Patents by Inventor David Abrahams

David Abrahams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133609
    Abstract: A cryogenic system comprising a first cryogenic stage and a second cryogenic stage. A first signal line passing from the first cryogenic stage and is connected to a superconducting thermal break in the second cryogenic stage. A second signal line connecting the superconducting thermal break to a cryogenic device.
    Type: Application
    Filed: August 16, 2021
    Publication date: April 25, 2024
    Inventors: David Abraham, Gerard McVicker, Sri M. Sri-Jayantha, Vijayeshwar Das Khanna, Nicholas A. Masluk
  • Patent number: 11952636
    Abstract: The disclosure relates generally to molecular diagnostic devices configured to amplifying a single nucleotide polymorphism (SNP) locus and discriminate between two or more allelic variants of the SNP, indicating presence or absence of a target allele. In some embodiments, the molecular diagnostic devices are capable of detecting, at point-of-care, SNPs associated with resistance or susceptibility to antibiotic treatment of organism infections. In other aspects, the disclosure provides methods of treatment for disease or disorders (e.g. organism infections) where treatment is guided by presence or absence of an allele at a SNP locus as determined by such molecular diagnostic devices.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: April 9, 2024
    Assignee: Visby Medical, Inc.
    Inventors: Brian Ciopyk, Paul Dentinger, Teresa Abraham, Brandon Ma, Kamal Kajouke, Mackenzie Hunt, Austin Phung, Karl Guegler, David Swenson, Anna H. Postlethwaite
  • Patent number: 11953266
    Abstract: Techniques for utilizing excess heat generated by an oven to generate electricity are provided. In one example, an oven can comprise a coolant pathway positioned adjacent to a hollow space within the oven, wherein the hollow space can contain heat. The oven can also comprise a chamber in fluid communication with the coolant pathway. The oven can further comprise a turbine in fluid communication with the chamber and an outlet. Moreover, the oven can comprise a generator connected to the turbine, wherein rotation of the turbine can power the generator.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: April 9, 2024
    Assignee: TPS IP, LLC
    Inventors: Lyle Oscar Dingman, Michael Abraham Schneck, Gary Allen Hanson, David Allen Strand, Michael Laddie Grande, Geoffry Allen Gromiuk, Steven Edward Kempowski, Jon Allen Ludlum
  • Patent number: 11953267
    Abstract: Techniques for utilizing excess heat generated by an oven to generate electricity are provided. In one example, an oven can comprise a coolant pathway positioned adjacent to a hollow space within the oven, wherein the hollow space can contain heat. The oven can also comprise a chamber in fluid communication with the coolant pathway. The oven can further comprise a turbine in fluid communication with the chamber and an outlet. Moreover, the oven can comprise a generator connected to the turbine, wherein rotation of the turbine can power the generator.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: April 9, 2024
    Assignee: TPS IP, LLC
    Inventors: Lyle Oscar Dingman, Michael Abraham Schneck, Gary Allen Hanson, David Allen Strand, Michael Laddie Grande, Geoffry Allen Gromiuk, Steven Edward Kempowski, Jon Allen Ludlum
  • Publication number: 20240104414
    Abstract: A quantum computing chip device provides an edge based capacitive, intra-chip connection. A first chip includes a first signal line with a distal end positioned proximate to or on an edge of the first chip and a proximal end positioned away from the edge of the first chip. A second chip includes a second signal line with a distal end positioned proximate to or on an edge of the second chip and a proximal end positioned away from the edge of the second chip. The first signal line and the second signal line are configured to conduct a signal. The second signal line of the second chip is disposed in alignment for a capacitive bus connection to the first signal line of the first chip.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Muir Kumph, Oliver Dial, John Michael Cotte, David Abraham
  • Patent number: 11943137
    Abstract: Systems, methods, and computer-readable media are disclosed for proactively and adaptively rerouting data to a healthier path through network, as part of flow provisioning, based on environmental variables associated with devices in the network. The present technology includes identifying a routing path for forwarding traffic flows in a network, receiving diagnostic data of a routing device on the routing path. The diagnostic data include one or more environmental parameters associated with internal state and surroundings of the routing device. Further, the present technology includes comparing the diagnostic data of the routing device with a predetermined threshold and modifying, prior to a failure of the routing device, the routing path to bypass the routing device for at least a portion of the traffic flows based on the comparison between the diagnostic data of the routing device and the predetermined threshold.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: March 26, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Hemamalini Subash, David John Zacks, N Shalini Srinivasan, Rashmi Nikhil Patil, Joel Abraham Obstfeld
  • Patent number: 11936169
    Abstract: An apparatus for the movement of a barrel pack containing spooled wire or cable. The apparatus comprising a frame, a handle attached to the frame, a plurality of wheels rotatably attached to the frame, securing structures attached to the frame, the securing structures securing the barrel pack to the frame and a footage counting assembly attached to the handle. The footage counting assembly counts the amount of footage of wire or cable passing through the footage counting assembly.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: March 19, 2024
    Assignee: Encore Wireless Corporation
    Inventors: Justin Abraham Hrbacek, John Lamar Rhoads, David Wayne Maxey
  • Publication number: 20240086998
    Abstract: Feeds in a network-based marketplace are described. The system receives a request, over a network, from a user that is associated with feed selection information, and identifies source feeds based on the feed selection information. The source feeds respectively include a first plurality of content elements. The system generates a presentation feed by retrieving a second plurality of content elements from the source feeds. The generating is performed continuously and in real-time. The system segments the presentation feed into pages and generates interfaces that include a first interface based on the pages. The system communicates the first interface, over the network, to the user, responsive to the receiving of the request.
    Type: Application
    Filed: March 23, 2022
    Publication date: March 14, 2024
    Applicant: eBay Inc.
    Inventors: Jack Philip Abraham, Andrew David Palmer, Jeffrey Tyson, Christina Mercando, Jason Kotenko, Benjamin Gleitzman, Kyle Lee
  • Patent number: 11908756
    Abstract: Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: February 20, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Abraham, John Michael Cotte
  • Publication number: 20240038723
    Abstract: Systems and techniques that facilitate high-density flip-chip co-packages for superconducting qubits and parametric Josephson devices are provided. In various embodiments, a device can comprise a superconducting qubit wafer that can be coupled, by one or more first bump-bonds, to a parametric Josephson wafer. In various aspects, the device can further comprise a first underfill that surrounds the one or more first bump-bonds. In various instances, the first underfill can protect the parametric Josephson wafer from mechanical and/or chemical degradation associated with subsequent fabrication, processing, and/or handling of the superconducting qubit wafer.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 1, 2024
    Inventors: Jae-Woong Nah, David Abraham, David Lokken-Toyli
  • Patent number: 11878976
    Abstract: The present invention provides compounds of the formula: for use in the treatment of systemic sclerosis, fibrosis (e.g. pulmonary fibrosis), achondroplasia, thanatophoric dysplasia (e.g. type I), severe achondroplasia with developmental delay and acanthosis nigricans (SADDAN), muenke syndrome or cancer.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: January 23, 2024
    Assignee: ELI LILLY AND COMPANY
    Inventors: Adedoyin David Abraham, Desta Doro Bume, Kevin Ronald Condroski, Robert Alan Hazlitt, Timothy Scott Kercher, Andrew Terrance Metcalf, Kaveri Balan Urkalan, Shane Michael Walls, Andrew Karl Dilger
  • Publication number: 20230410817
    Abstract: One embodiment of the present invention sets forth a technique for processing recordings of events. The technique includes applying a machine learning model to a plurality of samples from one or more recordings of the events to generate a plurality of embeddings representing the plurality of samples. The technique also includes generating a plurality of labels that identify speakers associated with the plurality of samples based on metadata comprising timestamps of voice activity during the events and participants associated with the voice activity. The technique further includes storing mappings of the plurality of embeddings to the plurality of labels.
