Patents by Inventor Daniel Yohannes

Daniel Yohannes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220237495
    Abstract: The technology disclosed in this patent document can be implemented to combine quantum computing, classical qubit control/readout, and classical digital computing in a scalable computing system based on superconducting qubits and special interconnection designs for connecting hardware components within a multi-stage cryogenic system to provide fast communications between the quantum computing module and its controller while allowing efficient management of wiring with other modules.
    Type: Application
    Filed: October 14, 2021
    Publication date: July 28, 2022
    Inventors: Daniel Yohannes, Igor Vernik, Caleb Jordan, Patrick Truitt, Alex Kirichenko, Amir Jafari Salim, Naveen Katam, Oleg Mukhanov
  • Patent number: 11385099
    Abstract: Superconducting nanowire single photon detectors have recently been developed for a wide range of applications, including imaging and communications. An improved detection system is disclosed, whereby the detectors are monolithically integrated on the same chip with Josephson junctions for control and data processing. This enables an enhanced data rate, thereby facilitating several new and improved applications. A preferred embodiment comprises integrated digital processing based on single-flux-quantum pulses. An integrated multilayer fabrication method for manufacturing these integrated detectors is also disclosed. Preferred examples of systems comprising such integrated nanowire photon detectors include a time-correlated single photon counter, a quantum random number generator, an integrated single-photon imaging array, a sensitive digital communication receiver, and quantum-key distribution for a quantum communication system.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 12, 2022
    Assignee: SeeQC Inc.
    Inventors: Amir Jafari-Salim, Daniel Yohannes, Oleg A. Mukhanov, Alan M. Kadin
  • Publication number: 20210408355
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Patent number: 11121302
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: September 14, 2021
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Patent number: 10833243
    Abstract: Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and/or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 10, 2020
    Assignee: SeeQC Inc.
    Inventors: Sergey K. Tolpygo, Denis Amparo, Richard Hunt, John Vivalda, Daniel Yohannes
  • Patent number: 10829519
    Abstract: Angiotensin (1-7) analogs are provided. Also provided are methods of making such analogs methods for using analogs as therapeutic compositions such as, for example, treatment cancer.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: November 10, 2020
    Assignees: WAKE FOREST UNIVERSITY HEALTH SCIENCES, TENSIVE CONTROLS, INC.
    Inventors: Patricia Gallagher, Ann Tallant, Daniel Yohannes, Kenneth A. Gruber
  • Publication number: 20200261419
    Abstract: Provided herein are methods of treatment for kidney stones, e.g., for controlling or inhibiting the formation of calcium oxalate kidney stones by inhibiting the production of glyoxylate and/or oxalate, treatment of primary hyperoxaluria, etc. In some embodiments, methods comprise administering to a subject in need thereof, in combination, an inhibitor of hydroxyproline dehydrogenase (HYPDH), an inhibitor of glycolate oxidase (GO), and/or another agent for the treatment of kidney stones. Compositions for such use or the use of active agents in the manufacture of a medicament for the treatment of kidney stones are also provided.
    Type: Application
    Filed: December 7, 2016
    Publication date: August 20, 2020
    Applicant: Wake Forest University Health Sciences
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20200262794
    Abstract: Provided herein are compounds of Formula I and Formula II, and compositions comprising the same, as well as methods of use thereof for treating kidney stones (e.g., inhibiting the formation of oxalate kidney stones; treating primary hyperoxaluria), inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting glycolate oxidase (GO).
    Type: Application
    Filed: December 7, 2016
    Publication date: August 20, 2020
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Patent number: 10716770
    Abstract: The present invention relates to compounds that modulate nicotinic receptors as non-competitive antagonists, methods for use, and their pharmaceutical compositions.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: July 21, 2020
    Assignee: Catalyst Biosciences, Inc.
    Inventors: Srinivasa Rao Akireddy, Balwinder Singh Bhatti, Ronald Joseph Heemstra, Jason Speake, Daniel Yohannes, Matt S. Melvin, Yunde Xiao
  • Publication number: 20200119251
    Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 16, 2020
    Inventors: Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg Mukhanov, Mario Renzullo, Andrei Talalaeskii, Igor Vernik, John Vivalda, Jason Walter
  • Patent number: 10562844
    Abstract: Provided herein are compounds of Formula (I), Formula (II), and Formula (III), and compositions comprising the same, as well as methods of use thereof for controlling or inhibiting the formation of calcium oxalate kidney stones, inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting hydroxyproline dehydrogenase (HYPDH).
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: February 18, 2020
    Assignees: Wake Forest University Health Sciences, UAB Research Foundation
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20190382336
    Abstract: Provided herein are compounds of Formula I, Formula II, and Formula III, and compositions comprising the same, as well as methods of use thereof for controlling or inhibiting the formation of calcium oxalate kidney stones, inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting hydroxyproline dehydrogenase (HYPDH).
