Patents by Inventor David A. Roman

David A. Roman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090281490
    Abstract: Balloon catheters and methods of making and using the same. A balloon catheter may include a catheter shaft and a balloon coupled thereto. A traction member may be coupled to the balloon catheter adjacent the balloon and may extend along a portion or all of the length of the balloon. The traction member can improve traction between the balloon and a target site.
    Type: Application
    Filed: July 20, 2009
    Publication date: November 12, 2009
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Steven A. McAuley, Karen M. Cheves, Loren M. Crow, Gregory S. Kelley, Herbert R. Radisch, JR., Ricardo David Roman, Show-Mean Wu
  • Publication number: 20090259263
    Abstract: Apparatus and methods of fixating bone include repairing or remodeling a hard tissue defect with a composite bone structure. The composite bone structure includes at least two hard tissues or bones and a scaffold material fixed together by an adhesive component. The apparatus and methods include positioning the hard tissues/bones, conforming the scaffold material to at least a portion of a surface of the hard tissues/bones, contacting the adhesive component with the hard tissues/bones and the scaffold material, and changing the material state of the adhesive component to another material state at which the adhesive component fixes together the hard tissues/bones and the scaffold material, thereby forming a composite bone structure having a desired rigidity.
    Type: Application
    Filed: April 11, 2008
    Publication date: October 15, 2009
    Applicant: Biomet Microfixation, Inc.
    Inventors: Shon David Steger, Robert Travis McKee, Shawn David Roman, Bradley James Winterroth
  • Patent number: 7566319
    Abstract: Balloon catheters and methods of making and using the same. A balloon catheter may include a catheter shaft and a balloon coupled thereto. A traction member may be coupled to the balloon catheter adjacent the balloon and may extend along a portion or all of the length of the balloon. The traction member can improve traction between the balloon and a target site.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: July 28, 2009
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Steven A. McAuley, Karen M. Cheves, Loren M. Crow, Gregory S. Kelley, Herbert R. Radisch, Jr., Ricardo David Roman, Show-Mean Wu
  • Patent number: 7424617
    Abstract: An electronic points system that allows consumers to redeem online those points that were earned offline is described. In one implementation, the offline-online points system is applied to a soft drink bottle caps program. A soft drink company is sponsoring a promotions program where certain bottle caps are worth so many points. A consumer buys a soft drink bottle at a local store. The lucky consumer discovers that he is the beneficiary of a winning bottle cap, and in particular, a bottle cap that is worth N points. Instead of redeeming this winning bottle cap in the traditional way, the consumer logs onto the soft drink company's website and registers his bottle cap code. Thereafter, after registration, the consumer can redeem these points for any merchandise that is available for purchase with these points at any participating company's online store.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: September 9, 2008
    Assignee: Yahoo! Inc.
    Inventors: Eric Boyd, Arturo Bejar, Anil Pal, David Roman
  • Patent number: 6919620
    Abstract: A memory card comprising a leadframe which includes a main frame defining a peripheral side. Extending toward the peripheral side of the main frame is a first set of leads, while extending away from the peripheral side is a second set of leads which are disposed in juxtaposed relation to respective ones of the leads of the first set. Positioned upon the main frame and electrically connected to the leads of the first and second sets is an electrical subassembly. A package body at least partially encapsulates the leadframe and the electrical subassembly. Portions of the leads of the first and second sets are exposed within the package body and mimic the structural and functional attributes of the fifty pin connector of a conventional CF card.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: July 19, 2005
    Assignee: Amkor Technology, Inc.
    Inventors: Jeffrey Alan Miks, David Roman, John A. Miranda
  • Publication number: 20040243156
    Abstract: An angioplasty balloon catheter and method of making and using the same. The balloon catheter may include a catheter shaft and a balloon coupled to the shaft. The balloon may include one or more cutting edges or member and may include one or more wings. The wings may include an undulating surface.
    Type: Application
    Filed: May 29, 2003
    Publication date: December 2, 2004
    Applicant: SciMed Life Systems, Inc.
    Inventors: Show-Mean Steve Wu, Ricardo David Roman, Reynaldo Cruz
  • Publication number: 20040193489
    Abstract: An electronic points system that allows consumers to redeem online those points that were earned offline is described. In one implementation, the offline-online points system is applied to a soft drink bottle caps program. A soft drink company is sponsoring a promotions program where certain bottle caps are worth so many points. A consumer buys a soft drink bottle at a local store. The lucky consumer discovers that he is the beneficiary of a winning bottle cap, and in particular, a bottle cap that is worth N points. Instead of redeeming this winning bottle cap in the traditional way, the consumer logs onto the soft drink company's website and registers his bottle cap code. Thereafter, after registration, the consumer can redeem these points for any merchandise that is available for purchase with these points at any participating company's online store.
    Type: Application
    Filed: December 31, 2003
    Publication date: September 30, 2004
    Inventors: Eric Boyd, Arturo Bejar, Anil Pal, David Roman
  • Publication number: 20040127908
    Abstract: A clamp assembly according to the invention can be fixed through an opening between adjacent members. The clamp assembly includes a base, a cap opposing the base, and a post connecting the cap and the base in a fastening position on the adjacent members. The post includes a torque-limiting feature to prevent over tightening of the cap and base. The clamp assembly may further include an applier interacting with the post to position the cap and base in the fastening position. A method according to the invention includes placing the base and cap on opposing internal and external surfaces of the adjacent members. The post is rotated to bring the base and cap to the fastening position, and a torque-limiting feature prevents over tightening. The method may further include removing a distal portion of the post projecting from the cap and leaving a proximal portion of the post projecting from the cap and which can be deformed to secure the base and cap in the fastening position.
