Patents by Inventor David DeKraker
David DeKraker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180190517Abstract: An apparatus for cleaning a microelectronic workpiece and a method of operating is described. The apparatus includes a workpiece holding mechanism to support and hold a workpiece, a chemical supply mechanism configured to supply multiple chemical fluids including gas-phase components and liquid-phase components, a dispense mechanism arranged to dispense one or more chemical compositions onto the workpiece, and a valve mechanism fluidically disposed between the chemical supply mechanism and the dispense mechanism. A control circuit is coupled to the valve mechanism, and configured to (i) flow at least one gas-phase chemical component to a first nozzle array and at least one liquid-phase chemical component to a second nozzle array, and (ii) flow at least one gas-phase chemical component from the chemical supply mechanism to the second nozzle array and at least one liquid-phase chemical component from the chemical supply mechanism to the first nozzle array.Type: ApplicationFiled: December 20, 2017Publication date: July 5, 2018Inventors: David DeKraker, Jeffrey M. Lauerhaas, Jeffery W. Butterbaugh, Alan D. Rose
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Patent number: 9887107Abstract: Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.Type: GrantFiled: February 15, 2016Date of Patent: February 6, 2018Assignee: TEL FSI, INC.Inventors: Mark A. Stiyer, David Dekraker
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Publication number: 20180025904Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the process conditions may be varied between subsequent treatments of a single substrate to target different types of particles with each treatment.Type: ApplicationFiled: September 29, 2017Publication date: January 25, 2018Inventor: David DeKraker
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Patent number: 9831107Abstract: A method and processing system are provided for independent temperature and hydration control for an etching solution used for treating a wafer in process chamber. The method includes circulating the etching solution in a circulation loop, maintaining the etching solution at a hydration setpoint by adding or removing water from the etching solution, maintaining the etching solution at a temperature setpoint that is below the boiling point of the etching solution in the circulation loop, and dispensing the etching solution into the process chamber for treating the wafer. In one embodiment, the dispensing includes dispensing the etching solution into a processing region proximate the wafer in the process chamber, introducing steam into an exterior region that is removed from the wafer in the process chamber, and treating the wafer with the etching solution and the steam.Type: GrantFiled: March 13, 2014Date of Patent: November 28, 2017Assignee: TEL FSI, INC.Inventors: Kevin L Siefering, William P Inhofer, David DeKraker
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Publication number: 20160284535Abstract: A method for stripping material from a microelectronic workpiece is described. The method includes receiving a workpiece having a surface exposing a layer composed of silicon and organic material, and placing the workpiece in a wet clean chamber. In the wet clean chamber, the layer composed of silicon and organic material is removed from the workpiece by exposing the surface of the workpiece to a first stripping agent containing a sulfuric acid composition, and then optionally exposing the surface of the workpiece to a second stripping agent containing dilute hydrofluoric acid (dHF).Type: ApplicationFiled: March 27, 2015Publication date: September 29, 2016Inventors: Jeffrey M. Lauerhaas, Anthony S. Ratkovich, Erik R. Berg, Jeffery W. Butterbaugh, Robert Thomas John Matz, David DeKraker
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Patent number: 9412639Abstract: Embodiments of the invention are directed towards improving on-wafer process performance and processing at increased processing fluid/wafer temperature while maintaining good process performance. A method for processing a wafer in a process chamber is described where the process chamber includes a wafer holder having first and second sets of edge grippers for independently securing the wafer at the wafer edge during processing, treating the wafer with a first processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, treating the wafer with a second processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, and treating the wafer with a third processing fluid while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers.Type: GrantFiled: December 5, 2014Date of Patent: August 9, 2016Assignee: TEL FSI, INC.Inventors: Kevin L. Siefering, David DeKraker
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Publication number: 20160163568Abstract: Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.Type: ApplicationFiled: February 15, 2016Publication date: June 9, 2016Applicant: TEL FSI, Inc.Inventors: Mark A. Stiyer, David Dekraker
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Patent number: 9263303Abstract: Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.Type: GrantFiled: June 10, 2011Date of Patent: February 16, 2016Assignee: TEL FSI, INC.Inventors: Mark A. Stiyer, David Dekraker
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Publication number: 20150162207Abstract: Embodiments of the invention are directed towards improving on-wafer process performance and processing at increased processing fluid/wafer temperature while maintaining good process performance. A method for processing a wafer in a process chamber is described where the process chamber includes a wafer holder having first and second sets of edge grippers for independently securing the wafer at the wafer edge during processing, treating the wafer with a first processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, treating the wafer with a second processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, and treating the wafer with a third processing fluid while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers.Type: ApplicationFiled: December 5, 2014Publication date: June 11, 2015Inventors: Kevin L. Siefering, David DeKraker
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Patent number: 8920577Abstract: A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors.Type: GrantFiled: September 1, 2010Date of Patent: December 30, 2014Assignee: Tel FSI, Inc.Inventors: David DeKraker, Jeffery W. Butterbaugh, Richard E. Williamson
