Patents by Inventor Dario S. Filoteo, Jr.
Dario S. Filoteo, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100144100Abstract: A semiconductor package includes a leadframe having first and second level downset lead extensions, a quad flat nonleaded package (QFN) attached to the first level downset lead extension, and a flip chip die attached to the second level downset lead extension. Another embodiment of a semiconductor package includes a leadframe having a lead, a first quad flat nonleaded package (QFN) connected to the lead, and a second quad flat nonleaded package invertly connected to a top surface of the first quad flat nonleaded package, wherein the second quad flat nonleaded package is wirebonded to the lead. A third embodiment of a semiconductor package includes a leadframe having a lead with a first level downset lead extension, a quad flat nonleaded package (QFN) connected to the first level downset lead extension, and a first wirebondable die attached to a top or bottom surface of the quad flat nonleaded package.Type: ApplicationFiled: February 10, 2010Publication date: June 10, 2010Applicant: STATS CHIPPAC, LTD.Inventors: Emmanuel A. Espiritu, Leo A. Merilo, Rachel L. Abinan, Dario S. Filoteo, JR.
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Publication number: 20100078794Abstract: A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.Type: ApplicationFiled: December 4, 2009Publication date: April 1, 2010Inventors: Philip Lyndon R. Cablao, Dario S. Filoteo, JR., Emmanuel A. Espiritu, Leo A. Merilo
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Patent number: 7687892Abstract: A semiconductor package includes a leadframe having first and second level downset lead extensions, a quad flat nonleaded package (QFN) attached to the first level downset lead extension, and a flip chip die attached to the second level downset lead extension. Another embodiment of a semiconductor package includes a leadframe having a lead, a first quad flat nonleaded package (QFN) connected to the lead, and a second quad flat nonleaded package invertly connected to a top surface of the first quad flat nonleaded package, wherein the second quad flat nonleaded package is wirebonded to the lead. A third embodiment of a semiconductor package includes a leadframe having a lead with a first level downset lead extension, a quad flat nonleaded package (QFN) connected to the first level downset lead extension, and a first wirebondable die attached to a top or bottom surface of the quad flat nonleaded package.Type: GrantFiled: August 8, 2006Date of Patent: March 30, 2010Assignee: STATS ChipPAC, Ltd.Inventors: Emmanuel A. Espiritu, Leo A. Merilo, Rachel L. Abinan, Dario S. Filoteo, Jr.
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Publication number: 20100038771Abstract: A method of manufacturing an integrated circuit package includes: forming a substrate that includes: forming a core layer, forming vias in the core layer, and forming a conductive layer having a predetermined thickness on the core layer and having substantially twice the predetermined thickness in the vias; and forming connections between an integrated circuit die and the conductive layer.Type: ApplicationFiled: October 20, 2009Publication date: February 18, 2010Inventors: Il Kwon Shim, Kwee Lan Tan, Jian Jun Li, Dario S. Filoteo, JR.
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Patent number: 7659608Abstract: A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.Type: GrantFiled: September 15, 2006Date of Patent: February 9, 2010Assignee: Stats Chippac Ltd.Inventors: Philip Lyndon R. Cablao, Dario S. Filoteo, Jr., Emmanuel A. Espiritu, Leo A. Merilo
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Patent number: 7626277Abstract: An integrated circuit package comprises a substrate including a core layer with a through opening and vias. A first conductive layer is on the core layer covering the through opening and a second conductive layer is on the core layer opposite the first conductive layer in the through opening and in the vias contacting the first conductive layer. An integrated circuit die is bonded to the second conductive layer and in the through opening. Connections are between the integrated circuit die and the second conductive layer, and the integrated circuit die and the connections are encapsulated.Type: GrantFiled: November 18, 2005Date of Patent: December 1, 2009Assignee: St Assembly Test Services Ltd.Inventors: Il Kwon Shim, Kwee Lan Tan, Jian Jun Li, Dario S. Filoteo, Jr.
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Patent number: 7622325Abstract: An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.Type: GrantFiled: October 29, 2005Date of Patent: November 24, 2009Assignee: Stats Chippac Ltd.Inventors: IL Kwon Shim, Tsz Yin Ho, Dario S. Filoteo, Jr., Seng Guan Chow
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Patent number: 7619314Abstract: An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die over the integrated circuit package with the die located within the aperture.Type: GrantFiled: October 9, 2007Date of Patent: November 17, 2009Assignee: Stats Chippac Ltd.Inventors: Dario S. Filoteo, Jr., Tsz Yin Ho
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Publication number: 20090152704Abstract: An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.Type: ApplicationFiled: February 24, 2009Publication date: June 18, 2009Inventors: Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan
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Patent number: 7518226Abstract: An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.Type: GrantFiled: February 6, 2007Date of Patent: April 14, 2009Assignee: Stats Chippac Ltd.Inventors: Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan
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Publication number: 20090014866Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.Type: ApplicationFiled: September 24, 2008Publication date: January 15, 2009Inventors: Il Kwon Shim, Dario S. Filoteo, JR., Tsz Yin Ho, Sebastian T. M. Soon
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Patent number: 7445955Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.Type: GrantFiled: July 12, 2005Date of Patent: November 4, 2008Assignee: Stats Chippac Ltd.Inventors: Il Kwon Shim, Dario S Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon
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Patent number: 7439620Abstract: An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.Type: GrantFiled: August 4, 2006Date of Patent: October 21, 2008Assignee: Stats Chippac Ltd.Inventors: Leo A. Merilo, Emmanuel Espiritu, Philip Lyndon Cablao, Dario S. Filoteo, Jr.
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Patent number: 7298038Abstract: An integrated circuit package system including a leadframe having an aperture provided therein and an integrated circuit package mounted to the leadframe over or under the aperture. A die is mounted within the aperture to the integrated circuit package and the die includes a plurality of the die.Type: GrantFiled: February 25, 2006Date of Patent: November 20, 2007Assignee: Stats Chippac Ltd.Inventors: Dario S. Filoteo, Jr., Tsz Yin Ho
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Patent number: 7008820Abstract: A method for manufacturing an integrated circuit package comprises forming a substrate by forming a core layer with a through opening and vias. A first conductive layer is formed on the core layer covering the through opening and a second conductive layer is formed on the core layer opposite the first conductive layer in the through opening and in the vias contacting the first conductive layer. An integrated circuit die is bonded to the second conductive layer and in the through opening. Connections are formed between the integrated circuit die and the second conductive layer, and the integrated circuit die and the connections are encapsulated.Type: GrantFiled: June 10, 2004Date of Patent: March 7, 2006Assignee: ST Assembly Test Services Ltd.Inventors: Il Kwon Shim, Kwee Lan Tan, Jian Jun Li, Dario S. Filoteo, Jr.
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Patent number: 6943057Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.Type: GrantFiled: August 31, 2004Date of Patent: September 13, 2005Assignee: Stats Chippac Ltd.Inventors: IL Kwon Shim, Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon