Abstract: Described herein are systems, methods, and software to manage actions across a cluster of replica computing nodes for a data structure. In one implementation, a first replica in the cluster generates a first action notification and receives one or more additional action notifications from at least one other replica in the cluster. The first replica further determines that consensus exists for the first action notification based on the one or more additional action notifications and, in response to determining that consensus exists, identifies one or more rules associated with the first action notification and initiates one or more actions corresponding to the one or more rules.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Abstract: A method and apparatus for fraud detection during transactions using identity graphs are described. The method may include receiving, at a commerce platform system, a transaction from a user having initial transaction attributes and transaction data. The method may also include determining, by the commerce platform system, an identity associated with the user, wherein the identity is associated with additional transaction attributes not received with the transaction. Furthermore, the method may include accessing, by the commerce platform system, a feature set associated with the initial transaction attributes and the additional transaction attributes, wherein the feature set comprises machine learning (ML) model features for detecting transaction fraud.

Abstract: Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.

Abstract: One embodiment of the present invention sets forth a technique for processing recordings of events. The technique includes applying a machine learning model to a plurality of samples from one or more recordings of the events to generate a plurality of embeddings representing the plurality of samples. The technique also includes generating a plurality of labels that identify speakers associated with the plurality of samples based on metadata comprising timestamps of voice activity during the events and participants associated with the voice activity. The technique further includes storing mappings of the plurality of embeddings to the plurality of labels.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Abstract: A content distribution system includes content receivers that provide a plurality of blockchain databases that store transaction records associated with subscriber requests for content, and a computer system that processes those transaction records and enables authorized content receivers to output requested content.

Abstract: Embodiments are directed towards employing multiple profiles to track identification of users across multiple domains. Multiple application-domain profiles and multiple web-domain profiles may each include a statistical identifier. A profile enrichment store may be generated from the application-domain profiles and web-domain profiles, where each entry in the profile enrichment store may be based on statistical identifiers. The profile enrichment store may be utilized to determine categories associated with a statistical identifier for a request from a client device. A targeted advertisement may be determined based on the determined category and may be provided to the client device. A client caching identifier may be used in a mobile web domain, in combination with the statistical identifier, to track mobile web users. If a request is associated with a profile that includes an affirmative opt-out flag, categories in the profile enrichment store for a corresponding statistical identifier may be cleaned up.

Abstract: A server receives incoming data records comprising an ID value and respective user attributes corresponding to a user activity that originates at a user device. Characteristics of the activity and/or characteristics of the user device are considered in order to assign a probabilistic confidence value, which is in turn used to generate links from an incoming data record to other previously-received data records, and in so doing, generates a probabilistic link between one set of user attributes from the incoming data record and another set of user attributes from previously-received data records. A messaging campaign specification that describes target user attributes is used to identify a matching set of target audience member records. The determination of a match or not is based on the probabilistic confidence value and a threshold can be varied to extend audience reach. The identified set of target audience member records are transmitted over a network.

Abstract: The present invention provides compounds of the formula: for use in the treatment of systemic sclerosis, fibrosis (e.g. pulmonary fibrosis), achondroplasia, thanatophoric dysplasia (e.g. type I), severe achondroplasia with developmental delay and acanthosis nigricans (SADDAN), muenke syndrome or cancer.

Abstract: Embodiments of a present invention disclose an apparatus including a silicon wafer and a through-silicon-via (TSV) filled with a thermally conductive material located in the silicon wafer, wherein the thermally conductive material has better thermal conduction properties than the silicon wafer when at cryogenic temperatures. A shunt layer connected to the thermal material in the TSV and a heat generating device located directly on top of the thermal material in the TSV and directly on top of the shunt layer, wherein the heat generated by the heat generating device is removed directly by the shunt layer and the thermal material in the TSV.