    Type: Application
    Filed: August 26, 2019
    Publication date: December 19, 2019
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20190254991
    Abstract: The present invention relates to compounds that modulate nicotinic receptors as non-competitive antagonists, methods for use, and their pharmaceutical compositions.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 22, 2019
    Inventors: Srinivasa Rao Akireddy, Balwinder Singh Bhatti, Ronald Joseph Heemstra, Jason Speake, Daniel Yohannes, Matt S. Melvin, Yunde Xiao
  • Publication number: 20190241616
    Abstract: Angiotensin (1-7) analogs are provided. Also provided are methods of making such analogs methods for using analogs as therapeutic compositions such as, for example, treatment cancer.
    Type: Application
    Filed: September 16, 2016
    Publication date: August 8, 2019
    Applicants: WAKE FOREST UNIVERSITY HEALTH SCIENCES, TENSIVE CONTROLS, INC.
    Inventors: PATRICIA GALLAGHER, ANN TALLANT, DANIEL YOHANNES, KENNETH A. GRUBER
  • Patent number: 10283694
    Abstract: A method for increasing the integration level of superconducting electronic circuits, comprising fabricating a series of planarized electrically conductive layers patterned into wiring, separated by planarized insulating layers, with vias communicating between the conductive layers. Contrary to the standard sequence of patterning from the bottom up, the pattern of vias in at least one insulating layer is formed prior to the pattern of wiring in the underlying conductive layer. This enables a reduction in the number of planarization steps, leading to a fabrication process which is faster and more reliable. In a preferred embodiment, the superconductor is niobium and the insulator is silicon dioxide. This method can provide 10 or more wiring layers in a complex integrated circuit, and is compatible with non-planarized circuits placed above the planarized wiring layers.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: May 7, 2019
    Assignee: Hypres, Inc.
    Inventors: Daniel Yohannes, Alexander F. Kirichenko, John Vivalda, Richard Hunt
  • Patent number: 10258582
    Abstract: The present invention relates to compounds that modulate nicotinic receptors as non-competitive antagonists, methods for their synthesis, methods for use, and their pharmaceutical compositions.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: April 16, 2019
    Assignee: Catalyst BioSciences, Inc.
    Inventors: Srinivasa Rao Akireddy, Balwinder Singh Bhatti, Ronald Joseph Heemstra, Jason Speake, Daniel Yohannes, Matt S. Melvin, Yunde Xiao
  • Publication number: 20180271806
    Abstract: The present invention relates to compounds that modulate nicotinic receptors as non-competitive antagonists, methods for their synthesis, methods for use, and their pharmaceutical compositions.
    Type: Application
    Filed: January 23, 2018
    Publication date: September 27, 2018
    Inventors: Srinivasa Rao Akireddy, Balwinder Singh Bhatti, Ronald Joseph Heemstra, Jason Speake, Daniel Yohannes, Matt S. Melvin, Yunde Xiao
  • Publication number: 20180002275
    Abstract: Provided herein are compounds of Formula (I), Formula (II), and Formula (III), and compositions comprising the same, as well as methods of use thereof for controlling or inhibiting the formation of calcium oxalate kidney stones, inhibiting the production of glyoxylate and/or oxalate, and/or inhibiting hydroxyproline dehydrogenase (HYPDH).
    Type: Application
    Filed: January 25, 2016
    Publication date: January 4, 2018
    Inventors: W. Todd Lowther, Ross P. Holmes, Daniel Yohannes
  • Publication number: 20170345990
    Abstract: A method for increasing the integration level of superconducting electronic circuits, comprising fabricating a series of planarized electrically conductive layers patterned into wiring, separated by planarized insulating layers, with vias communicating between the conductive layers. Contrary to the standard sequence of patterning from the bottom up, the pattern of vias in at least one insulating layer is formed prior to the pattern of wiring in the underlying conductive layer. This enables a reduction in the number of planarization steps, leading to a fabrication process which is faster and more reliable. In a preferred embodiment, the superconductor is niobium and the insulator is silicon dioxide. This method can provide 10 or more wiring layers in a complex integrated circuit, and is compatible with non-planarized circuits placed above the planarized wiring layers.
    Type: Application
    Filed: August 17, 2017
    Publication date: November 30, 2017
    Inventors: Daniel Yohannes, Alexander F. Kirichenko, John Vivalda, Richard Hunt
  • Patent number: 9741920
    Abstract: Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and/or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: August 22, 2017
    Assignee: Hypres, Inc.
    Inventors: Sergey K. Tolpygo, Denis Amparo, Richard Hunt, John Vivalda, Daniel Yohannes