Patents by Inventor David Chen

David Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260126972
    Abstract: A data transformation system is provided for extracting source data and transmitting it to a transformation processing unit. The transformation processing unit transforms the source data into standard format data through a mapping profile. By collecting format descriptions of the source data and data examples, in cooperation with documentation and a specification file of a standard format and a specification file of the mapping profile, a language model algorithm is used to create the mapping profile.
    Type: Application
    Filed: November 6, 2024
    Publication date: May 7, 2026
    Inventors: Ta Wei Huang, Yu Ru Chen, Ying Ju Lin, Yu Ting Chen, David Chen, Shan Shan Liu
  • Publication number: 20260119011
    Abstract: The technology described herein improves data security by giving users control over data collected by and/or for machine-learning (ML) systems through a computing system. A first aspect of providing control to the user is the display of a data-collection status indicator. The status indicator, which may take the form of an icon or other user interface feature, communicates whether data collection is active or inactive. A second aspect of providing control to the user is providing a data-collection management interface through which the information collected can be managed. The data-collection management interface allows the user to provide and/or edit data-collection policies and to delete previously collected data. These policies can establish criteria indicating when data may or may not be collected. The data-collection management interface may allow the user to pause data collection for a period of time.
    Type: Application
    Filed: October 24, 2024
    Publication date: April 30, 2026
    Inventors: Medhaj Suresh ATHILKAR, Emma Catherine NESTVOLD, Manisha KUSUMA, David CHEN, Matthew Richard LICHTENBERG, Pratik Pankajbhai MISTRI, Yash MISRA
  • Patent number: 12606081
    Abstract: A cover for covering a car or luggage on top of a car is described. The cover is made of a stretchy material such that it can expand to tightly fit the size and shape of a large variety of items or vehicles. Thus, the material composition as well as cover layers are crucial in obtaining the optimal balance of flexibility and protection. In many embodiments securing mechanisms are provided around the base of the cover as well as over the top of the cover to aid in securing the cover over the items or vehicle. In some embodiments a lower cover is provided which sits under items on top of a vehicle and protects the roof of the vehicle from the items.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: April 21, 2026
    Inventor: David Chen
  • Publication number: 20250313072
    Abstract: A vehicle protector is described. In some embodiments the vehicle protector comprises an outer frame and an interior section. In some embodiments the outer frame and interior section are each one piece, in other embodiments they are both made of multiple pieces, and in another embodiment either the outer frame or interior section are made of multiple pieces. In some embodiments the outer frame and interior section are equipped with fasteners which join the areas together. In other embodiments the outer frame pieces are equipped with fasteners which join them together and in other embodiments the interior section pieces are equipped with fasteners which join them together. In some embodiments the bottom surface comprises features to raise the vehicle protector off of the vehicle. In some embodiments the vehicle protector comprises a lock which secures the sections together to reduce the potential for theft.
    Type: Application
    Filed: June 20, 2025
    Publication date: October 9, 2025
    Inventor: David Chen
  • Publication number: 20250306560
    Abstract: A smart panel system comprises a network of interconnected smart panels, each including subpanels and micropanels. Each micropanel includes layers, such as a processing layer, communications layer, and module controller. The module controller uses an Artificial Intelligence Operating System (AIOS) to control and monitor the subpanels and micropanels. The AIOS includes software Artificial Intelligence (AI) agents dedicated to specific tasks, such as analyzing data, generating prompts, and applying AI outputs to the smart panels. The system can be monitored and controlled remotely using identification data, state data, and operating data transmitted by the smart panels.
    Type: Application
    Filed: March 28, 2025
    Publication date: October 2, 2025
    Applicant: Edlen Habitat & Technologies
    Inventors: Richard Chia Tsing Tong, Matthew Edlen, David Chen, Trang Thuy Le
  • Publication number: 20250248617
    Abstract: The present disclosure relates to automated cardiovascular magnetic resonance imaging systems and methods that can be used to produce both cine and delayed enhancement images with minimal interaction by a clinician and minimal dependence on system hardware and clinician skill and experience. The images may be acquired during patient free-breathing and does not require a contrast agent. The resulting images be time-resolved three-dimensional images having isotropic resolution, permitting retrospective two-dimensional image reconstruction in any plane image reconstruction according to a retrospectively determined inversion time.
