Patents by Inventor David Amos
David Amos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11968802Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: March 16, 2023Date of Patent: April 23, 2024Assignee: Iceotope Group LimitedInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Patent number: 11963338Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.Type: GrantFiled: October 5, 2022Date of Patent: April 16, 2024Assignee: Iceotope Group LimitedInventors: Neil Edmunds, Jason Matteson, Nathan Longhurst, David Amos
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Publication number: 20240098944Abstract: A manifold is provided for distribution of dielectric coolant within a chassis, to allow the dielectric coolant to receive heat from at least one electronic component mounted within the chassis. The manifold comprises: a circuit board, having first and second opposing surfaces; and a substrate, at least partially spaced apart from the circuit board and a gap between a first surface of the circuit board and the substrate being configured to receive and contain dielectric coolant. One or more apertures are provided in the circuit board or substrate to allow dielectric coolant contained in the gap to flow across the opposing surfaces of the circuit board or substrate.Type: ApplicationFiled: December 14, 2021Publication date: March 21, 2024Inventors: Neil EDMUNDS, David AMOS
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Patent number: 11917796Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.Type: GrantFiled: November 18, 2020Date of Patent: February 27, 2024Assignee: Iceotope Group LimitedInventors: Nathan Longhurst, Jason Matteson, David Amos
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Publication number: 20240032243Abstract: A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.Type: ApplicationFiled: November 18, 2021Publication date: January 25, 2024Inventors: Jason MATTESON, Neil EDMUNDS, David AMOS, William PAGE, Nathan LONGHURST, Mustafa KADHIM, Jasper KIDGER
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Patent number: 11875252Abstract: Some embodiments are directed to a neural network training device for training a neural network. At least one layer of the neural network layers is a projection layer. The projection layer projects a layer input vector (x) of the projection layer to a layer output vector (y). The output vector (y) sums to the summing parameter (k).Type: GrantFiled: May 17, 2019Date of Patent: January 16, 2024Inventors: Brandon David Amos, Vladlen Koltun, Jeremy Zieg Kolter, Frank RĂ¼diger Schmidt
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Publication number: 20230420799Abstract: Nonwoven battery separators, batteries comprising nonwoven battery separators, and methods of manufacturing nonwoven battery separators having improved durability and resilience for better in-service performance, more long-term durability, and safer battery products, wherein the nonwoven battery separator is coated with inorganic oxides.Type: ApplicationFiled: June 27, 2023Publication date: December 28, 2023Applicant: GLATFELTER CORPORATIONInventors: Christopher John JOWSEY, David Amos Rittenhouse, Vishal BANSAL
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Patent number: 11778790Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.Type: GrantFiled: March 23, 2022Date of Patent: October 3, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: Neil Edmunds, Andrew Young, David Amos
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Patent number: 11737247Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.Type: GrantFiled: June 22, 2021Date of Patent: August 22, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: Neil Edmunds, Andrew Young, David Amos
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Publication number: 20230240042Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: March 16, 2023Publication date: July 27, 2023Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20230217629Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: March 16, 2023Publication date: July 6, 2023Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Patent number: 11653472Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: February 23, 2022Date of Patent: May 16, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20230096875Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.Type: ApplicationFiled: October 5, 2022Publication date: March 30, 2023Inventors: Neil Edmunds, Jason Matteson, Nathan Longhurst, David Amos
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Publication number: 20230083799Abstract: A housing is provided for mounting within an enclosure, for example a module for cooling electronic devices, that is arranged to contain a liquid coolant. The housing comprises: a wall structure, arranged to define a plurality of mounting chambers, each mounting chamber being configured to hold at least one respective electronic device and having a respective chamber coolant inlet for receiving liquid coolant, such that liquid coolant received through each chamber coolant inlet accumulates in the respective mounting chamber around the respective electronic device; a housing coolant inlet, for receiving liquid coolant from outside the housing; and a liquid coolant manifold, arranged to receive liquid coolant from the housing coolant inlet and provide the received liquid coolant to each of the chamber coolant inlets.Type: ApplicationFiled: February 11, 2021Publication date: March 16, 2023Inventors: Andrew SHAW, Jasper KIDGER, Neil EDMUNDS, David AMOS
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Patent number: 11596082Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: September 2, 2022Date of Patent: February 28, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20220418156Abstract: A cold plate is configured to use isolated primary and secondary liquid coolants and comprises: a thermally conductive body defining an internal volume and arranged for mounting with respect to an electronic device, so as to transfer heat from the electronic device to the internal volume; a coolant inlet for receiving the secondary liquid coolant into the internal volume to receive the transferred heat; and a coolant outlet for the secondary liquid coolant to flow out of the internal volume. The thermally conductive body is configured to define an external receptacle having a volume arranged to receive and retain the primary liquid coolant for heat transfer between the primary and secondary liquid coolants. The cold plate may form part of a system for cooling electronic devices.Type: ApplicationFiled: November 18, 2020Publication date: December 29, 2022Inventors: Alexander Cushen, Neil Edmunds, David Amos
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Publication number: 20220418153Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: September 2, 2022Publication date: December 29, 2022Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20220408609Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.Type: ApplicationFiled: November 18, 2020Publication date: December 22, 2022Inventors: Nathan Longhurst, Jason Matteson, David Amos
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Publication number: 20220400579Abstract: A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.Type: ApplicationFiled: November 18, 2020Publication date: December 15, 2022Inventors: Nathan Longhurst, Jason Matteson, David Amos
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Patent number: D972619Type: GrantFiled: December 17, 2020Date of Patent: December 13, 2022Assignee: E.D. Bullard CompanyInventors: Alain Laurent, Jonathan Price, David Amos Ward