    Type: Application
    Filed: December 12, 2003
    Publication date: July 1, 2004
    Inventors: Shawn David Roman, Richard Champion Davis, Jeffrey Allen Duncan, Derek Sean Lewis, Kevin T. Stone
  • Publication number: 20040113481
    Abstract: A generally rectangular vehicle seat frame includes a pair of side members and a pair of cross members. The side members and the cross members have ends defining mating surfaces. The ends of the side members are attached to the respective ends of the cross members such that the mating surfaces are first overlapped at a desired one of multiple positions relative to one another, and then subsequently attached together at the mating surfaces.
    Type: Application
    Filed: September 13, 2002
    Publication date: June 17, 2004
    Inventors: Mohammad Saberan, James Klein, Daniel Armagost, Jeffrey David Roman
  • Patent number: 6685707
    Abstract: A clamp assembly for repairing a bone defect according to the invention includes a base, a cap opposing the base, and a post connecting the cap and the base in a fastening position on adjacent bone plate and surrounding cranium. The clamp assembly may further include an applier interacting with the post to position the cap and base in the fastening position. A method according to the invention includes placing the base and cap on opposing internal and external surfaces of the bone plate, with a portion of each of the base and cap overlapping a border of junction between the bone plate and surrounding bone. The post is rotated to bring the base and cap to the fastening position. The method may further include removing a distal portion of the post projecting from the cap and leaving a proximal portion of the post projecting from the cap and which can be deformed to secure the base and cap in the fastening position.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: February 3, 2004
    Assignee: Walter Lorenz Surgical, Inc.
    Inventors: Shawn David Roman, Richard Champion Davis, III, Jeffrey Allen Duncan, Derek Sean Lewis, Kevin T. Stone
  • Publication number: 20030125743
    Abstract: A clamp assembly according to the invention can be fixed through an opening between adjacent members, each member having a near face and a far face. The clamp assembly includes a base, a cap opposing the base, and a post connecting the cap and the base in a fastening position on the adjacent members. The clamp assembly may further include an applier interacting with the post to position the cap and base in the fastening position. A method according to the invention includes placing the base and cap on opposing internal and external surfaces of the adjacent members, with a portion of each of the base and cap overlapping a border of junction between the members. The post is rotated to bring the base and cap to the fastening position. The method may further include removing a distal portion of the post projecting from the cap and leaving a proximal portion of the post projecting from the cap and which can be deformed to secure the base and cap in the fastening position.
    Type: Application
    Filed: September 25, 2002
    Publication date: July 3, 2003
    Inventors: Shawn David Roman, Richard Champion Davis, Jeffrey Allen Duncan, Derek S. Lewis, Kevin T. Stone
  • Patent number: 6521987
    Abstract: A package for an integrated circuit device, having a die, a die pad, leads, bond wire, and an encapsulant. The lower surfaces of the die pad and the leads are provided with stepped profiles. Structures extending from lateral sides of the leads are formed to prevent the leads from being pulled horizontally from the package. Encapsulant material fills beneath the recessed, substantially horizontal surfaces of the die pad and the leads, and thereby prevents the die pad and the leads from being pulled vertically from the package body. Other portions of the die pad and the leads are exposed within the package for connecting the package externally.
    Type: Grant
    Filed: October 31, 2000
    Date of Patent: February 18, 2003
    Assignee: Amkor Technology, Inc.
    Inventors: Thomas P. Glenn, Scott J. Jewler, David Roman, Jae Hak Yee, Doo Hwan Moon
  • Patent number: 6455356
    Abstract: Methods for making packages and leadframes are enclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material is applied by molding or liquid encapsulation techniques. The encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described partial etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other surface of the die pad and leads are not covered during the encapsulation step, but rather remain exposed at the lower surface of the package for connecting the package externally.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: September 24, 2002
    Assignee: Amkor Technology
    Inventors: Thomas P. Glenn, Scott J. Jewler, David Roman, J. H. Yee, D. H. Moon
  • Patent number: 6339850
    Abstract: The apparatus consists of a mechanism for supplying water to the toilet and flushing water into lavatory, a vessel with solid cleaning detergent in a saturated solution, a portioning mechanism and a water supplying mechanism. The portioning mechanism supplies equal portion saturated or strong detergent solution into tank with every flush. The water supplying mechanism adds water into the vessel and keeps high level of the detergent solution in the vessel. Because the vessel consists several solid detergent tablets and it is full of saturated detergent solution, and because the portion of the detergent solution pouring into the toilet tank is a small fraction of the volume of the solution in the vessel, and an equal portion water has been supplied after each, the solution of the detergent is always saturated. Because the portion of the detergent solution dispensed is always equal the concentration of the detergent in the water of tank is always equal until the last tablet is dissolved.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: January 22, 2002
    Inventor: David Roman Gore
  • Patent number: 6281568
    Abstract: Packages for an integrated circuit device and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other portions of the die pad and leads are exposed at the lower surface of the package for connecting the package externally. A metal leadframe for making an encapsulated package includes an outer frame. A die pad is within and connected to the frame.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: August 28, 2001
    Assignees: Amkor Technology, Inc., Anam Semiconductor Inc.
    Inventors: Thomas P. Glenn, Scott J. Jewler, David Roman, J. H. Yee, D. H. Moon