Vivalda, Daniel Yohannes
  • Patent number: 10829519
    Abstract: Angiotensin (1-7) analogs are provided. Also provided are methods of making such analogs methods for using analogs as therapeutic compositions such as, for example, treatment cancer.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: November 10, 2020
    Assignees: WAKE FOREST UNIVERSITY HEALTH SCIENCES, TENSIVE CONTROLS, INC.
    Inventors: Patricia Gallagher, Ann Tallant, Daniel Yohannes, Kenneth A. Gruber
  • Publication number: 20200262794
    Abstract: Provided herein are compounds of Formula I and Formula II, and compositions comprising the same, as well as methods of use thereof for treating kidney stones (e.g., inhibiting the formation of oxalate kidney stones; treating primary hyperoxaluria), inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting glycolate oxidase (GO).
    Type: Application
    Filed: December 7, 2016
    Publication date: August 20, 2020
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20200261419
    Abstract: Provided herein are methods of treatment for kidney stones, e.g., for controlling or inhibiting the formation of calcium oxalate kidney stones by inhibiting the production of glyoxylate and/or oxalate, treatment of primary hyperoxaluria, etc. In some embodiments, methods comprise administering to a subject in need thereof, in combination, an inhibitor of hydroxyproline dehydrogenase (HYPDH), an inhibitor of glycolate oxidase (GO), and/or another agent for the treatment of kidney stones. Compositions for such use or the use of active agents in the manufacture of a medicament for the treatment of kidney stones are also provided.
    Type: Application
    Filed: December 7, 2016
    Publication date: August 20, 2020
    Applicant: Wake Forest University Health Sciences
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Patent number: 10716770
    Abstract: The present invention relates to compounds that modulate nicotinic receptors as non-competitive antagonists, methods for use, and their pharmaceutical compositions.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: July 21, 2020
    Assignee: Catalyst Biosciences, Inc.
    Inventors: Srinivasa Rao Akireddy, Balwinder Singh Bhatti, Ronald Joseph Heemstra, Jason Speake, Daniel Yohannes, Matt S. Melvin, Yunde Xiao
  • Publication number: 20200119251
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 16, 2020
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Patent number: 10562844
    Abstract: Provided herein are compounds of Formula (I), Formula (II), and Formula (III), and compositions comprising the same, as well as methods of use thereof for controlling or inhibiting the formation of calcium oxalate kidney stones, inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting hydroxyproline dehydrogenase (HYPDH).
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: February 18, 2020
    Assignees: Wake Forest University Health Sciences, UAB Research Foundation
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20190382336
    Abstract: Provided herein are compounds of Formula I, Formula II, and Formula III, and compositions comprising the same, as well as methods of use thereof for controlling or inhibiting the formation of calcium oxalate kidney stones, inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting hydroxyproline dehydrogenase (HYPDH).
    Type: Application
    Filed: August 26, 2019
    Publication date: December 19, 2019
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20190254991
    Abstract: The present invention relates to compounds that modulate nicotinic receptors as non-competitive antagonists, methods for use, and their pharmaceutical compositions.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 22, 2019
    Inventors: Srinivasa Rao Akireddy, Balwinder Singh Bhatti, Ronald Joseph Heemstra, Jason Speake, Daniel Yohannes, Matt S. Melvin, Yunde Xiao