    Type: Application
    Filed: June 19, 2023
    Publication date: December 21, 2023
    Applicant: Cisco Technology, Inc.
    Inventors: Kareem Aladdin Nassar, David Abraham Wiener
  • Publication number: 20230363295
    Abstract: An electronic structure includes a first substrate having a first under bump metallization (UBM) region and a second UBM region formed thereon. One or more solder bumps is deposited onto the first UBM region. A downstop formed on the second UBM region is wider, shallower and more rigid than any one of the solder bumps formed on the first UBM region. A second substrate is joined to the first substrate by the one or more solder bumps located on the first UBM region, and a height of the downstop limits a distance between at least one of the first substrate and the second substrate, or between an object and at least one of the first substrate and the second substrate.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 9, 2023
    Inventors: David Abraham, John Michael Cotte
  • Publication number: 20230363294
    Abstract: A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The predefined region and the bump region are separate regions.
    Type: Application
    Filed: July 8, 2022
    Publication date: November 9, 2023
    Inventors: David Abraham, John Michael Cotte, Nicholas A. Masluk
  • Publication number: 20230363296
    Abstract: Devices and methods that facilitate modular quantum systems with discreet levels of connectivity are provided. In various embodiments, a quantum computing device can comprise one or more modules comprising at least qubits, buses, and readout structures; a plurality of couplers, wherein the plurality of couplers comprises at least two couplers selected from a group consisting of: classical couplers, short-range couplers, and long-range couplers, that are adapted for coupling a plurality of the at least qubits, buses, and readout structures; and a connection from the one or more modules to one or more classical controllers external to a cryogenic environment comprising the one or more modules.
    Type: Application
    Filed: September 28, 2022
    Publication date: November 9, 2023
    Inventors: Oliver Dial, Jay Michael Gambetta, Blake Robert Johnson, Jerry M. Chow, Jason S. Orcutt, David Abraham
  • Publication number: 20230359917
    Abstract: A quantum computing (QC) chip module includes an interposer chip having a footprint. A qubit chip bump is bonded to the interposer chip and arranged so that the qubit chip extends beyond the footprint of the interposer chip. The interposer chip extends beyond an edge of the qubit chip. A wiring harness is connected to the interposer chip.
    Type: Application
    Filed: May 9, 2022
    Publication date: November 9, 2023
    Inventors: David Abraham, John Michael Cotte, Muir Kumph
  • Patent number: 11804442
    Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: October 31, 2023
    Assignee: International Business Machines Corporation
    Inventors: David Abraham, John Michael Cotte, Shawn Anthony Hall
  • Publication number: 20230298031
    Abstract: A method and apparatus for fraud detection during transactions using identity graphs are described. A method includes receiving, at a commerce platform system, a transaction from a user having initial transaction attributes and transaction data. The method also includes determining, by the commerce platform system, an identity associated with the user associated with additional transaction attributes not received with the transaction. Furthermore, the method includes accessing a feature set associated with the initial transaction attributes and the additional transaction attributes that includes machine learning (ML) model features for detecting transaction fraud.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Inventors: Ryan Drapeau, Feiyi Ouyang, Tianshi Zhu, David Abrahams, Joshua Rosen
  • Publication number: 20230261880
    Abstract: A content distribution system includes content receivers that provide a plurality of blockchain databases that store transaction records associated with subscriber requests for content, and a computer system that processes those transaction records and enables authorized content receivers to output requested content.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 17, 2023
    Inventors: Christofer Hardy, David Abraham
  • Publication number: 20230230927
    Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.
    Type: Application
    Filed: March 29, 2023
    Publication date: July 20, 2023
    Inventors: David Abraham, John Michael Cotte, Shawn Anthony Hall