Patents by Inventor David Ding-Chung Lu

David Ding-Chung Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Novel structure for reducing low-k dielectric damage and improving copper EM performance
    Publication number: 20080258303
    Abstract: A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a dielectric layer; a chemical mechanical polish (CMP) stop layer on the dielectric layer; a conductive wiring in the dielectric layer; and a metal cap over the conductive wiring.
    Type: Application
    Filed: April 23, 2007
    Publication date: October 23, 2008
    Inventors: Ming-Shih Yeh, Tien-I Bao, David Ding-Chung Lu