Abstract: Embodiments provided herein describe systems and methods for aligning sputtering sources, such as in a substrate processing tool. The substrate processing tool includes at least one sputtering source and a device. Each of sputtering sources includes a target having a central axis. The device has an axis and is detachably coupled to the at least one sputtering source. The device indicates to a user a direction in which the central axis of the target of the at least one sputtering source is oriented.

Abstract: Methods and apparatuses for combinatorial processing using a remote plasma source are disclosed. The apparatus includes a remote plasma source and an inner chamber enclosing a substrate support. An aperture is operable to provide plasma exposure to a site-isolated region on a substrate. A transport system moves the substrate support and is capable of positioning the substrate such that the site-isolated region can be located anywhere on the substrate. Barriers and a gas purge system operate to provide site-isolation. Plasma exposure parameters can be varied in a combinatorial manner. Such parameters include source gases for the plasma generator, plasma filtering parameters, exposure time, gas flow rate, frequency, plasma generator power, plasma generation method, chamber pressure, substrate temperature, distance between plasma source and substrate, substrate bias voltage, or combinations thereof.

Abstract: Embodiments provided herein describe substrate processing tools. The substrate processing tools include a housing defining a processing chamber. A substrate support is coupled to the housing and configured to support a substrate within the processing chamber. The substrate has a central axis. A first annular member is moveably coupled to the housing and positioned within the processing chamber. The first annular member circumscribes the central axis of the substrate. A second annular member is moveably coupled to the housing and positioned within the processing chamber. The second annular member circumscribes the central axis of the substrate. Movement of the first annular member and the second annular member relative to the housing changes a flow of processing fluid through the processing chamber.

Abstract: A computer mouse includes a sliding cover and a control platform. The sliding cover is disposed on the top surface of the computer mouse, and the control platform is disposed under the sliding cover. Several control keys are provided on the control platform. Two rails are provided on the sliding cover and two grooves are provided on the computer mouse so that the sliding cover may be slid downwards. When the sliding cover is slid downwards, the control keys may be automatically activated. When the sliding cover is closed, the computer mouse looks like a regular computer mouse; when the sliding cover is opened, the control keys may be automatically activated and a user may access the control keys.

Abstract: A computer mouse includes a sliding cover and a control platform. The sliding cover is disposed on the top surface of the computer mouse, and the control platform is disposed under the sliding cover. Several control keys are provided on the control platform. Two rails are provided on the sliding cover and two grooves are provided on the computer mouse so that the sliding cover may be slid downwards. When the sliding cover is slid downwards, the control keys may be automatically activated. When the sliding cover is closed, the computer mouse looks like a regular computer mouse; when the sliding cover is opened, the control keys may be automatically activated and a user may access the control keys.

Abstract: A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

Abstract: A semiconductor wafer processing apparatus, and more specifically, a semiconductor substrate support pedestal having a substrate support, an isolator, and first and second heat transfer plates for providing a controllable, uniform temperature distribution across the diameter of a semiconductor wafer. A semiconductor wafer placed upon the pedestal is maintained uniformly at a predetermined temperature by heating the wafer with one or more electrodes embedded within the substrate support and cooling the wafer with a fluid passing through the first and second heat transfer plates.