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Publication number: 20140277682Abstract: A method and processing system are provided for independent temperature and hydration control for an etching solution used for treating a wafer in process chamber. The method includes circulating the etching solution in a circulation loop, maintaining the etching solution at a hydration setpoint by adding or removing water from the etching solution, maintaining the etching solution at a temperature setpoint that is below the boiling point of the etching solution in the circulation loop, and dispensing the etching solution into the process chamber for treating the wafer. In one embodiment, the dispensing includes dispensing the etching solution into a processing region proximate the wafer in the process chamber, introducing steam into an exterior region that is removed from the wafer in the process chamber, and treating the wafer with the etching solution and the steam.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: TEL FSI, Inc.Inventors: Kevin L. Siefering, William P. Inhofer, David DeKraker
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Patent number: 8387635Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.Type: GrantFiled: June 20, 2007Date of Patent: March 5, 2013Assignee: Tel FSI, Inc.Inventors: Jimmy D. Collins, David DeKraker, Tracy A. Gast, Alan D. Rose
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Patent number: 8142571Abstract: A process is provided for treating a semiconductor wafer at a target wafer temperature. This process includes the following steps: a) determining the target wafer temperature of the semiconductor wafer during a given wafer treatment process step; b) providing a treatment chamber having at least one semiconductor wafer disposed therein; c) dispensing water vapor into the treatment chamber in an amount to provide the chamber with an atmospheric environment having a dew point sufficiently close to the target wafer temperature to provide a temperature regulating effect; and d) initiating the given wafer treatment process step when the atmospheric environment of the treatment chamber is at the dew point of step c).Type: GrantFiled: May 6, 2009Date of Patent: March 27, 2012Assignee: FSI International, Inc.Inventors: Kurt K. Christenson, David DeKraker
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Publication number: 20110303246Abstract: Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.Type: ApplicationFiled: June 10, 2011Publication date: December 15, 2011Inventors: Mark A. Stiyer, David DeKraker
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Publication number: 20110259376Abstract: The present invention provides methods and apparatuses for controlling the transition between first and second treatment fluids during processing of microelectronic devices using spray processor toolsType: ApplicationFiled: April 11, 2011Publication date: October 27, 2011Inventors: Thomas J. Wagener, Jeffery W. Butterbaugh, David DeKraker
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Patent number: 7913706Abstract: Tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. The invention provides an approach for rapid, efficient rinsing of wetted surface(s), and is particularly advantageous when used to rinse the lower surface of moveable barrier structures such as a barrier plate that overlies a workpiece being treated in such a manner to define a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, the liquid is flowingly dispensed, preferably under laminar flow conditions, onto a surface that is in fluid communication with the surface to be rinsed. A smooth, uniform wetting and sheeting action results to accomplish rinsing with a significantly reduced risk of generating particle contamination.Type: GrantFiled: July 29, 2008Date of Patent: March 29, 2011Assignee: FSI International, Inc.Inventors: David DeKraker, Jimmy D. Collins, Tracy A. Gast, Alan D. Rose, Richard E. Williamson
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Publication number: 20100326477Abstract: A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors.Type: ApplicationFiled: September 1, 2010Publication date: December 30, 2010Inventors: David DeKraker, Jeffery W. Butterbaugh, Richard E. Williamson
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Patent number: 7819984Abstract: A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors.Type: GrantFiled: May 15, 2008Date of Patent: October 26, 2010Assignee: FSI International, Inc.Inventors: David DeKraker, Jeffery W. Butterbaugh, Richard E. Williamson
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Publication number: 20090286334Abstract: A process is provided for treating a semiconductor wafer at a target wafer temperature. This process includes the following steps: a) determining the target wafer temperature of the semiconductor wafer during a given wafer treatment process step; b) providing a treatment chamber having at least one semiconductor wafer disposed therein; c) dispensing water vapor into the treatment chamber in an amount to provide the chamber with an atmospheric environment having a dew point sufficiently close to the target wafer temperature to provide a temperature regulating effect; and d) initiating the given wafer treatment process step when the atmospheric environment of the treatment chamber is at the dew point of step c).Type: ApplicationFiled: May 6, 2009Publication date: November 19, 2009Applicant: FSI INTERNATIONAL, INC.Inventors: Kurt K. Christenson, David DeKraker
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Publication number: 20090038647Abstract: Tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. The invention provides an approach for rapid, efficient rinsing of wetted surface(s), and is particularly advantageous when used to rinse the lower surface of moveable barrier structures such as a barrier plate that overlies a workpiece being treated in such a manner to define a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, the liquid is flowingly dispensed, preferably under laminar flow conditions, onto a surface that is in fluid communication with the surface to be rinsed. A smooth, uniform wetting and sheeting action results to accomplish rinsing with a significantly reduced risk of generating particle contamination.Type: ApplicationFiled: July 29, 2008Publication date: February 12, 2009Inventors: David DeKraker, Jimmy D. Collins, Tracy A. Gast, Alan D. Rose, Richard E. Williamson