Abstract: A method is disclosed for forming an array of focusing elements for use in a lithography system. The method involves varying an exposure characteristic over an area to create a focusing element that varies in thickness in certain embodiments. In further embodiments, the method includes the steps of providing a first pattern via lithography in a substrate, depositing a conductive absorber material on the substrate, applying an electrical potential to at least a first portion of the conductive absorber material, leaving a second portion of the conductive material without the electrical potential, and etching the second portion of the conductive material to provide a first pattern on the substrate that is aligned with the first portion of the conductive absorber material.

Abstract: A maskless lithography system is disclosed that includes an array of focusing elements, each of which focuses an energy beam from an array of sources into an array of focal spots in order to create a permanent pattern on an adjacent substrate.

Abstract: A maskiess lithography system is disclosed that includes an array of blazed diffractive zone plates, each of which focuses an energy beam into an array of images in order to create a permanent pattern on an adjacent substrate in certain embodiments. In further embodiments, an array of apodized diffractive elements may also be used.