Abstract: An adaptor for incorporating a function of an Open Compute Project (OCP) mezzanine card into a storage device includes a framework, a baseboard mounted to the framework and arranged to have the Open Compute Project (OCP) mezzanine card mounted thereon, an adapting part on the baseboard, the adapting part including an insertion slot for receiving a first interface of the OCP mezzanine card, and a connector on the baseboard, the connector configured to connect with the storage device, the baseboard including interconnections between the connector and the adapting part to provide for data exchange between the OCP mezzanine card and the storage device.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: Various embodiments of the present disclosure disclose a storage system. The storage system comprises: at least one storage device array enclosure, each of the storage device array enclosure accommodating storage devices, which are arranged in columns and have gaps existing between adjacent storage devices; each storage device array enclosure includes a cap for covering accommodated storage devices; the cap includes vents and windshield bars, such that when the cap is in a closed state, the vents abut against an upper surface of the corresponding storage devices and the windshield bars cover the gaps between adjacent storage devices.

Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.

Abstract: Embodiments of the present disclosure relate to a stabilizing apparatus for a plug-in card, a chassis including the stabilizing apparatus and associated manufacturing method. The stabilizing apparatus comprises a fixed part adapted for attaching the stabilizing apparatus to a chassis for supporting the plug-in card and a contact part electrically coupled to a ground terminal of the chassis and movable towards the plug-in card supported on the chassis along a first positive direction perpendicular to an extended plane of the plug-in card, so as to contact the plug-in card.

Abstract: Embodiments of the present disclosure provide a system and method for heat dissipation of a storage device. The system comprises a guiding rail mounted in an enclosure of the storage device; a set of fans arranged on the guiding rail and being movable on the guiding rail, the set of fans being configured to dissipate heat of a disk assembly of the storage device; and a controller configured to: obtain a temperature of the disk assembly at a first time point; and in response to the temperature of at least one disk in the disk assembly exceeding a threshold temperature, perform at least one of the following: adjusting a position of at least one of the set of fans; and increasing a rotational speed of at least one of the set of fans.

Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.

Abstract: Embodiments of the present disclosure relate to a screw, a manufacturing method thereof and an associated storage device. The screw includes a screw stem at least partly provided with threads; and a head comprising a rolling element, the rolling element protruding out of a surface of the head and adapted to form rolling contact with an object abutting against the head. By the screw according to embodiments of the present disclosure, an effective support can be provided to the storage device, without interfering with the plug operation of the storage device.

Abstract: The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector.

Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

Abstract: The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.

Abstract: Embodiments of the present disclosure provide a method and device for determining a physical position of an electronic device. The method comprises obtaining, at a power distribution unit (PDU) that provides power supply for the electronic device, a position identifier of a physical position of the PDU from a radio frequency (RF) tag reader. The method further comprises providing to a computing device the position identifier, a network address of the PDU and a network address of the electronic device associated with the network address of the PDU so that the computing device determines the physical position of the electronic device.

Abstract: The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector.

Abstract: An adaptor for incorporating a function of an Open Compute Project (OCP) mezzanine card into a storage device includes a framework, a baseboard mounted to the framework and arranged to have the Open Compute Project (OCP) mezzanine card mounted thereon, an adapting part on the baseboard, the adapting part including an insertion slot for receiving a first interface of the OCP mezzanine card, and a connector on the baseboard, the connector configured to connect with the storage device, the baseboard including interconnections between the connector and the adapting part to provide for data exchange between the OCP mezzanine card and the storage device.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.

Abstract: The present disclosure relates to an integrator for a storage device, a corresponding storage device and a method of manufacturing the same. The integrator comprises a base board comprising a first interface and a second interface; a connector coupled to the first interface of the base board, the connector being connectable with at least one server in the storage device; an input/output (I/O) part coupled to the second interface of the base board and connectable with an I/O device; and a switcher arranged on the base board and adapted to exchange data between the first interface and the second interface to support data transmission of the I/O device or other servers with the server via the integrator.

Abstract: The present disclosure provides an apparatus integrated with cooling components. The apparatus comprises heat generating components and cooling components for delivering a cooling airflow to the heat generating components. The cooling components are arranged along one side of the apparatus and upstream of the heat generating components along a direction of the airflow generated by the cooling components. The cooling components are rotatable towards an outside of the apparatus to expose the heat generating components. The apparatus integrated with cooling components of the present disclosure can effectively improve the maintenance efficiency of the cooling components and other important components.

Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.