    Type: Application
    Filed: January 24, 2025
    Publication date: August 7, 2025
    Inventors: Christopher T. NGUYEN, David CHEN, Deborah KWON, Danielle Kara
  • Patent number: 12380547
    Abstract: Systems and methods for detecting and/or mitigating video artifacts in a video. A processor in a computing device may be configured to receive the video from a video source (e.g., codec or from any other video source compressed or uncompressed) subtract pixel intensities from two consecutive frames in the video to generate a residual, analyze the residual to detect small rectangular shapes, and identifying a video artifact in the video based on a result of the analysis.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: August 5, 2025
    Assignee: Charter Communications Operating, LLC
    Inventors: Srilal M. Weerasinghe, Vipul Patel, David Chen, Erdogan Simsek
  • Patent number: 12365227
    Abstract: A vehicle protector is described. In some embodiments the vehicle protector comprises an outer frame and an interior section. In some embodiments the outer frame and interior section are each one piece, in other embodiments they are both made of multiple pieces, and in another embodiment either the outer frame or interior section are made of multiple pieces. In some embodiments the outer frame and interior section are equipped with fasteners which join the areas together. In other embodiments the outer frame pieces are equipped with fasteners which join them together and in other embodiments the interior section pieces are equipped with fasteners which join them together. In some embodiments the bottom surface comprises features to raise the vehicle protector off of the vehicle. In some embodiments the vehicle protector comprises a lock which secures the sections together to reduce the potential for theft.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: July 22, 2025
    Inventor: David Chen
  • Publication number: 20250125546
    Abstract: A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. Each signal pin in the first set of signal pins is arranged between adjacent buried ground vias in a first direction of the two-dimensional array.
    Type: Application
    Filed: December 21, 2024
    Publication date: April 17, 2025
    Inventors: Woody Maynard, Mayuresh Patki, David Chen, Gary Hsieh
  • Publication number: 20250125551
    Abstract: An electrical connector includes a contact element layer including an array of contact elements. Each contact element includes a base portion and first and second elastic arm portions provided on opposing sides of the base portion, the sides of the base portion being in a direction along a planar surface of the base portion. The first and second elastic arm portions are compliant spring elements and extend in opposite first and second directions relative to the base portion, the first and second directions being perpendicular to the planar surface of the base portion.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 17, 2025
    Inventors: David Chen, Woody Maynard
  • Patent number: 12224510
    Abstract: A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core with first, second and third ground planes isolated from each other and signal vias and ground vias formed therein, conductive signal traces formed coplanar with the second ground plane and isolated from a conductive ground layer forming the second ground plane, where one or more conductive signal traces are shielded by the conductive ground layer and by the first and third ground planes. The connector includes a first set of contact elements electrically connected to signal vias that are electrically connected to first ends of the conductive signal traces and a second set of contact elements electrically connected to signal vias that are electrically connected to second ends of the conductive signal traces.
    Type: Grant
    Filed: January 30, 2024
    Date of Patent: February 11, 2025
    Assignee: Neoconix, Inc.
    Inventors: Woody Maynard, Mayuresh Patki, David Chen, Gary Hsieh
  • Publication number: 20250047022
    Abstract: A single piece electrical connector for connecting two circuit elements incudes a housing and an interconnection member provided therein with an array of electrically conductive and elastic spring contact elements provided on the interconnection member to interconnect the two circuit elements electrically and mechanically in a stacked or coplanar configuration. In some embodiments, the single piece electrical connector connects to interconnection terminals of each circuit element by the application of a force normal to the surfaces of the circuit elements. In some embodiments, the housing of the connector is configured to apply and maintain the normal force between the elastic spring contact elements of the connector and the interconnection terminals of the circuit elements to form low resistance interconnections therebetween.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Bohdan Wozniak, David Chen, Tan Nguyen, Woody Maynard
  • Patent number: 12135174
    Abstract: A heat exchange system for a surgical instrument includes a valve, a load, and a load conduit extending between the valve and the load. The load conduit delivers fluid from the valve to the load. The heat exchange system also includes an exhaust conduit that directs the fluid away from the valve. A portion of the load conduit is positioned so as to thermally transfer heat to a portion of the exhaust conduit.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: November 5, 2024
    Assignee: Medical Instrument Development Laboratories, Inc.
