Abstract: A multi-module wearable device. According to an embodiment of the present disclosure, there is provided a system, including: a first wearable instrument; a second wearable instrument including a biometric sensor; an electrical connection between the first wearable instrument and the second wearable instrument; and a strap, sized and dimensioned to be disposed about a wrist. The electrical connection may be capable of connecting the first wearable instrument to the second wearable instrument when the second wearable instrument is at a first position on the strap relative to the first wearable instrument, and of connecting the first wearable instrument to the second wearable instrument when the second wearable instrument is at a second position on the strap relative to the first wearable instrument.

Abstract: An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.

Abstract: A semiconductor package. In some embodiments, the package has a top surface and a bottom surface, and includes: a semiconductor die having a front surface, a back surface, and a plurality of edges; a mold compound, on the back surface of the die and the edges of the die; a plurality of first conductive elements extending through the mold compound on the back surface of the die to the top surface of the package; and a plurality of second conductive elements on the bottom surface of the package.

Abstract: A sensor system for diffuse reflectance tissue monitoring, the sensor system comprising: one or more integrated photonic silicon or silicon nitride broadband transceiver circuits for multi-wavelength diffuse reflectance tissue monitoring, wherein the one or more transceiver circuits includes a transmitter photonic integrated circuit (PIC), the transmitter PIC comprising an optical phased array (OP A) the OP A comprising a steering mechanism to steer transmitted light across the tissue.

Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

Abstract: An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.

Abstract: A Mach-Zehnder waveguide modulator. In some embodiments, the Mach-Zehnder waveguide modulator includes a first arm including a first optical waveguide, and a second arm including a second optical waveguide. The first optical waveguide includes a junction, and the Mach-Zehnder waveguide modulator further includes a plurality of electrodes for providing a bias across the junction to enable control of the phase of light travelling through the junction.

Abstract: A modulator. In some embodiments, the modulator includes a portion of an optical waveguide, the waveguide including a rib extending upwards from a surrounding slab. The rib may have a first sidewall, and a second sidewall parallel to the first sidewall. The rib may include a first region of a first conductivity type, and a second region of a second conductivity type different from the first conductivity type. The second region may have a first portion parallel to and extending to the first sidewall, and a second portion parallel to the second sidewall. The first region may extend between the first portion of the second region and the second portion of the second region.

Abstract: A faceplate pluggable remote laser source and system incorporating such a laser source. The system may include an enclosure having a faceplate; a first optical connector, in the faceplate; a laser module; and a loopback fiber cable, connected between the laser module and the first optical connector. The faceplate may form an exterior boundary of the enclosure. The laser module may have a first end including an electrical interface, and a second end including an optical interface. The first end of the laser module may be engaged in a receptacle in the faceplate, and the second end of the laser module may extend outside the faceplate. The laser module may be configured to receive electrical power through the electrical interface, and to produce unmodulated light at the optical interface. The loopback fiber cable and the first optical connector may be configured to route the unmodulated light back into the enclosure.

Abstract: A modulator. In some embodiments, the modulator includes a portion of an optical waveguide, the waveguide including a rib extending upwards from a surrounding slab. The rib may have a first sidewall, and a second sidewall parallel to the first sidewall. The rib may include a first region of a first conductivity type, and a second region of a second conductivity type different from the first conductivity type. The second region may have a first portion parallel to and extending to the first sidewall, and a second portion parallel to the second sidewall. The first region may extend between the first portion of the second region and the second portion of the second region.

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Abstract: An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Abstract: A faceplate pluggable remote laser source and system incorporating such a laser source. The system may include an enclosure having a faceplate; a first optical connector, in the faceplate; a laser module; and a loopback fiber cable, connected between the laser module and the first optical connector. The faceplate may form an exterior boundary of the enclosure. The laser module may have a first end including an electrical interface, and a second end including an optical interface. The first end of the laser module may be engaged in a receptacle in the faceplate, and the second end of the laser module may extend outside the faceplate. The laser module may be configured to receive electrical power through the electrical interface, and to produce unmodulated light at the optical interface. The loopback fiber cable and the first optical connector may be configured to route the unmodulated light back into the enclosure.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

Abstract: An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

Abstract: A modulator. In some embodiments, the modulator includes a portion of an optical waveguide, the waveguide including a rib extending upwards from a surrounding slab. The rib may have a first sidewall, and a second sidewall parallel to the first sidewall. The rib may include a first region of a first conductivity type, and a second region of a second conductivity type different from the first conductivity type. The second region may have a first portion parallel to and extending to the first sidewall, and a second portion parallel to the second sidewall. The first region may extend between the first portion of the second region and the second portion of the second region.

Abstract: A Mach-Zehnder waveguide modulator. In some embodiments, the Mach-Zehnder waveguide modulator includes a first arm including a first optical waveguide, and a second arm including a second optical waveguide. The first optical waveguide includes a junction, and the Mach-Zehnder waveguide modulator further includes a plurality of electrodes for providing a bias across the junction to enable control of the phase of light travelling through the junction.