Patents by Inventor David Auchere

David Auchere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT CHIP COMPRISING ELECTRONIC DEVICE AND ELECTRONIC SYSTEM
    Publication number: 20150103489
    Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.
    Type: Application
    Filed: October 10, 2014
    Publication date: April 16, 2015
    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: David AUCHERE, Yvon IMBS
  • ELECTRONIC DEVICE WITH INTEGRATED CIRCUIT CHIP PROVIDED WITH AN EXTERNAL ELECTRICAL CONNECTION NETWORK
    Publication number: 20150016081
    Abstract: An electronic device may include a substrate, and an integrated circuit over the substrate. The substrate may be provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links may include an impedance-compensating inductor.
    Type: Application
    Filed: July 14, 2014
    Publication date: January 15, 2015
    Inventors: David Auchere, Laurent Marechal