Patents by Inventor DAVID DONG

DAVID DONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11026061
    Abstract: A method and apparatus for PTT over IoT is described herein. During operation IoT devices will be dynamically added to a particular talkgroup. The particular devices added to the talkgroup will be based on a current public-safety event along with a location of the public-safety officer.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: June 1, 2021
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Guo Dong Gan, Yen Hsiang Chew, Jin Hoe Phua, Tejeash Duraimanickam, Jacob Shem Tov, David Mizrachi, Ido Merkado
  • Patent number: 11001583
    Abstract: Provided are novel compounds of Formula (I): pharmaceutically acceptable salts thereof, and pharmaceutical compositions thereof, which are useful in the treatment of diseases and disorders mediated by ROR?. Also provided are pharmaceutical compositions comprising the novel compounds of Formula (I) and methods for their use in treating one or more inflammatory, metabolic, autoimmune and other diseases or disorders.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: May 11, 2021
    Assignee: Vitae Pharmaceuticals, LLC
    Inventors: David A. Claremon, Lawrence Wayne Dillard, Chengguo Dong, Yi Fan, Stephen D. Lotesta, Andrew Marcus, Suresh B. Singh, Colin M. Tice, Jing Yuan, Wei Zhao, Linghang Zhuang
  • Patent number: 11006484
    Abstract: A skin effect heating system for long pipelines includes a heater cable disposed in a ferromagnetic or other conductive heat tube. A semiconductive jacket contacts the inner surface of the heat tube, where the charge density of the return current carried by the heat tube is at its highest. The semiconductive jacket material has a resistivity that is sufficiently low to reduce or eliminate arcing events such as corona discharge by allowing accumulated charge on the heat tube to dissipate. The resistivity is also high enough to prevent the return current from flowing into or through the semiconductive outer layer, so that heat production capacity of the system is maximized.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: May 11, 2021
    Assignee: nVent Services GmbH
    Inventors: Wesley Dong, Paul Becker, David Parman
  • Patent number: 10969836
    Abstract: Various embodiments of the present disclosure disclose a storage system. The storage system comprises: at least one storage device array enclosure, each of the storage device array enclosure accommodating storage devices, which are arranged in columns and have gaps existing between adjacent storage devices; each storage device array enclosure includes a cap for covering accommodated storage devices; the cap includes vents and windshield bars, such that when the cap is in a closed state, the vents abut against an upper surface of the corresponding storage devices and the windshield bars cover the gaps between adjacent storage devices.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: April 6, 2021
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, David Dong, Hendry Wu, Yujie Zhou
  • Patent number: 10949729
    Abstract: Embodiments of the present disclosure relate to a stabilizing apparatus for a plug-in card, a chassis including the stabilizing apparatus and associated manufacturing method. The stabilizing apparatus comprises a fixed part adapted for attaching the stabilizing apparatus to a chassis for supporting the plug-in card and a contact part electrically coupled to a ground terminal of the chassis and movable towards the plug-in card supported on the chassis along a first positive direction perpendicular to an extended plane of the plug-in card, so as to contact the plug-in card.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: March 16, 2021
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, David Dong, Hendry Xiaoping Wu, Yujie Zhou
  • Patent number: 10948956
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 16, 2021
    Assignee: Dell Products L.P.
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10905032
    Abstract: Embodiments of the present disclosure provide a system and method for heat dissipation of a storage device. The system comprises a guiding rail mounted in an enclosure of the storage device; a set of fans arranged on the guiding rail and being movable on the guiding rail, the set of fans being configured to dissipate heat of a disk assembly of the storage device; and a controller configured to: obtain a temperature of the disk assembly at a first time point; and in response to the temperature of at least one disk in the disk assembly exceeding a threshold temperature, perform at least one of the following: adjusting a position of at least one of the set of fans; and increasing a rotational speed of at least one of the set of fans.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: January 26, 2021
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10869381
    Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: December 15, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10825483
    Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: November 3, 2020
    Assignee: Dell Products, L.P.
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10746219
    Abstract: Embodiments of the present disclosure relate to a screw, a manufacturing method thereof and an associated storage device. The screw includes a screw stem at least partly provided with threads; and a head comprising a rolling element, the rolling element protruding out of a surface of the head and adapted to form rolling contact with an object abutting against the head. By the screw according to embodiments of the present disclosure, an effective support can be provided to the storage device, without interfering with the plug operation of the storage device.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: August 18, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, David Dong, Ricky Liu
  • Patent number: 10729035
    Abstract: The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: July 28, 2020
    Assignee: Dell Products L.P.
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, Yujie Zhou, David Dong
  • Publication number: 20200178383
    Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10672430
    Abstract: The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 2, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Yujie Zhou, Qingqiang Guo, Hendry Xiaoping Wu, David Dong, Michael Hao Zhou
  • Patent number: 10666519
    Abstract: Embodiments of the present disclosure provide a method and device for determining a physical position of an electronic device. The method comprises obtaining, at a power distribution unit (PDU) that provides power supply for the electronic device, a position identifier of a physical position of the PDU from a radio frequency (RF) tag reader. The method further comprises providing to a computing device the position identifier, a network address of the PDU and a network address of the electronic device associated with the network address of the PDU so that the computing device determines the physical position of the electronic device.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: May 26, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou, Peter Yuanhang Pan
  • Publication number: 20200154591
    Abstract: An adaptor for incorporating a function of an Open Compute Project (OCP) mezzanine card into a storage device includes a framework, a baseboard mounted to the framework and arranged to have the Open Compute Project (OCP) mezzanine card mounted thereon, an adapting part on the baseboard, the adapting part including an insertion slot for receiving a first interface of the OCP mezzanine card, and a connector on the baseboard, the connector configured to connect with the storage device, the baseboard including interconnections between the connector and the adapting part to provide for data exchange between the OCP mezzanine card and the storage device.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: Haifang Zhai, David Dong, Michael Hao Zhou, Sandburg Hao Hu, Sean Xu Chen
  • Publication number: 20200154601
    Abstract: The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, Yujie Zhou, David Dong
  • Publication number: 20200141669
    Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.
    Type: Application
    Filed: January 8, 2020
    Publication date: May 7, 2020
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Publication number: 20200133357
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10635320
    Abstract: The present disclosure relates to an integrator for a storage device, a corresponding storage device and a method of manufacturing the same. The integrator comprises a base board comprising a first interface and a second interface; a connector coupled to the first interface of the base board, the connector being connectable with at least one server in the storage device; an input/output (I/O) part coupled to the second interface of the base board and connectable with an I/O device; and a switcher arranged on the base board and adapted to exchange data between the first interface and the second interface to support data transmission of the I/O device or other servers with the server via the integrator.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: April 28, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: D918930
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: May 11, 2021
    Assignee: LYFT, INC.
    Inventors: Katherine Marisa Dill, Gordon Tindall, David Bellona, Karina van Schaardenburg, Timothy Johnson, Jeffrey Hurray, Linda Dong, Kai Xiao Fang, Benjamin Lee