Abstract: A die stack that includes a first chip die, a second chip die connected to the first chip die by one or more controlled collapse chip connection (“C4”) solder bump bonds, and a spacer die interposed between the first and second chip dies. The spacer die includes through holes for the one or more C4 solder bumps, and has a thickness such that when the first and second chip dies are compressed into contact with the spacer die, the spacer die thickness is a minimum defined spacing between the first and second chip dies, and the spacer die operates as a hard stop against compression of the die stack after the first and second chip dies are compressed into contact with the spacer die.

Abstract: Techniques for creating an offset embedded ground plane cutout for a qubit device to facilitate frequency tuning of the qubit device are presented. A qubit device can comprise a first substrate and second substrate in a flip-chip assembly. The qubit chip assembly can comprise a qubit component fabricated on the first substrate. The qubit component can comprise a Josephson junction (JJ) circuit that can be offset from a center point of the qubit component. The qubit chip assembly can comprise an embedded ground plane situated on a surface of the qubit chip assembly. A cutout section can be formed in the ground plane and positioned over the JJ circuit. The cutout section can enable access of an optical signal or magnetic flux to the JJ circuit. A frequency of the qubit component can be tuned based on application of the optical signal or magnetic flux to the JJ circuit.

Abstract: Techniques for creating an offset embedded ground plane cutout for a qubit device to facilitate frequency tuning of the qubit device are presented. A qubit device can comprise a first substrate and second substrate in a flip-chip assembly. The qubit chip assembly can comprise a qubit component fabricated on the first substrate. The qubit component can comprise a Josephson junction (JJ) circuit that can be offset from a center point of the qubit component. The qubit chip assembly can comprise an embedded ground plane situated on a surface of the qubit chip assembly. A cutout section can be formed in the ground plane and positioned over the JJ circuit. The cutout section can enable access of an optical signal or magnetic flux to the JJ circuit. A frequency of the qubit component can be tuned based on application of the optical signal or magnetic flux to the JJ circuit.

Abstract: A quantum semiconductor device includes a qubit chip; an interposer chip, with a handler, including a through-silicon-via (TSV) coupled to a first side of the qubit chip. A multi-level wiring (MLW) layer contacts an underside of the interposer chip and coupling to the top side of the handler, the TSV facilitates an electrical signal connection between the MLW layer, a topside of the interposer chip and the qubit chip, wherein structure of the device mitigates signal cross-talk across respective lines of the MLW layer.

Abstract: A semiconductor device comprises a first chip layer, having a first chip layer front-side and a first chip layer back-side, a qubit chip layer, having a qubit chip layer front-side and a qubit chip layer back-side, the qubit chip layer front-side operatively coupled to the first chip layer front-side with a set of bump-bonds, a set of through-silicon vias (TSVs) connected to at least one of: the first chip layer back-side or the qubit chip layer back-side and a cap wafer metal bonded to at least one of: the qubit chip layer back-side or the first chip layer back-side.

Abstract: An embodiment of the invention may include a method of forming a device and the resulting structure. The method may include forming a first conductive pattern on a first surface of a substrate. The method may include depositing a first conformal layer on the first surface of the substrate and the first conductive pattern. The method may include planarizing the first conformal layer so that a top surface of the first conductive pattern is substantially planar to a top surface of the first conformal layer. The method may include forming a first electrical component on the top surface of the first conformal layer in contact with the first conductive pattern. This may enable wiring on different levels as the electrical components, while allowing the first electrical component to be built on a substantially planar surface.

Abstract: In one embodiment, the interactive virtual meeting assistant implements a meeting debrief post-processing operation. For a given meeting that the interactive virtual meeting assistant participated in, a meeting post-processing engine enables one or more participants of the meeting to associate a debrief with the meeting. The debrief may be an audio recording, a video recording, text, or any file. The meeting post-processing engine stores the debrief in data stores and provides access to the debrief via the meeting GUI associated with the meeting. The meeting post-processing engine also processes the debrief to generate tasks to be assigned to participants or other entities and/or schedule reminders to be provided to the participants or other entities. The debrief may be private, such that only the participant who provided the debrief may subsequently access the debrief.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.