Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A semiconductor wafer dicing saw is controlled by monitoring blade exposure from a flange holding the blade during the wafer dicing process. As the wafer is cut and separated into discrete electronic chips, the dicing blade wears. As the blade is brought closer and closer toward the wafer during cutting, the blade exposure is continuously being reduced. The small dimensions, coolant flow, and close tolerances typical in the wafer dicing process, do not permit visual inspection. Excess blade wear and thus reduced exposure or flange clearance between the blade cutting edge and flange edge will cause damage to the wafer and blade by restricting coolant flow or by contact of the flange with the wafer.

Abstract: A reusable package and method suitable for storage and handling of a fragile dicing blade includes a rigid card having a smooth surface upon which the blade is placed. A flexible plastic film is placed over the blade and card surface and bonds to the surface through a molecular bonding action with sufficient bonding force for holding the disk in place on the card. With such a combination of card, blade and film, the blade is protected during storing, shipping and handling. Further, such a packaging method provides for repeated use of this non-adhesive package thereby increasing useful life of both the blade and package. Molecular bonding of the film to the card surface provides sufficient strength to hold the blade and to provide a hermetically sealed chamber within which the blade is positioned and stored. A package and handling for a fragile dicing blade and electronic components is described but application for components having stringent handling and storage requirements is appropriate.

Abstract: A semiconductor wafer dicing saw is controlled by monitoring blade exposure from a flange holding the blade during the wafer dicing process. As the wafer is cut and separated into discrete electronic chips, the dicing blade wears. As the blade is brought closer and closer toward the wafer during cutting, the blade exposure is continuously being reduced. The small dimensions, coolant flow, and close tolerances typical in the wafer dicing process, do not permit visual inspection. Excess blade wear and thus reduced exposure or flange clearance between the blade cutting edge and flange edge will cause damage to the wafer and blade by restricting coolant flow or by contact of the flange with the wafer.

Abstract: A rotary table lockdown apparatus made a part of a computer controlled dicing saw holds a table work surface parallel to a reference surface independent of axial misalignment and without rotational movement. The apparatus includes a deflectable disk rotor radially extended from the table within a plane parallel to the reference surface. A piston styled plunger is biased against a top surface of the rotor forcing it into frictional contact with the reference surface for holding the table and thus the work surface in a rigid position for operation on a workpiece removably attached to the work surface. A chamber is pressurized to displace the plunger in a piston-like manner against a top surface of the rotor. A flexible O-ring holds the plunger in sealable contact with chamber walls and with increased pressure in the chamber flexes to permit the displacement of the plunger. Upon release of the pressure, the flexible O-ring pulls the plunger out of contact with the rotor permitting the table to be rotated.

Abstract: An apparatus for positioning a bowling ball during a drilling process and method that provides reproducible orientations of the ball for accurately modifying and repeating the drilling process is described. The apparatus affixed a bowling ball while exposing a sufficient portion of a surface of the ball where middle finger, ring finger and thumb holes are to be drilled. The apparatus positions the bowling ball for drilling holes of varying pitch without requiring the ball to be removed from its rigidly affixed position within the apparatus. Holes having severe pitches are easily drilled and reproduced, including oval holes having preselected oval rotations. A computer program converts inputted hand measurements to digitized apparatus movements for positioning the ball prior to drilling a desired hole. Digital encoders indicate apparatus movement that is matched with computer output for ease and repeatability in drilling a ball.

Abstract: A reusable package and method suitable for storage and handling of a fragile dicing blade includes a rigid card having a smooth surface upon which the blade is placed. A flexible plastic film is placed over the blade and card surface and bonds to the surface through a molecular bonding action with sufficient bonding force for holding the disk in place on the card. With such a combination of card, blade and film, the blade is protected during storing, shipping and handling. Further, such a packaging method provides for repeated use of this non-adhesive package thereby increasing useful life of both the blade and package. Molecular bonding of the film to the card surface provides sufficient strength to hold the blade and to provide a hermetically sealed chamber within which the blade is positioned and stored. A package and handling for a fragile dicing blade and electronic components is described but application for components having stringent handling and storage requirements is appropriate.

Abstract: An apparatus for positioning a bowling ball during a drilling process and method that provides reproducible orientations of the ball for accurately modifying and repeating the drilling process is described. The apparatus affixed a bowling ball while exposing a sufficient portion of a surface of the ball where middle finger, ring finger and thumb holes are to be drilled. The apparatus positions the bowling ball for drilling holes of varying pitch without requiring the ball to be removed from its rigidly affixed position within the apparatus. Holes having severe pitches are easily drilled and reproduced, including oval holes having preselected oval rotations. A computer program converts inputted hand measurements to digitized apparatus movements for positioning the ball prior to drilling a desired hole. Digital encoders indicate apparatus movement that is matched with computer output for ease and repeatability in drilling a ball.

Abstract: An abrasive cutting blade having very high rigidity, has a core which is a disc of low porosity, polycrystalline structural ceramic and an abrasive material adhered to the periphery thereof. The structural ceramic may be conductive or non-conductive and the abrasive may be adhered by resin bonding, electroplating, sintering or pressing.