Patents by Inventor Darren Molloy
Darren Molloy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210182650Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.Type: ApplicationFiled: August 29, 2020Publication date: June 17, 2021Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 11037044Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.Type: GrantFiled: March 23, 2020Date of Patent: June 15, 2021Assignee: AMATECH GROUP LIMITEDInventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 10977542Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.Type: GrantFiled: December 30, 2019Date of Patent: April 13, 2021Assignee: AMTECH GROUP LIMITED INDUSTRIAL ESTATEInventors: Mustafa Lotya, Darren Molloy, David Finn
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Publication number: 20210056375Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.Type: ApplicationFiled: August 29, 2020Publication date: February 25, 2021Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Publication number: 20210056374Abstract: A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.Type: ApplicationFiled: August 29, 2020Publication date: February 25, 2021Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Publication number: 20200387768Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP). The slits in the metal layers may have non-linear shapes.Type: ApplicationFiled: July 31, 2020Publication date: December 10, 2020Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 10839282Abstract: A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 ?m or less; and a spacing between adjacent turns of the track of approximately 25 ?m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).Type: GrantFiled: January 14, 2019Date of Patent: November 17, 2020Assignee: Féinics AmaTech TeorantaInventors: David Finn, Mustafa Lotya, Darren Molloy
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Patent number: 10824931Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard.Type: GrantFiled: January 13, 2019Date of Patent: November 3, 2020Assignee: Féinics AmaTech TeorantaInventors: David Finn, Mustafa Lotya, Darren Molloy
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Patent number: 10783426Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB), a booster antenna (BA) and a metal frame (CMF, DMF) disposed in the card body, in the form of a rectangular metal frame disposed external to the booster antenna (BA). The metal frame may extend continuously around the periphery of the card body as a continuous metal frame (CMF), or may have a slit (S), thereby forming a discontinuous metal frame (DMF). A second metal slug (MS-2) may be disposed at a lower portion of the card body (CB), inside the booster antenna. A smartcard may comprise a plastic card body (CB) and a generally rectangular metal slug (MS) having a main body portion slightly smaller than the card body, and having at least one protrusion extending from corresponding at least one corner of the main body portion of the metal slug to corresponding at least one corner of the card body.Type: GrantFiled: January 29, 2019Date of Patent: September 22, 2020Inventors: David Finn, Mustafa Lotya, Darren Molloy
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Publication number: 20200257953Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.Type: ApplicationFiled: January 14, 2020Publication date: August 13, 2020Inventors: Mustafa Lotya, Darren Molloy, David Finn
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Publication number: 20200250504Abstract: A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.Type: ApplicationFiled: March 3, 2020Publication date: August 6, 2020Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Publication number: 20200250506Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.Type: ApplicationFiled: March 23, 2020Publication date: August 6, 2020Inventors: Mustafa Lotya, David Finn, Darren Molloy
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Patent number: 10733494Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).Type: GrantFiled: March 29, 2018Date of Patent: August 4, 2020Assignee: Féinics AmaTech TeorantaInventors: David Finn, Mustafa Lotya, Darren Molloy
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Publication number: 20200151534Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.Type: ApplicationFiled: December 30, 2019Publication date: May 14, 2020Inventors: Mustafa Lotya, Darren Molloy, David Finn
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Patent number: 10599972Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.Type: GrantFiled: November 26, 2018Date of Patent: March 24, 2020Assignee: Féinics AmaTech TeorantaInventors: David Finn, Mustafa Lotya, Darren Molloy
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Patent number: 10552722Abstract: Smartcard (SC) having a card body (CB) and a conductive coupling frame antenna (CFA) extending as a closed loop circuit around a periphery of the card body, and also extending inwardly so that two portions of the coupling frame antenna are closely adjacent each other, with a gap therebetween. The gap may extend from a periphery of the card body to a position corresponding with a module antenna (MA) of a transponder chip module (TCM) disposed in the card body, and may function like a slit (S) in a coupling frame (CF). A portion of the coupling frame antenna may be arranged to surround the ISO position of the transponder chip module in the card body. A coupling frame antenna (CFA) may be incorporated onto a module tape (MT) for a transponder chip module (TCM).Type: GrantFiled: March 29, 2018Date of Patent: February 4, 2020Assignee: Féinics AmaTech TeorantaInventors: David Finn, Mustafa Lotya, Darren Molloy
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Publication number: 20200034578Abstract: According to the invention, generally, a wireless connection may be established between two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed close to the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone. A coupling antenna (CPA) may have only the two coupler coils connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna. A module may be disposed in only one of the two module openings.Type: ApplicationFiled: September 16, 2019Publication date: January 30, 2020Inventors: David Finn, Mustafa Lotya, Darren Molloy
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Publication number: 20200005114Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB), a booster antenna (BA) and a metal frame (CMF, DMF) disposed in the card body, in the form of a rectangular metal frame disposed external to the booster antenna (BA). The metal frame may extend continuously around the periphery of the card body as a continuous metal frame (CMF), or may have a slit (S), thereby forming a discontinuous metal frame (DMF). A second metal slug (MS-2) may be disposed at a lower portion of the card body (CB), inside the booster antenna. A smartcard may comprise a plastic card body (CB) and a generally rectangular metal slug (MS) having a main body portion slightly smaller than the card body, and having at least one protrusion extending from corresponding at least one corner of the main body portion of the metal slug to corresponding at least one corner of the card body.Type: ApplicationFiled: January 29, 2019Publication date: January 2, 2020Inventors: David Finn, Mustafa Lotya, Darren Molloy
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Patent number: 10518518Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.Type: GrantFiled: May 3, 2018Date of Patent: December 31, 2019Assignee: Féinics AmaTech TeorantaInventors: David Finn, Mustafa Lotya, Darren Molloy
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Publication number: 20190392283Abstract: A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 ?m or less; and a spacing between adjacent turns of the track of approximately 25 ?m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).Type: ApplicationFiled: January 14, 2019Publication date: December 26, 2019Inventors: David Finn, Mustafa Lotya, Darren Molloy