Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Abstract: A modulator drive circuit, including: a first transistor having: a first output terminal connected to a first reference voltage, a second output terminal connected to a first output terminal of the modulator drive circuit, and a control terminal; and a second transistor having: a first output terminal connected to a second reference voltage different from the first reference voltage, a second output terminal connected to the first output terminal of the modulator drive circuit, and a control terminal.

Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: A modulator drive circuit, including: a first transistor having: a first output terminal connected to a first reference voltage, a second output terminal connected to a first output terminal of the modulator drive circuit, and a control terminal; and a second transistor having: a first output terminal connected to a second reference voltage different from the first reference voltage, a second output terminal connected to the first output terminal of the modulator drive circuit, and a control terminal.

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Abstract: Provided is a burst-mode receiver configured to receive an optical signal having a preamble and a data payload, the burst-mode receiver including a first bias resistor coupled between a first voltage supply and a photosensor, a first capacitor coupled between the photosensor and an amplifier, a first common-mode resistor configured to supply a voltage of a common-mode voltage supply to the amplifier, a first bypass switch configured to couple the first capacitor to the common-mode voltage supply while bypassing the first common-mode resistor, and a first data switch configured to couple the first capacitor to the amplifier, and to couple the first capacitor to the common-mode voltage supply through the first common-mode resistor.

Abstract: Provided is a burst-mode receiver configured to receive an optical signal having a preamble and a data payload, the burst-mode receiver including a first bias resistor coupled between a first voltage supply and a photosensor, a first capacitor coupled between the photosensor and an amplifier, a first common-mode resistor configured to supply a voltage of a common-mode voltage supply to the amplifier, a first bypass switch configured to couple the first capacitor to the common-mode voltage supply while bypassing the first common-mode resistor, and a first data switch configured to couple the first capacitor to the amplifier, and to couple the first capacitor to the common-mode voltage supply through the first common-mode resistor.

Abstract: Provided is a burst-mode receiver configured to receive an optical signal having a preamble and a data payload, the burst-mode receiver including a first bias resistor coupled between a first voltage supply and a photosensor, a first capacitor coupled between the photosensor and an amplifier, a first common-mode resistor configured to supply a voltage of a common-mode voltage supply to the amplifier, a first bypass switch configured to couple the first capacitor to the common-mode voltage supply while bypassing the first common-mode resistor, and a first data switch configured to couple the first capacitor to the amplifier, and to couple the first capacitor to the common-mode voltage supply through the first common-mode resistor.