    Inventors: Jeffrey A. Walker, Erik W. Peterson, David Chen
  • Publication number: 20240354918
    Abstract: Systems and methods for detecting and/or mitigating video artifacts in a video. A processor in a computing device may be configured to receive the video from a video source (e.g., codec or from any other video source compressed or uncompressed) subtract pixel intensities from two consecutive frames in the video to generate a residual, analyze the residual to detect small rectangular shapes, and identifying a video artifact in the video based on a result of the analysis.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 24, 2024
    Inventors: Srilal M. WEERASINGHE, Vipul PATEL, David CHEN, Erdogan SIMSEK
  • Patent number: 12081605
    Abstract: Embodiments of the present invention are directed to a Content Delivery Network (CDN) for broadcasting data streams. The CDN allows a streamer to stream live (in realtime) on a network(s), such as the Internet, for a live audience to view and to interact with the live entertainment. Each of the broadcast clients send data streams to the CDN via an input node, wherein the CDN output a selected media stream to one or more selected viewing clients via the output node. The architecture of the CDN contains one or more System Racks. Each of the System Racks contains multiple media channels. In operation, the data stream of a broadcasting client is sent to the CDN and distributed into selected channels. The data streams in each of the selected channels are outputted to viewing clients of a corresponding type.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: September 3, 2024
    Assignee: Caffeine, Inc.
    Inventors: Bao Nguyen, David Chen, George Leontiev, James Birchler, Nick Artman, Paul Kerr, Peter Sankauskas, Ryan Amos
  • Publication number: 20240205511
    Abstract: Methods and apparatus for providing delivery of content to client devices of a network via both multicast and unicast mechanisms. In one embodiment, a system for use in a managed content delivery network is described to bridge multicast to unicast, so that the total network bandwidth consumption is significantly lower than a corresponding unicast-only delivery solution, yet which still provides improved quality of service and user viewing experience as compared to a multicast-only delivery solution. In addition, various exemplary aspects of the present disclosure are readily adapted for real-time multicast to unicast streaming of audio and data to, among other things, minimize network bandwidth usage, while maintaining the guaranteed delivery of unicast streams with little or no modification to the existing client device logic.
    Type: Application
    Filed: February 29, 2024
    Publication date: June 20, 2024
    Inventors: Tom Gonder, William Helms, Kenneth Gould, David Chen, John Chen, Jian Yu, Niem Dang, Vipul Patel
  • Publication number: 20240170867
    Abstract: A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core with first, second and third ground planes isolated from each other and signal vias and ground vias formed therein, conductive signal traces formed coplanar with the second ground plane and isolated from a conductive ground layer forming the second ground plane, where one or more conductive signal traces are shielded by the conductive ground layer and by the first and third ground planes. The connector includes a first set of contact elements electrically connected to signal vias that are electrically connected to first ends of the conductive signal traces and a second set of contact elements electrically connected to signal vias that are electrically connected to second ends of the conductive signal traces.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: Woody Maynard, Mayuresh Patki, David Chen, Gary Hsieh
  • Patent number: 11967782
    Abstract: A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of or in the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Neoconix, Inc.
    Inventors: Woody Maynard, Mayuresh Patki, David Chen, Gary Hsieh
  • Patent number: D1024355
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: April 23, 2024
    Assignee: Peak Innovations Inc.
    Inventors: Craig Lawson, David Chen, Adam Mantei
  • Patent number: D1109897
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: January 20, 2026
    Assignee: Peak Innovations Inc.
    Inventors: David Chen, Craig Lawson