Patents by Inventor DAVID DONG

DAVID DONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200133357
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10635320
    Abstract: The present disclosure relates to an integrator for a storage device, a corresponding storage device and a method of manufacturing the same. The integrator comprises a base board comprising a first interface and a second interface; a connector coupled to the first interface of the base board, the connector being connectable with at least one server in the storage device; an input/output (I/O) part coupled to the second interface of the base board and connectable with an I/O device; and a switcher arranged on the base board and adapted to exchange data between the first interface and the second interface to support data transmission of the I/O device or other servers with the server via the integrator.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: April 28, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10624235
    Abstract: The present disclosure provides an apparatus integrated with cooling components. The apparatus comprises heat generating components and cooling components for delivering a cooling airflow to the heat generating components. The cooling components are arranged along one side of the apparatus and upstream of the heat generating components along a direction of the airflow generated by the cooling components. The cooling components are rotatable towards an outside of the apparatus to expose the heat generating components. The apparatus integrated with cooling components of the present disclosure can effectively improve the maintenance efficiency of the cooling components and other important components.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: April 14, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, Yujie Zhou, David Dong
  • Patent number: 10602602
    Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: March 24, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10588237
    Abstract: Techniques involve use of an adaptor for a storage device. The adaptor includes a baseboard arranged to support an Open Compute Project (OCP) mezzanine card in the storage device; a connector coupled to the baseboard and arranged to connect with the storage device; and an adapting part coupled to the baseboard and including an insertion slot for receiving a first interface of the OCP mezzanine card.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: March 10, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, David Dong, Michael Hao Zhou, Sandburg Hao, Sean Xu Chen
  • Patent number: 10575435
    Abstract: The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: February 25, 2020
    Assignee: Dell Products L.P.
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, Yujie Zhou, David Dong
  • Patent number: 10571207
    Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 25, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10545547
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 28, 2020
    Assignee: Dell Products L.P.
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10522191
    Abstract: Embodiments of the present disclosure provide a method for managing a storage device and a storage device, the storage device including a chassis and a hard disk assembly. The method comprises: receiving a signal indicating a position of the hard disk assembly relative to the chassis, the hard disk assembly being slidably coupled to the chassis, and the signal being generated by an electromechanical element disposed on the hard disk assembly; and controlling a rotating speed of a fan based at least in part on the signal, the fan being disposed in the chassis and configured to blow wind to the hard disk assembly.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: December 31, 2019
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Yujie Zhou, Hendry Xiaoping Wu, David Dong, Qingqiang Guo
  • Publication number: 20190335615
    Abstract: The present disclosure provides an apparatus integrated with cooling components. The apparatus comprises heat generating components and cooling components for delivering a cooling airflow to the heat generating components. The cooling components are arranged along one side of the apparatus and upstream of the heat generating components along a direction of the airflow generated by the cooling components. The cooling components are rotatable towards an outside of the apparatus to expose the heat generating components. The apparatus integrated with cooling components of the present disclosure can effectively improve the maintenance efficiency of the cooling components and other important components.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 31, 2019
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, Yujie Zhou, David Dong
  • Publication number: 20190335575
    Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 31, 2019
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Publication number: 20190333545
    Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.
    Type: Application
    Filed: January 9, 2019
    Publication date: October 31, 2019
    Inventors: HAIFANG ZHAI, HENDRY WU, DAVID DONG, YUJIE ZHOU
  • Publication number: 20190332914
    Abstract: Embodiments of the present disclosure relate to a stabilizing apparatus for a plug-in card, a chassis including the stabilizing apparatus and associated manufacturing method. The stabilizing apparatus comprises a fixed part adapted for attaching the stabilizing apparatus to a chassis for supporting the plug-in card and a contact part electrically coupled to a ground terminal of the chassis and movable towards the plug-in card supported on the chassis along a first positive direction perpendicular to an extended plane of the plug-in card, so as to contact the plug-in card.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 31, 2019
    Inventors: Haifang Zhai, David Dong, Hendry Xiaoping Wu, Yujie Zhou
  • Publication number: 20190331157
    Abstract: Embodiments of the present disclosure relate to a screw, a manufacturing method thereof and an associated storage device. The screw includes a screw stem at least partly provided with threads; and a head comprising a rolling element, the rolling element protruding out of a surface of the head and adapted to form rolling contact with an object abutting against the head. By the screw according to embodiments of the present disclosure, an effective support can be provided to the storage device, without interfering with the plug operation of the storage device.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 31, 2019
    Inventors: Haifang Zhai, David Dong, Ricky Liu
  • Publication number: 20190265762
    Abstract: Various embodiments of the present disclosure disclose a storage system. The storage system comprises: at least one storage device array enclosure, each of the storage device array enclosure accommodating storage devices, which are arranged in columns and have gaps existing between adjacent storage devices; each storage device array enclosure includes a cap for covering accommodated storage devices; the cap includes vents and windshield bars, such that when the cap is in a closed state, the vents abut against an upper surface of the corresponding storage devices and the windshield bars cover the gaps between adjacent storage devices.
    Type: Application
    Filed: October 26, 2018
    Publication date: August 29, 2019
    Inventors: Haifang Zhai, David Dong, Hendry Wu
  • Publication number: 20190223321
    Abstract: The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, Yujie Zhou, David Dong
  • Publication number: 20190220072
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Publication number: 20190170457
    Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system.
    Type: Application
    Filed: October 26, 2018
    Publication date: June 6, 2019
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Publication number: 20190174657
    Abstract: Embodiments of the present disclosure provide a system and method for heat dissipation of a storage device. The system comprises: a guiding rail mounted in an enclosure of the storage device; a set of fans arranged on the guiding rail and being movable on the guiding rail, the set of fans being configured to dissipate heat of a disk assembly of the storage device; and a controller configured to: obtain a temperature of the disk assembly at a first time point; and in response to the temperature of at least one disk in the disk assembly exceeding a threshold temperature, perform at least one of the following: adjusting a position of at least one of the set of fans; and increasing a rotational speed of at least one of the set of fans.
    Type: Application
    Filed: October 26, 2018
    Publication date: June 6, 2019
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10139874
    Abstract: The present disclosure involves a heat dissipater for a storage and the corresponding storage. The storage comprises a drawer chassis including at least one baffle arranged in a direction perpendicular to a pulling direction of the drawer chassis. The drawer chassis accommodates disks organized in a plurality of rows and placed against the corresponding baffle. The heat dissipater comprises: venting holes arranged on the baffle and corresponding to disks placed against the respective baffle; and flyers arranged on the baffle and corresponding to the venting holes respectively, the flyers being arranged to block the corresponding venting holes and to expose the corresponding venting holes in response to the attraction of the magnetic winding.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: November 27, 2018
    Assignee: EMC IP Holding Company LLC
    Inventors: Haifang Zhai, Yujie Zhou, Qingqiang Guo, Hendry Xiaoping Wu, David Dong