Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: Devices are provided that include a device housing defining and a maximum dielectric cooling liquid level, and a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space. The cooling liquid outlet weir can set the level of the dielectric cooling liquid within the interior space and establish a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of heat-generating electronic components.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant;. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: A brace for a part of a body includes a first conductive fiber associated with a first polarity, and a second conductive fiber associated with a second polarity different from the first polarity. The second fiber is woven together with the first fiber and insulated from the first fiber. The brace also includes a selectively electrically activated cross-linking agent between the first and second fibers. The agent is constructed to cross-link in a first active mode when the first and second fibers are electrified and is constructed to not cross-link in a second inactive mode when the first and second fibers are not electrified. The brace surrounds a body part, such as a knee or neck. The agent can include an ER fluid and/or EAP. A brace system includes a selectively electrically activated brace for the part of the body.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: A wrapped heating assembly may be wrapped around a tubular member for heating the tubular member. The wrapped heating assembly includes an outer insulation sleeve and a pocketed heating system that is fixed to an inner surface of the outer insulation sleeve in a manner that forms longitudinal pockets that extend between a first end of the outer insulation sleeve and a second end of the outer insulation sleeve. One or more heater strips are each respectively inserted longitudinally into a corresponding one of the pockets, wherein heat is generated by the heater strips when electrical current flows through the heater strips for heating the tubular member in a wrapped position. Multiple wrapped heating assemblies may be daisy chained together by electrical connectors into a heating system with a single thermostat and linked to a single power source to accommodate a wide range of configurations of tubular member systems.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: A protective helmet adapted to receive and protect the head of a wearer includes an outer shell and an attachment ring removably secured to the outer shell, such that the attachment ring can be selectively attached to or detached and removed from the outer shell. The outer shell is shaped to protect the head of the wearer of the protective helmet and defines a bottom opening and an internal cavity for receiving the head of the wearer. The attachment ring acts as a point of attachment for, and thus secures, one or more components of the protective helmet configured to engage the head of the wearer, such that the components secured to the attachment ring are transported with the attachment ring when the attachment ring is detached and removed from the outer shell.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: Some embodiments are directed to a neural network training device for training a neural network. At least one layer of the neural network layers is a projection layer. The projection layer projects a layer input vector (x) of the projection layer to a layer output vector (y). The output vector (y) sums to the summing parameter (k).

Abstract: An adapter for connecting a breathing tube to a headpiece includes: a housing including a first portion configured to connect to a breathing tube, a second portion configured to connect to a headpiece, and a hollow cavity extending through the first portion and the second portion to define a flow path for breathable air received from the breathing tube to travel through the adapter for delivery to the headpiece; and a speaker configured to emit an audible sound into the flow path. The speaker is positioned within the housing so that, when the adapter is connected to a breathing tube and a headpiece of a respirator system, the speaker is in close proximity to the headpiece to help ensure sound emitted from the speaker is audible to a user wearing the headpiece. The speaker is also positioned outside of the flow path to prevent air flow obstruction within the adapter.

Abstract: A power generation system burns a fuel in a gas in a combustion chamber, producing one or more combustion products and heating a working fluid, preferably supercritical CO2, that is chemically the same as a combustion product. The working fluid is mixed with the combustion products to form a combustion output mixture which is used in a turbine to drive a shaft of the turbine connected with a generator, producing electricity. The turbine outputs an exhaust that goes to a working fluid recycling system that connects the turbine outlet with the combustion chamber. The fluid recycling system has a radial compressor that receives and pressurizes the exhaust mixture and sends it to a chamber that has a bleed outlet and a recycling outlet.