Abstract: This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

Abstract: An apparatus is configured according to a transformer based step down topology is provided. The apparatus includes a first transformer that transfers energy from a primary side of the first transformer to a secondary side of the first transformer for driving a load at the secondary side. The apparatus includes a first inductor and a second inductor electrically coupled at the secondary side. The apparatus includes a primary side directional conducting element and a secondary side directional conducting element configured to perform a first phase of transferring the energy through the first inductor and a second phase of transferring the energy through the second inductor. The first inductor induces the second inductor to transfer energy during the first phase and the second inductor induces the first inductor to transfer energy during the second phase.

Abstract: An inductor device includes a first face, a first inductive path, and magnetic permeable material. The first face couples the inductor device to a circuit board. The first inductive path extends between a first terminal on the first face to a second terminal on the first face. A portion of the first inductive path is exposed on a second face of the inductor device. The second face is disposed opposite the first face. The second face supports dissipation of heat conveyed by the first inductive path from the first face to the second face. The magnetic permeable material is disposed between the first face and the second face and carries magnetic flux associated with the first inductive path.

Abstract: An apparatus includes a controller. The controller is operative to determine a magnitude of first output current supplied from a first power converter to a dynamic load and determine a magnitude of second output current supplied from a second power converter to power the dynamic load. The controller controls a magnitude of the first output current with respect to a magnitude of the second content output current depending on a magnitude of total output current consumed by the dynamic load.

Abstract: An inductor device may include a first electrically conductive path and a second electrically conductive path. The first electrically conductive path may extend from a first terminal of the inductor device to a second terminal of the inductor device. The second electrically conductive path may extend from a third terminal of the inductor device to a fourth terminal of the inductor device. The second electrically conductive path may be magnetically coupled to the first electrically conductive path. Each of the third terminal and the fourth terminal may be offset with respect to a virtual axis extending through the first terminal and the second terminal.

Abstract: In an embodiment, a semiconductor package includes a first transistor device having first and second opposing surfaces, a first power electrode and a control electrode arranged on the first surface and a second power electrode arranged on the second surface. A first metallization structure arranged on the first surface includes a plurality of outer contact pads which includes a protective layer of solder, Ag or Sn. A second metallization structure is arranged on the second surface. A conductive connection extending from the first surface to the second surface electrically connects the second power electrode to an outer contact pad of the first metallization structure. A first epoxy layer arranged on side faces and on the first surface of the transistor device includes openings which define a lateral size of the plurality of outer contact pads and a package footprint.

Abstract: An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.

Abstract: A power supply includes a storage component to store an output current value representative of a magnitude of output current supplied by an output voltage of a power converter to power a load. The power supply further includes an offset reference generator and a controller. The offset reference generator produces an offset reference signal, the output current value being offset by the offset reference signal. The controller controls generation of the output voltage of the power converter as a function of the offset output current value with respect to a threshold signal (value). Additionally, the controller is configured to detect a startup mode of a power converter operative to convert an input voltage into an output voltage. During the startup mode, the controller: i) produces a threshold signal having a magnitude that varies over time, and ii) controls operation of switches in the power converter as a function of the threshold signal while the power converter is operated in a diode emulation mode.

Abstract: An apparatus includes a controller. The controller monitors a magnitude of voltage powering a first dynamic load disposed in a series circuit path of multiple dynamic loads. The controller compares the magnitude of the voltage to a reference voltage. Based on the comparing, the controller controls operation of multiple power converter phases in a power converter to maintain a magnitude of the voltage powering the first dynamic load.

Abstract: This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

Abstract: A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.

Abstract: A power semiconductor module arrangement includes a circuit carrier including an electrically insulating substrate and an upper metallization layer disposed on upper side of the electrically insulating substrate, and a plurality of power stage inlays that each include first and second transistor dies and a driver die configured to control switching of the first and second transistor dies. Each of the power stage inlays are modular units comprising terminals that are electrically connected to the first and second transistor dies and the driver die. Each of the power stage inlays is embedded within the electrically insulating substrate. The upper metallization layer comprises conductive connectors that extend over the power stage inlays and connect with the terminals of the terminals of each of the power stage inlays.

Abstract: An apparatus such as a power supply includes a controller and multiple power converter phases. The controller controls operation of the multiple power converter phases to produce an output voltage that powers a load. The multiple power converter phases are coupled in parallel to convert an input voltage into an output voltage. The controller further controls a flow of current through a series circuit path connecting multiple windings of the multiple power converter phases to operate the power supply in different modes.

Abstract: An inductor device includes a first face, a first inductive path, and magnetic permeable material. The first face couples the inductor device to a circuit board. The first inductive path extends between a first terminal on the first face to a second terminal on the first face. A portion of the first inductive path is exposed on a second face of the inductor device. The second face is disposed opposite the first face. The second face supports dissipation of heat conveyed by the first inductive path from the first face to the second face. The magnetic permeable material is disposed between the first face and the second face and carries magnetic flux associated with the first inductive path.

Abstract: An apparatus includes a controller. The controller controls a main power supply to produce an output signal to power multiple dynamic loads such as disposed in series or other suitable configuration. The controller detects a transient power consumption condition associated with a first dynamic load of the multiple dynamic loads. The controller then adjusts control of the main power supply and generation of the output signal based on the detected transient power consumption condition.

Abstract: A semiconductor assembly includes a carrier including a dielectric substrate and a plurality of contact pads disposed on an upper surface of the carrier, first and second surface mount packages mounted on the carrier, first and second discrete inductors respectively mounted over the first and second surface mount packages, wherein the first and second surface mount packages each comprise lower surface terminals that face and electrically connect with the contact pads from the carrier, wherein the first and second surface mount packages each comprise an upper side that faces away from the carrier, and wherein the first and second discrete inductors are respectively thermally coupled to the upper sides of the first and second surface mount packages.

Abstract: Voltage converter inlay modules are provided for embedding within a package substrate, and are configured to supply power to a processor, or similar digital circuit, which is mounted to the package substrate. The package substrate is typically mounted to a circuit board, or similar. The circuit board provides high-voltage, low-current power to the voltage converter module which, in turn, provides low-voltage high-current power to the processor. The voltage converter inlay provides largely vertical current conduction from the circuit board to the processor, thereby reducing conduction losses incurred by lateral current conduction. The location of the voltage converter inlay between the circuit board and the microprocessor minimizes radiation of electromagnetic interference. The number of terminals allocated for providing power to the package substrate may be minimized due to the voltage converter inlay inputting fairly low levels of current.

Abstract: According to one configuration, an inductor device comprises core material and at least a first electrically conductive path. The core material is fabricated from magnetically permeable material. The first electrically conductive path extends axially through the core material from a proximal end of the inductor device to a distal end of the inductor device. The core material is operable to confine first magnetic flux generated from first current flowing through the first electrically conductive path. The inductor device further includes a gap in the core material. The gap (gas or solid material) has a different magnetic permeability than the core material. Inclusion of the gap in the core material provides a way to tune an inductance of the inductor device and increase a magnetic saturation level of the inductor device. The core material includes any number of electrically conductive paths and corresponding gaps.

Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.

Abstract: An inductor device may include a first electrically conductive path and a second electrically conductive path. The first electrically conductive path may extend from a first terminal of the inductor device to a second terminal of the inductor device. The second electrically conductive path may extend from a third terminal of the inductor device to a fourth terminal of the inductor device. The second electrically conductive path may be magnetically coupled to the first electrically conductive path. Each of the third terminal and the fourth terminal may be offset with respect to a virtual axis extending through the first terminal and the second terminal.