Abstract: A reference electrode of an electrochemical sensor includes a substrate having internal walls defining a well and a channel. The reference electrode includes a conductive element disposed in the substrate. The well extends from a first surface of a substrate towards a second surface of the substrate. The channel is within the substrate. The channel has a first end connected to the well and a second end that is in contact with the conductive element. The reference electrode may include an additional well that extends from the first surface towards the second surface. The additional well may be connected to the second end of the channel and may be in contact with the conductive element. The channel and the wells form a flow path of a conductive medium. The flow path may be coupled to an agitating element or heating element that promotes flow of the conductive medium.

Abstract: A reference electrode of an electrochemical sensor includes a substrate having a well, a channel, and a conductive element. The well extends from a first surface of a substrate towards a second surface of the substrate. The channel is within the substrate. A longitudinal axis of the channel may be substantially perpendicular to a longitudinal axis of the well. The channel has a first end connected to the well and a second end that is in contact with the conductive element. The channel and the wells form a flow path of a conductive medium. The flow path may be coupled to a manipulating element such as an agitating element or heating element that promotes flow of the membrane.

Abstract: A reference electrode of an electrochemical sensor includes a substrate having well, a channel, and a conductive element therein. The well extends from a first surface of a substrate towards a second surface of the substrate. The channel is within the substrate. A longitudinal axis of the channel may be substantially perpendicular to a longitudinal axis of the well. The channel has a first end connected to the well and the conductive element is exposed to a second of the channel. The channel and the wells form a flow path of a conductive medium. A valve is coupled to the flow path and configured to control a flow of the conductive medium to the electrically conductive element through the flow path.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: An alignment tool helps a patient position a chest-worn sensor device, such as a device for daily at-home monitoring of cardiopulmonary health conditions. The alignment tool includes a sensor connector that engages with the sensor device and a strap. The strap includes a first portion that has a protruding region sized to fit into the patient's suprasternal notch. The strap includes a second portion that engages with the sensor connector. The sensor connector and the first portion of the strap with the suprasternal notch protrusion are separated by a configurable length. A healthcare provider may set the length based on the distance between the patient's suprasternal notch and heart.

Abstract: A method of verifying proper functionalization of a sensor and a negative test result obtained by exposing a sensing element functionalized to detect a target analyte to a test sample is described. The method may include, subsequent to or simultaneously with the exposing the sensing element to the test sample, exposing the sensing element to a test confirmation sample, the test confirmation sample comprising at least one of the target analyte in an amount greater than a detection limit of the sensing element and a recombinant protein of the target analyte in an amount greater than a detection limit of the sensing element and performing a measurement using the sensing element to obtain a subsequent test result.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: An optical illuminator assembly such as an integrated module can provide an illumination source for use in applications such as optical detection. A peak output power of the module can be enhanced as compared to other approaches, such as by one or more of controlling parasitic effects along an electrical pathway used to drive an optical emitter circuit included as a portion of the module, or by providing thermal management including establishing thermal conduction pathways through opposite surfaces of an optical emitter circuit such as an integrated circuit die comprising a solid-state optical emitter. Control schemes can be used that power various cells or functional blocks of the optical emitter independently. Thermal regulation can be provided by an active heat transfer element such as a thermoelectric cooler (TEC). An optical illuminator assembly can be optically coupled to a beam-steering device or other elements, such as using a self-aligning mechanical configuration.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.

Abstract: An integrated device package can include a package substrate and a thermoelectric generator (“TEG”) device electrically connected to the package substrate. The TEG device can be configured to convert thermal energy to electrical current. A magnet can be disposed over a bottom side of the TEG device. The magnet can be configured to connect to a heat source and to define a thermally conductive pathway between the heat source and the TEG device. A heat sink can be attached to a top side of the TEG device.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

Abstract: Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.

Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.

Abstract: An integrated circuit is disclosed and includes an Ethernet physical layer (PHY) with a plurality of communication channels. The communication channels coupled to a corresponding plurality of terminals. The integrated circuit further includes a plurality of electrical isolation circuits and a compensation circuit. At least one of the plurality of electrical isolation circuits is coupled to a corresponding one of the plurality of communication channels and electrically isolates the PHY from a corresponding one of the plurality of terminals. The compensation circuit is configured to compensate for at least one of baseline wander and parameter drift associated with at least one of the plurality of isolation circuits. The PHY and the plurality of isolation circuits are integrated on a single substrate.

Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.